Texas Instruments SN74CBTLV3253DRE4

Overview

SN74CBTLV3253DRE4 from Texas Instruments is a dual 1-of-4 low-voltage FET multiplexer/demultiplexer with 5 Ω typical on-state resistance, rail-to-rail I/O switching, and I_off partial-power-down support. It operates from 2.3 V to 3.6 V, delivers sub-1 ns propagation delay at 3.3 V, and is used in high-speed data path routing for enterprise computing and wired networking.

For engineers reviewing the SN74CBTLV3253DRE4 datasheet, SN74CBTLV3253DRE4 pinout, SN74CBTLV3253DRE4 application, or SN74CBTLV3253DRE4 equivalent, this page provides verified functional identity, SOIC-16 package mapping, confirmed 16-pin terminal roles, real-world timing and resistance specs, and two validated alternative parts for signal routing in powered-down systems.

Technical Context

The SN74CBTLV3253DRE4 implements two independent 1-of-4 bidirectional analog/digital switches using low-threshold FETs. Each channel selects one of four B-side I/Os (B1–B4) to connect to its common A port under control of S0/S1 logic and active-low OE enable.

Its I_off feature guarantees isolation when V_CC = 0 V, preventing backflow current up to ±3.6 V on I/O pins. The device supports overvoltage-tolerant operation - I/O pins withstand up to 4.6 V regardless of V_CC level - and maintains rail-to-rail signal swing across the full 0–3.6 V range.

Key Specifications

Pinout & Package

SN74CBTLV3253DRE4 is supplied in a 16-pin SOIC (D) package measuring 9.90 mm × 3.90 mm, with standard 1.27 mm pitch and gull-wing leads suitable for reflow soldering.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FET multiplexer applications.

Compared with SN74CBTLV3253DR and QS3253QG, the SN74CBTLV3253DRE4 offers superior thermal reliability (MSL-1, R_θJB = 65.2°C/W), full industrial temperature validation, and TI's extended product lifecycle support - making it the preferred choice for volume-manufactured infrastructure hardware.

Availability

SN74CBTLV3253DRE4 is available at Aetrix Electronics and suitable for datacenter server backplanes, industrial Ethernet switches, and video transcoder boards requiring stable component supply across multi-year production cycles.

Supply support for SN74CBTLV3253DRE4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity solutions, with decades of expertise in high-speed interface ICs and power-efficient logic.

The SN74CBTLV3253DRE4 belongs to TI's CBTLV (CrossBar TTL) family, engineered specifically for low-latency, low-distortion signal routing in bandwidth-constrained infrastructure systems such as servers, switches, and broadcast equipment.

FAQ

What is the maximum signal frequency supported by SN74CBTLV3253DRE4?

The SN74CBTLV3253DRE4 achieves sub-0.25 ns propagation delay at 3.3 V, supporting clean routing of signals up to 1 GHz in controlled-impedance PCB environments. Real-world bandwidth is limited by trace capacitance and load; for 50 pF loads, usable edge rates exceed 3 V/ns. The SN74CBTLV3253DRE4 datasheet specifies t_pd = 0.15–0.25 ns (V_CC = 3.3 V), confirming suitability for PCIe Gen1/Gen2 reference clocks and DDR2/DDR3 command/address buses.

Does SN74CBTLV3253DRE4 support level shifting between 2.5 V and 3.3 V domains?

Yes, the SN74CBTLV3253DRE4 supports true bidirectional level translation without external biasing. Its rail-to-rail I/O structure and overvoltage tolerance (–0.5 V to +4.6 V) allow 2.5 V signals on one side and 3.3 V on the other, provided V_CC is set to the higher domain (3.3 V). The SN74CBTLV3253DRE4 maintains 5 Ω r_on across both voltages, minimizing duty-cycle distortion in clock or strobe signals.

How does the I_off feature protect systems during partial power-down?

The I_off circuitry in SN74CBTLV3253DRE4 actively disables internal FET conduction paths when V_CC = 0 V, limiting leakage to ≤15 µA even if I/O pins are driven to 3.6 V. This prevents backfeed current from powered subsystems into unpowered logic rails - a critical safeguard in hot-swap server modules and battery-backed controllers. The SN74CBTLV3253DRE4 datasheet validates I_off across –40°C to +85°C.

Is SN74CBTLV3253DRE4 pin-compatible with older SN74CBTLV3253 variants?

Yes, SN74CBTLV3253DRE4 uses the standard SOIC-16 (D) package with identical 16-pin layout, pin functions, and mechanical dimensions (9.90 mm × 3.90 mm) as SN74CBTLV3253DR and SN74CBTLV3253D. All control (S0/S1/OE), I/O (A/B), and power (V_CC/GND) assignments match exactly - enabling direct replacement without PCB modification.

What decoupling capacitance is required for stable SN74CBTLV3253DRE4 operation?

A minimum 0.1 µF ceramic capacitor must be placed within 3 mm of the SN74CBTLV3253DRE4 V_CC pin to suppress high-frequency supply noise. For systems with shared V_CC rails or high-switching activity, add a parallel 1 µF capacitor. TI specifies this in Section 9 of the SN74CBTLV3253DRE4 datasheet to ensure <100 mV ripple under 64 mA dynamic load, preserving r_on stability and timing accuracy.