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Texas Instruments SN74CBTLV3253DGVR
- Part No.:
- SN74CBTLV3253DGVR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 16-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74CBTLV3253DGVR.pdf
- Description:
- IC MUX/DEMUX 2 X 4:1 16TVSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,560
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Product details
Overview
SN74CBTLV3253DGVR from Texas Instruments is a dual 1-of-4 low-voltage FET multiplexer/demultiplexer with 5Ω ON-state resistance, rail-to-rail switching on all I/O ports, and Ioff partial-power-down support. It operates from 2.3V to 3.6V, delivers sub-1ns propagation delay at 3.3V, and is used in high-speed data routing for enterprise computing and wired networking systems.
For engineers reviewing the SN74CBTLV3253DGVR datasheet, SN74CBTLV3253DGVR pinout, SN74CBTLV3253DGVR application, or SN74CBTLV3253DGVR equivalent, key selection criteria include its 16-pin TVSOP package, guaranteed -40°C to +85°C operation, Ioff current ≤15µA at VCC = 0V, and compatibility with 3.3V LVTTL logic families.
Technical Context
The SN74CBTLV3253DGVR implements two independent 1-of-4 analog/digital switches using low-threshold FETs, enabling bidirectional rail-to-rail signal pass-through without level translation. Each channel features separate active-low output-enable (1OE, 2OE) and 2-bit binary select (S0, S1) inputs.
Its Ioff protection blocks current backflow when VCC = 0V, ensuring system-level isolation during partial power-down. The device maintains high-impedance states on all I/Os during power-up/down when OE is pulled up to VCC via an external resistor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ON-state resistance | 5Ω typical at VCC = 3V, 64mA - enables minimal voltage drop and signal distortion in high-speed data paths |
| Propagation delay | 0.15–0.25ns at VCC = 3.3V - supports >1GHz signal routing without timing degradation |
| Supply voltage range | 2.3V to 3.6V - compatible with 2.5V and 3.3V LVTTL/LVCMOS systems |
| Ioff current | ≤15µA at VCC = 0V - prevents damaging back-current during hot-swap or partial power-down |
| ESD rating | HBM ±2000V - meets industrial-grade ESD robustness requirements |
| Operating temperature | -40°C to +85°C - qualified for enterprise computing and networking equipment environments |
| Input/output voltage tolerance | -0.5V to 4.6V - allows overvoltage-safe interfacing with mixed-supply systems |
Pinout & Package
SN74CBTLV3253DGVR uses a 16-pin Thin Very Small Outline Package (TVSOP) measuring 3.60mm × 4.40mm with 0.5mm pitch. Pin 1 is marked by a beveled corner; the package is RoHS-compliant and moisture-sensitive Level-1 (UNLIM reflow).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE | Active-low enable for Channel 1 | Drives all Channel 1 B-port I/Os into high-Z when high; must be pulled up for power-up safety |
| S1, S0 | Binary select inputs | Control which of four B-port lines connects to Channel 1 A-port (00→B1, 01→B2, 10→B3, 11→B4) |
| 1A, 2A | Common I/O terminals | Bidirectional signal path for each 4:1 mux/demux channel; rail-to-rail capable |
| 1B1–1B4, 2B1–2B4 | Channel I/O terminals | Four selectable I/O paths per channel; all support 3.6V max I/O voltage regardless of VCC |
| VCC | Power supply | Single 2.3–3.6V supply powers logic control and switch FETs; bypass with 0.1µF capacitor |
| GND | Ground reference | Common return for all signals and supply; requires low-inductance PCB connection |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail I/O switching | Supports full 0V to VCC signal swing on all ports - eliminates need for level shifters in mixed-voltage interconnects |
| Ioff partial-power-down protection | Blocks current flow between powered and unpowered domains - critical for hot-plug and modular system designs |
| 5Ω low ON-resistance | Minimizes insertion loss and timing skew in high-frequency data buses (e.g., PCIe sideband, SMBus, JTAG) |
