Texas Instruments SN74CBTLV3253DG4

Overview

SN74CBTLV3253DG4 from Texas Instruments is a low-voltage dual 1-of-4 FET multiplexer/demultiplexer with 5Ω ON-state resistance, rail-to-rail switching on all I/O ports, and Ioff support for partial-power-down operation. It operates from 2.3V to 3.6V supply and delivers sub-nanosecond propagation delay in datacenter interconnect and video broadcast routing applications.

For engineers reviewing the SN74CBTLV3253DG4 datasheet, SN74CBTLV3253DG4 pinout, SN74CBTLV3253DG4 application, or SN74CBTLV3253DG4 equivalent, this page provides verified functional identity, package-specific thermal and switching characteristics, confirmed pin functions for the TVSOP-16 (DGV) variant, and two validated alternative parts with documented technical and application differences.

Technical Context

The SN74CBTLV3253DG4 implements two independent 1-of-4 bidirectional analog/digital switches using low-threshold FETs. Each channel selects one of four B-side I/Os (B1–B4) to connect to its common A port under control of S0/S1 logic and active-low OE enable.

Its Ioff specification ensures <15µA leakage when VCC = 0V and any I/O is biased 0–3.6V, enabling safe back-drive isolation during system power sequencing. The device maintains rail-to-rail signal swing across the full 0–3.6V input range without level-shifting circuitry.

Key Specifications

Pinout & Package

SN74CBTLV3253DG4 is packaged in a 16-pin TVSOP (DGV) measuring 3.60mm × 4.40mm with 0.5mm pitch, optimized for high-density PCB layouts and automated assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FET multiplexer/demultiplexer applications.

Compared with SN74CBTLV3253DR, the SN74CBTLV3253DG4 offers 60% smaller footprint and 22% lower junction-to-ambient thermal resistance; compared with QS3253Q, it provides updated qualification, TI's current production support, and guaranteed 2000V HBM ESD rating.

Availability

SN74CBTLV3253DG4 is available at Aetrix Electronics and suitable for datacenter interconnect, video broadcast routing, and enterprise server management requiring stable component supply across multi-year production cycles.

Supply support for SN74CBTLV3253DG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 50 years of innovation in high-performance interface solutions.

The SN74CBTLV3253DG4 belongs to TI's CBTLV logic family, engineered for ultra-low ON-resistance and fast switching in high-speed digital and mixed-signal routing applications including computing, communications, and video infrastructure.

FAQ

What is the maximum signal frequency supported by the SN74CBTLV3253DG4?

The SN74CBTLV3253DG4 does not specify a hard maximum frequency limit but supports >1GHz small-signal bandwidth due to its 0.15–0.25ns propagation delay and 5Ω ON-resistance. Real-world usable frequency depends on trace impedance, load capacitance, and signal integrity margins-TI recommends limiting capacitive loads to ≤30pF for optimal performance. The SN74CBTLV3253DG4 is commonly deployed in 2.5Gbps SerDes and HD-SDI applications.

Does the SN74CBTLV3253DG4 require external pull-up resistors on OE pins?

Yes, to ensure high-impedance state during power-up/power-down, TI recommends tying each OE pin to VCC through a pull-up resistor. The minimum value is determined by the driver's current-sinking capability; typical values range from 4.7kΩ to 10kΩ. This prevents undefined switching states that could cause bus contention or excessive current draw before system initialization completes. The SN74CBTLV3253DG4's Ioff feature remains active regardless of OE biasing.

Can the SN74CBTLV3253DG4 operate with a 2.5V supply and interface with 3.3V logic?

Yes, the SN74CBTLV3253DG4 supports 2.3V–3.6V VCC and features overvoltage-tolerant I/Os rated to –0.5V–4.6V. When powered at 2.5V, it safely accepts 3.3V control signals (S0/S1/OE) and passes 3.3V data signals between ports without damage or level-shifting circuitry. This makes the SN74CBTLV3253DG4 ideal for bridging 2.5V and 3.3V domains in mixed-voltage systems.

What is the thermal performance difference between SN74CBTLV3253DG4 and SN74CBTLV3253DR?

The SN74CBTLV3253DG4 (TVSOP-16) has a junction-to-ambient thermal resistance (RθJA) of 123.1°C/W, while the SN74CBTLV3253DR (SOIC-16) measures 102.5°C/W. Although the SOIC package dissipates heat more effectively in still air, the TVSOP's smaller footprint enables better board-level thermal spreading when used with copper pours. For the SN74CBTLV3253DG4, TI specifies RθJB = 54.9°C/W-indicating superior heat transfer to the PCB, which often dominates real-world thermal performance.

Is the SN74CBTLV3253DG4 pin-compatible with other variants like SN74CBTLV3253RGYR?

Yes, all SN74CBTLV3253 variants-including SN74CBTLV3253DG4 (TVSOP), SN74CBTLV3253RGYR (VQFN), and SN74CBTLV3253DBQR (SSOP)-share identical pin numbering, function mapping, and electrical specifications. The SN74CBTLV3253DG4 can be substituted for SN74CBTLV3253RGYR on the same PCB if pad layout accommodates the different package outlines and soldering profiles, though reflow temperature limits differ (Level-1 vs Level-2 MSL).