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Texas Instruments SN74CBTLV3253DR
- Part No.:
- SN74CBTLV3253DR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 16-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
SN74CBTLV3253DR.pdf
- Description:
- IC MUX/DEMUX 2 X 4:1 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:6,588
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Product details
Overview
SN74CBTLV3253DR from Texas Instruments is a dual 1-of-4 FET multiplexer/demultiplexer IC designed for high-speed, low-distortion signal routing in 2.3V–3.6V systems. It features 5Ω typical ON-state resistance, rail-to-rail I/O switching, and Ioff partial-power-down support. Used in datacenter interconnects and wired networking to switch bidirectional 2-bit buses between multiple peripherals.
For engineers reviewing the SN74CBTLV3253DR datasheet, SN74CBTLV3253DR pinout, SN74CBTLV3253DR application, or SN74CBTLV3253DR equivalent, key selection criteria include its 0.25ns propagation delay at 3.3V, ±128mA channel current rating, -40°C to 85°C operating range in SOIC-16, and functional equivalence to QS3253 for drop-in replacement evaluation.
Technical Context
The SN74CBTLV3253DR implements two independent 1-of-4 analog switches using low-threshold FETs, enabling bidirectional signal flow with minimal voltage drop and distortion. Its select logic (S0/S1) and active-low output enables (1OE/2OE) provide deterministic channel routing without latching or clocking.
Designed for partial-power-down operation, the device guarantees Ioff ≤15µA when VCC = 0V, preventing back-current flow and ensuring isolation between powered and unpowered system domains. All I/O pins tolerate up to 4.6V regardless of VCC level, supporting mixed-voltage domain interfacing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ON-state resistance | 5Ω typical at VCC = 3V, 64mA - ensures <50mV voltage drop across switch under full load, preserving signal integrity |
| Propagation delay | 0.25ns max at VCC = 3.3V - supports >1GHz small-signal switching in high-speed bus applications |
| Supply voltage range | 2.3V to 3.6V - compatible with 2.5V and 3.3V logic families without level translation |
| Ioff current | 15µA max at VCC = 0V - blocks damaging back-current during hot-swap or partial power-down sequences |
| ESD rating (HBM) | ±2000V - meets industrial-grade ESD robustness requirements per ANSI/ESDA/JEDEC JS-001 |
| Operating temperature | -40°C to +85°C - qualified for enterprise computing and industrial networking environments |
| Channel count | Dual independent 1-of-4 switches - routes two separate 4:1 data paths simultaneously |
Pinout & Package
SN74CBTLV3253DR is housed in a 16-pin SOIC package (9.90mm × 3.90mm), RoHS-compliant with NIPDAU lead finish and moisture sensitivity level (MSL) 1 (unlimited floor life at ≤30°C/60% RH).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE, 2OE | Active-low output enable | Disables respective 1-of-4 switch bank when high; ties to VCC via pullup for power-up high-impedance safety |
| S0, S1 | Binary channel select | 2-bit address selects one of four B-port I/Os (B1–B4) to connect bidirectionally with A-port |
| 1A, 2A | Common I/O port | Shared bidirectional terminal per switch bank; connects to system bus or controller interface |
| 1B1–1B4, 2B1–2B4 | Individual I/O channels | Four dedicated bidirectional I/O terminals per bank; support rail-to-rail analog/digital signal routing |
| VCC | Power supply | Single 2.3–3.6V supply powers both switch banks and control logic; requires local 0.1µF bypass |
| GND | Ground reference | Common return path for all switch conduction and logic; must be low-impedance for noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail I/O switching | Supports full 0V to VCC signal swing on all ports - eliminates clipping in analog or mixed-signal paths |
| Ioff partial-power-down | Guarantees <15µA leakage when VCC = 0V - enables safe hot-plug operation in modular backplanes |
| 5Ω low ON-resistance | Minimizes insertion loss and timing skew across channels - critical for impedance-matched DDR or PCIe trace routing |
| Functional equivalence to QS3253 | Validated pinout, timing, and electrical compatibility - simplifies legacy design migration and second-source qualification |
| 4.6V overvoltage tolerant I/O | Withstands transient excursions beyond VCC - protects against bus contention or level-shifter fault conditions |
Applications
| Enterprise Server Interconnect | Data Center Network Switching |
|---|---|
Use Scenario: Routing 2-bit address/control lines between CPU, memory controller, and multiple DIMM slots in a scalable server platform. IC Role / Device Role / Timing Role: Dual 1-of-4 FET mux provides non-blocking, low-latency path selection for memory-side configuration signals. Use Value: 0.25ns propagation delay preserves setup/hold timing margins across multi-DIMM topologies without added buffering. |
Use Scenario: Selecting among four 10G Ethernet PHY interfaces connected to a central packet processor in a modular line card. IC Role / Device Role / Timing Role: Bidirectional analog switch routes differential clock and status signals between PHYs and host ASIC. Use Value: 5Ω ON-resistance maintains signal fidelity and minimizes jitter accumulation in high-speed serial links. |
| Industrial Building Automation Hub | Wired Broadband Access Gateway |
Use Scenario: Multiplexing sensor data streams (temperature, occupancy, CO₂) from multiple zones into a single microcontroller ADC input. IC Role / Device Role / Timing Role: Low-leakage FET mux isolates unused sensors to prevent loading and crosstalk in battery-powered nodes. Use Value: Ioff ≤15µA at VCC = 0V extends battery life during sleep mode while maintaining sensor readiness. |