| Sub-1ns propagation delay | Enables clean signal routing in >1Gbps serial links and parallel address/data buses without added latency |
| Functionally equivalent to QS3253 | Direct drop-in replacement for legacy QS3253 designs - preserves existing layout and firmware logic |
Applications
| Enterprise Server Backplane Switching | Data Center Rack Interconnect |
|---|---|
Use Scenario: Routing SMBus, PMBus, or I²C management traffic between baseboard management controller (BMC) and multiple blade servers in a 19-inch rack. IC Role / Device Role / Timing Role: Dual 4:1 mux provides non-blocking access to shared management bus while isolating inactive blades. Use Value: Ioff ensures no backfeed from powered blades to unpowered ones during hot-swap; 5Ω Ron preserves signal integrity across 1m backplane traces. |
Use Scenario: Selecting among four upstream Ethernet PHYs for a multi-port switch ASIC in a top-of-rack (ToR) switch. IC Role / Device Role / Timing Role: High-speed analog mux routes 2.5G/5G SERDES reference clocks and status signals with sub-nanosecond skew control. Use Value: 0.25ns max tpd guarantees deterministic clock distribution; rail-to-rail I/O accommodates both 1.8V and 3.3V PHY interfaces. |
| Industrial Video Transcoder I/O Multiplexing | Building Automation Controller Bus Expansion |
Use Scenario: Dynamically connecting one of four HDMI or SDI video sources to a single transcoding engine in IP-based broadcast infrastructure. IC Role / Device Role / Timing Role: Bidirectional FET switch passes uncompressed video pixel data and embedded audio without DC blocking or level shifting. Use Value: 4.6V I/O tolerance safely handles HDMI DDC pull-ups; low Ron avoids pixel jitter in 1080p60+ streams. |
Use Scenario: Expanding Modbus RTU or BACnet MS/TP serial bus connectivity across multiple HVAC zones in smart building controllers. IC Role / Device Role / Timing Role: Mux selects between four RS-485 transceiver pairs sharing one UART interface on the MCU. Use Value: -40°C to +85°C rating ensures reliability in unconditioned mechanical rooms; Ioff prevents ground loop currents across distributed zones. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET multiplexer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3253DR | SOIC-16 package (9.90mm × 3.90mm); same electrical specs but larger footprint and higher thermal resistance (RθJA = 102.5°C/W vs. 123.1°C/W) | Better suited for prototyping or through-hole assembly; less optimal for space-constrained networking modules | Choose DR for manual soldering or legacy board compatibility; DGVR preferred for density-critical designs |
| SN74CBTLV3253DBQR | SSOP-16 package (4.90mm × 3.90mm); identical specs but MSL Level-2 (1-year floor life) vs. DGVR's Level-1 (unlimited) | Requires stricter handling and bake-out before reflow; slightly lower thermal performance (RθJA = 116.6°C/W) | Select DBQR only if SSOP is already standardized in production; DGVR offers superior manufacturability and thermal margin |
Compared with SN74CBTLV3253DR and SN74CBTLV3253DBQR, the SN74CBTLV3253DGVR delivers the smallest PCB footprint (3.60mm × 4.40mm), highest moisture sensitivity robustness (Level-1), and best thermal dissipation among TVSOP variants - making it optimal for high-density, high-reliability networking and server applications.
Availability
SN74CBTLV3253DGVR is available at Aetrix Electronics and suitable for enterprise server backplanes, data center rack interconnects, and industrial video transcoder I/O routing requiring stable component supply across extended product lifecycles.
Supply support for SN74CBTLV3253DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 90 years of innovation in industrial, automotive, and communications markets.
The SN74CBTLV3253DGVR belongs to TI's CBTLV logic family, engineered for ultra-low-latency, rail-to-rail signal routing in high-speed digital infrastructure where power efficiency, signal fidelity, and system-level isolation are critical.
