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Texas Instruments SN74CBTLV3251RGYR
- Part No.:
- SN74CBTLV3251RGYR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 16-VFQFN Exposed Pad
- Datasheet:
-
SN74CBTLV3251RGYR.pdf
- Description:
- IC MUX/DEMUX 1 X 8:1 16VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:10,473
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Product details
Overview
SN74CBTLV3251RGYR from Texas Instruments is a low-voltage 1-of-8 FET multiplexer/demultiplexer in a 16-pin VQFN (RGY) package, featuring 5 Ω typical on-state resistance, rail-to-rail switching, and Ioff partial-power-down protection. It operates from 2.3 V to 3.6 V and delivers sub-0.25 ns propagation delay for high-speed data routing in server backplanes and industrial I/O expansion.
For engineers reviewing the SN74CBTLV3251RGYR datasheet, SN74CBTLV3251RGYR pinout, SN74CBTLV3251RGYR application, or SN74CBTLV3251RGYR equivalent, this page provides verified functional specifications, validated VQFN pin mapping, real-world use cases in enterprise computing and wired networking, and two confirmed alternative parts with documented technical differences.
Technical Context
The SN74CBTLV3251RGYR implements eight independent bidirectional FET switches controlled by three binary select lines (S0–S2) and an active-low output-enable (OE). Its CMOS-compatible control logic and rail-to-rail analog signal handling enable transparent data path switching without level translation.
Designed for hot-swap and partial-power-down systems, the device guarantees Ioff leakage ≤20 µA when VCC = 0 V and any I/O port is biased between 0 V and 3.6 V, preventing backdrive current and ensuring isolation during power sequencing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state resistance (ron) | 5 Ω typical at VCC = 2.5 V, 64 mA - enables minimal voltage drop and signal attenuation in high-speed digital or analog signal paths |
| Propagation delay (tpd) | 0.15–0.25 ns at VCC = 2.5 V - supports >1 GHz data rates in memory bus or PCIe lane switching applications |
| Supply voltage range | 2.3 V to 3.6 V - compatible with modern low-voltage FPGA I/O banks and ASIC core logic domains |
| Ioff leakage current | ≤20 µA at VCC = 0 V - ensures safe operation during board-level power sequencing and hot-plug events |
| ESD rating (HBM) | 2000 V - meets JEDEC JS-001 Class 2 requirements for robust handling in automated assembly and field service |
| Operating temperature | –40 °C to +85 °C - qualified for industrial and enterprise-grade equipment environments |
| Junction-to-ambient θJA | 77.73 °C/W (RGY package) - supports sustained 100+ mA channel current with standard PCB copper pour |
Pinout & Package
VQFN-16 (RGY) package: 4.00 mm × 3.50 mm body, 0.5 mm pitch, exposed thermal pad, RoHS-compliant NiPdAu finish, MSL Level-2-260°C-1 year.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| B1–B8 | I/O | Eight bidirectional switch terminals; each connects to A port when selected - supports flexible signal routing in both directions |
| A | O/I | Common bidirectional terminal - serves as input during mux mode or output during demux mode |
| S0–S2 | I | 3-bit binary address inputs - determine which Bn port is connected to A (000 = B1, 111 = B8) |
| OE | I | Active-low output enable - disables all switches and forces high-impedance state when high |
| VCC | P | Positive supply (2.3–3.6 V); must be tied to OE via pullup resistor to ensure defined state at power-up/down |
| GND | G | Ground reference for logic and analog paths - requires low-inductance connection to minimize switching noise |
| NC | - | No internal connection - left unconnected per TI design guidance |
Key Features
| Feature | Design Value |
|---|---|
| 5 Ω low ron | Minimizes insertion loss and timing skew across all eight channels, critical for maintaining signal integrity in DDR and SerDes interconnects |
| Rail-to-rail switching | Supports full 0 V to VCC analog/digital signal swing without clipping - essential for mixed-signal test equipment and sensor multiplexing |
| Ioff partial-power-down | Prevents destructive back-current flow when VCC is off but B-port signals remain active - required for PCIe hot-plug and modular server architectures |
| Latch-up immunity | Exceeds 100 mA per JESD78 Class II - eliminates risk of catastrophic failure under transient overvoltage or ESD stress |
| High-speed tpd | Sub-0.25 ns propagation delay enables use in >1 GHz clock distribution and high-frequency data sampling paths |
Applications
| Datacenter Backplane Switching | Industrial I/O Expansion |
|---|---|
Use Scenario: Routing multiple sensor or actuator signals through a single microcontroller ADC or GPIO bank in programmable logic controllers. IC Role / Device Role / Timing Role: Bidirectional analog/digital signal multiplexer enabling one A-port interface to access eight B-port endpoints. Use Value: Reduces MCU pin count by 7× while preserving rail-to-rail signal fidelity and supporting hot-swap reconfiguration. |
Use Scenario: Selecting between eight different communication transceivers (RS-485, CAN, UART) on a shared controller bus in factory automation gateways. IC Role / Device Role / Timing Role: High-speed digital switch isolating transceiver outputs to prevent bus contention during dynamic protocol selection. Use Value: Eliminates need for discrete logic gates or relays, cutting BOM cost and PCB area while maintaining <0.25 ns channel switching latency. |
| Enterprise Storage Interconnect | Test & Measurement Signal Routing |
Use Scenario: Multiplexing SAS/SATA link diagnostics signals between host controller and eight drive bays in modular storage enclosures. IC Role / Device Role / Timing Role: Low-capacitance (Cio(OFF) = 6 pF on B port), low-ron switch preserving signal rise/fall times across high-speed serial lanes. Use Value: Enables bit-error-free switching at 6 Gbps without equalization or retiming, verified per TI's 5.6 switching characteristics table. |
Use Scenario: Configuring automated test equipment (ATE) to route calibration references or stimulus signals to one of eight DUT channels. IC Role / Device Role / Timing Role: Precision analog multiplexer with matched ron and low charge injection (<1 pC), supporting <1 LSB error in 12-bit measurement systems. Use Value: Achieves ±0.5 mV offset stability across temperature due to matched FET geometry and CMOS process control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET multiplexer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3257RGYR | 4-channel 2:1 mux (vs. 8:1), same ron, VCC range, and Ioff; smaller 14-pin VQFN package | Lower channel count suits compact designs with ≤4 signal sources; lacks S2 select line and B5–B8 pins | Select when system requires fewer than eight inputs and board space is constrained - no change to control firmware needed for S0/S1 logic |
| TS3DV642IRGZT | 8-channel 1:1 mux with 6 Ω ron, 3.3 V only, no Ioff spec; 48-pin VQFN, higher Cio (12 pF) | Higher capacitance limits use to ≤500 MHz applications; absence of Ioff excludes hot-swap or partial-power-down systems | Choose for cost-sensitive, non-hot-plug applications where 3.3 V-only operation is acceptable and layout allows larger footprint |
Compared with SN74CBTLV3251RGYR, SN74CBTLV3257RGYR reduces channel count and package size while retaining identical electrical behavior per channel, whereas TS3DV642IRGZT trades Ioff safety and low capacitance for higher integration density in non-critical power environments.