Use Scenario: Demultiplexing DOCSIS upstream/downstream control signals between cable modem chipset and multiple RF front-end modules. IC Role / Device Role / Timing Role: Dual-channel switch routes time-critical MAC-layer handshaking signals with deterministic latency. Use Value: Rail-to-rail I/O supports 3.3V logic levels used across cable modem SoCs and RF ICs without level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET multiplexer/demultiplexer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3253DBQR | SSOP-16 package (4.90mm × 3.90mm); identical electrical specs and pinout | Higher board density required; thermal resistance RθJA = 116.6°C/W vs 102.5°C/W for SOIC | Preferred for space-constrained designs where footprint reduction outweighs thermal margin trade-off |
| SN74CBTLV3253DGV | TVSOP-16 package (3.60mm × 4.40mm); same functionality, MSL Level-1, RθJA = 123.1°C/W | Ultra-thin profile suitable for stacked PCB assemblies; slightly higher thermal impedance than SOIC | Select when Z-height is constrained and thermal derating is acceptable within ambient limits |
Compared with SN74CBTLV3253DBQR and SN74CBTLV3253DGV, the SN74CBTLV3253DR offers the lowest thermal resistance (102.5°C/W) and largest solder joint reliability margin in SOIC packaging, making it optimal for thermally demanding enterprise and industrial deployments.
Availability
SN74CBTLV3253DR is available at Aetrix Electronics and suitable for enterprise server interconnect, data center network switching, and industrial building automation requiring stable component supply across extended product lifecycles.
Supply support for SN74CBTLV3253DR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing solutions, with leadership in interface, power management, and signal chain technologies.
The SN74CBTLV3253DR belongs to TI's CBTLV logic family, engineered for ultra-low ON-resistance and high-speed signal routing in next-generation computing and communications infrastructure.
FAQ
What is the maximum operating voltage for SN74CBTLV3253DR I/O pins?
The SN74CBTLV3253DR I/O pins are overvoltage tolerant up to 4.6V regardless of VCC level, allowing safe interfacing with higher-voltage peripherals or transient conditions. This specification is validated per absolute maximum ratings and applies to all B-port and A-port terminals, enabling robust operation in mixed-voltage systems without external clamping diodes.
Does SN74CBTLV3253DR support hot-swap or partial-power-down operation?
Yes, SN74CBTLV3253DR fully supports partial-power-down via its Ioff feature: when VCC = 0V, leakage current is guaranteed ≤15µA, preventing back-current flow and ensuring isolation between powered and unpowered domains. This makes SN74CBTLV3253DR suitable for hot-pluggable modules and systems with staggered power sequencing.
What is the typical ON-state resistance of SN74CBTLV3253DR at 2.5V supply?
At VCC = 2.5V and VI = 0V with 64mA test current, SN74CBTLV3253DR exhibits a typical ON-state resistance of 5Ω, with a maximum of 8Ω across temperature. This low ron value ensures minimal voltage drop and signal attenuation, critical for maintaining signal integrity in high-speed digital and analog multiplexing applications.
Is SN74CBTLV3253DR pin-compatible with QS3253?
Yes, SN74CBTLV3253DR is functionally equivalent and pin-compatible with QS3253, sharing identical pinout, electrical characteristics, and timing behavior. TI explicitly states this equivalence in the device features and functional description, enabling direct substitution in existing QS3253-based designs without layout changes.
What package type and dimensions does SN74CBTLV3253DR use?
SN74CBTLV3253DR uses a 16-pin SOIC (D) package measuring 9.90mm × 3.90mm with standard 1.27mm lead pitch. It carries NIPDAU lead finish, complies with RoHS, and is rated MSL Level-1 (unlimited floor life), making it compatible with standard surface-mount assembly processes and long-term storage requirements.
SN74CBTLV3253DR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTLV
- Package/Case:
- 16-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Multiplexer/Demultiplexer
- Circuit:
- 2 x 4:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
SN74CBTLV3253DR FAQ
1.How can I place an order for SN74CBTLV3253DR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CBTLV3253DR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CBTLV3253DR reliable?
The price and inventory of SN74CBTLV3253DR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTLV3253DR is usually 5 days.
3.What payment methods are accepted for SN74CBTLV3253DR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74CBTLV3253DR transactions.
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4.How is shipping managed for SN74CBTLV3253DR?
SN74CBTLV3253DR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74CBTLV3253DR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CBTLV3253DR?
For technical support, including SN74CBTLV3253DR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV3253DR requirements.
6.How does Aetrix verify that SN74CBTLV3253DR is sourced from the original manufacturer or authorized distributors?
All SN74CBTLV3253DR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV3253DR meets industry standards.
7.What is the process for return or replacement of SN74CBTLV3253DR?
All SN74CBTLV3253DR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV3253DR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTLV3253DR part is unused and in its original packaging.
Return procedure for SN74CBTLV3253DR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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