FAQ
What is the maximum operating frequency supported by the SN74CBTLV3253DGVR?
The SN74CBTLV3253DGVR does not specify a hard maximum frequency limit but achieves 0.25ns typical propagation delay at 3.3V, supporting clean signal routing up to 1–2 GHz depending on trace impedance, load capacitance, and layout. Its 5Ω ON-resistance and 5.5pF OFF-capacitance minimize RC time constants, enabling reliable use in PCIe Gen1/2 sideband, JTAG, and high-speed I²C applications. Always validate with actual board-level measurements under target load conditions.
Does the SN74CBTLV3253DGVR require external pull-up resistors on OE pins?
Yes, the SN74CBTLV3253DGVR requires external pull-up resistors on both 1OE and 2OE pins to ensure high-impedance state during power-up and power-down. TI recommends tying OE to VCC through a resistor sized to accommodate the driver's current-sinking capability - typically 10kΩ for standard CMOS drivers. This prevents undefined switching states and unintended channel activation before firmware initialization.
Can the SN74CBTLV3253DGVR interface with 1.8V logic while powered at 3.3V?
Yes, the SN74CBTLV3253DGVR supports rail-to-rail I/O operation: its data ports tolerate voltages from -0.5V to 4.6V independent of VCC, allowing safe interfacing with 1.8V, 2.5V, or 3.3V logic families while powered at 3.3V. Control inputs (S0, S1, OE) meet 3.3V LVTTL thresholds (VIH ≥ 2.0V, VIL ≤ 0.8V), so 1.8V control signals require level translation unless buffered.
Is the SN74CBTLV3253DGVR pin-compatible with the QS3253?
Yes, the SN74CBTLV3253DGVR is functionally and pin-compatible with the IDT QS3253, sharing identical pinout, electrical behavior, and timing characteristics. TI explicitly states functional equivalence in the datasheet, and both devices use the same 16-pin SOIC/SSOP/TVSOP footprints. No PCB changes are required when migrating from QS3253 to SN74CBTLV3253DGVR in TVSOP layout.
What is the thermal performance of the SN74CBTLV3253DGVR in its TVSOP package?
The SN74CBTLV3253DGVR in TVSOP (DGV) package has a junction-to-ambient thermal resistance (RθJA) of 123.1°C/W and junction-to-board (RθJB) of 54.9°C/W. Under typical 10mA per channel operation at 3.3V, power dissipation remains below 15mW, resulting in negligible temperature rise. For sustained high-current switching (>50mA), ensure adequate copper pour and thermal vias beneath the exposed pad area to leverage RθJB performance.
SN74CBTLV3253DGVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTLV
- Package/Case:
- 16-TFSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Multiplexer/Demultiplexer
- Circuit:
- 2 x 4:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-TVSOP
SN74CBTLV3253DGVR FAQ
1.How can I place an order for SN74CBTLV3253DGVR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CBTLV3253DGVR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CBTLV3253DGVR reliable?
The price and inventory of SN74CBTLV3253DGVR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTLV3253DGVR is usually 5 days.
3.What payment methods are accepted for SN74CBTLV3253DGVR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74CBTLV3253DGVR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74CBTLV3253DGVR?
SN74CBTLV3253DGVR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74CBTLV3253DGVR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CBTLV3253DGVR?
For technical support, including SN74CBTLV3253DGVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV3253DGVR requirements.
6.How does Aetrix verify that SN74CBTLV3253DGVR is sourced from the original manufacturer or authorized distributors?
All SN74CBTLV3253DGVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV3253DGVR meets industry standards.
7.What is the process for return or replacement of SN74CBTLV3253DGVR?
All SN74CBTLV3253DGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV3253DGVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTLV3253DGVR part is unused and in its original packaging.
Return procedure for SN74CBTLV3253DGVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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