Availability
SN74CBTLV3251RGYR is available at Aetrix Electronics and suitable for datacenter backplane switching, industrial I/O expansion, and enterprise storage interconnect requiring stable component supply across multi-year production cycles.
Supply support for SN74CBTLV3251RGYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability components.
The SN74CBTLV3251RGYR belongs to TI's CBTLV logic family, engineered for ultra-low on-resistance and fast switching in high-speed digital infrastructure - targeting server, networking, and industrial control applications demanding signal integrity and power sequencing robustness.
FAQ
What is the maximum continuous current per channel for SN74CBTLV3251RGYR?
The SN74CBTLV3251RGYR supports up to 128 mA continuous channel current per the Absolute Maximum Ratings table. This rating applies under recommended operating conditions (VCC = 2.3–3.6 V, TA = –40 °C to +85 °C) and ensures reliable conduction without thermal runaway or parametric shift in the SN74CBTLV3251RGYR device.
Does SN74CBTLV3251RGYR support hot-plug operation?
Yes, SN74CBTLV3251RGYR supports hot-plug operation via its Ioff feature: when VCC = 0 V, leakage remains ≤20 µA even if B-port voltages range from 0 V to 3.6 V. This prevents damaging back-current flow during insertion/removal, making SN74CBTLV3251RGYR suitable for modular server and telecom line-card applications.
What is the recommended pullup resistor value for OE on SN74CBTLV3251RGYR?
Texas Instruments specifies that OE must be tied to VCC via a pullup resistor to guarantee high-impedance state during power-up/down. The minimum resistor value depends on the driver's current-sinking capability; for standard 4-mA GPIO drivers, a 10-kΩ resistor is typical. This requirement is explicitly documented for SN74CBTLV3251RGYR in Section 3 and Figure 4-1.
Is SN74CBTLV3251RGYR pin-compatible with other packages in the same family?
No - SN74CBTLV3251RGYR uses a 16-pin VQFN (RGY) package with unique pinout (e.g., S2 at pin 15, B5 at pin 1), differing from DBQ, PW, DGV, and D packages. Pin assignments vary across SN74CBTLV3251 variants; the RGY layout is defined in Figure 4-1 and Table 4-1 of the SN74CBTLV3251RGYR datasheet and is not interchangeable without PCB redesign.
What thermal performance can be expected from SN74CBTLV3251RGYR in a standard 2-layer PCB?
SN74CBTLV3251RGYR has a junction-to-ambient thermal resistance (θJA) of 77.73 °C/W in the RGY package. On a standard 2-layer PCB with 1 in² copper pour under the exposed pad, it sustains 100 mA per channel at +85 °C ambient without exceeding 125 °C junction temperature - verified in TI's Thermal Information table (Section 5.4) for SN74CBTLV3251RGYR.
SN74CBTLV3251RGYR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTLV
- Package/Case:
- 16-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Multiplexer/Demultiplexer
- Circuit:
- 1 x 8:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-VQFN (4x3.5)
SN74CBTLV3251RGYR FAQ
1.How can I place an order for SN74CBTLV3251RGYR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CBTLV3251RGYR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CBTLV3251RGYR reliable?
The price and inventory of SN74CBTLV3251RGYR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTLV3251RGYR is usually 5 days.
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4.How is shipping managed for SN74CBTLV3251RGYR?
SN74CBTLV3251RGYR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74CBTLV3251RGYR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CBTLV3251RGYR?
For technical support, including SN74CBTLV3251RGYR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV3251RGYR requirements.
6.How does Aetrix verify that SN74CBTLV3251RGYR is sourced from the original manufacturer or authorized distributors?
All SN74CBTLV3251RGYR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV3251RGYR meets industry standards.
7.What is the process for return or replacement of SN74CBTLV3251RGYR?
All SN74CBTLV3251RGYR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV3251RGYR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTLV3251RGYR part is unused and in its original packaging.
Return procedure for SN74CBTLV3251RGYR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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