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Home > Products > Integrated Circuits (ICs) > Logic > Signal Switches, Multiplexers, Decoders

Texas Instruments SN74CBTLV3253RGYR

Name: SN74CBTLV3253RGYR
Brand: Texas Instruments
SKU: SN74CBTLV3253RGYR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: SN74CBTLV3253RGYR

Manufacturer:: Texas Instruments

Category:: Signal Switches, Multiplexers, Decoders

Package:: 16-VFQFN Exposed Pad

Datasheet:: SN74CBTLV3253RGYR.pdf

Description:: IC MUX/DEMUX 2 X 4:1 16VQFN

Quantity:: RFQ Add To RFQ list

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Product details

Overview

SN74CBTLV3253RGYR from Texas Instruments is a dual 1-of-4 low-voltage FET multiplexer/demultiplexer in a 16-pin VQFN package (4.00 mm × 3.50 mm), featuring 5 Ω typical on-state resistance, rail-to-rail switching on all I/O ports, and I_off support for partial-power-down operation. It enables high-speed signal routing in 2-channel, 4:1 configurations for enterprise computing and wired networking systems.

For engineers reviewing the SN74CBTLV3253RGYR datasheet, SN74CBTLV3253RGYR pinout, SN74CBTLV3253RGYR application, or SN74CBTLV3253RGYR equivalent, this page delivers verified electrical specs (V_CC = 2.3–3.6 V, t_pd = 0.15 ns), thermal metrics (R_θJA = 78.4 °C/W), I_off leakage (15 µA), and functional mode truth table - all specific to the RGY package variant.

Technical Context

The SN74CBTLV3253RGYR implements two independent 1-of-4 analog switches using low-threshold FETs, with select inputs S0/S1 determining channel connectivity between common A ports (1A, 2A) and four bidirectional B ports per channel (1B1–1B4, 2B1–2B4). Each switch operates with rail-to-rail voltage handling (–0.5 V to 4.6 V) and supports overvoltage tolerance beyond V_CC.

Its I_off protection ensures <15 µA backflow current when V_CC = 0 V and any I/O is biased 0–3.6 V, enabling safe isolation during power sequencing. The device is characterized for –40°C to +85°C operation and exhibits propagation delay as low as 0.15 ns at V_CC = 2.5 V with 30 pF load.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CC Range	2.3 V to 3.6 V - Enables interoperability with 2.5 V and 3.3 V logic domains without level translation.
r_on (Typ)	5 Ω at V_CC = 2.5 V, I_I = 64 mA - Minimizes insertion loss and signal distortion in high-speed data paths.
t_pd	0.15 ns (min) at V_CC = 2.5 V - Supports >1 GHz small-signal bandwidth in impedance-matched traces.
I_off	15 µA max at V_CC = 0 V - Prevents damaging back-current during hot-insertion or partial power-down sequences.
Operating Temp	–40°C to +85°C - Qualified for industrial-grade deployment in datacenter and networking equipment.
R_θJA	78.4 °C/W - Enables higher sustained power dissipation in compact VQFN layout vs. SOIC/SSOP alternatives.
ESD HBM	±2000 V - Meets JEDEC JS-001 for robust handling in automated assembly and field service environments.

Pinout & Package

SN74CBTLV3253RGYR uses a 4.00 mm × 3.50 mm, 16-pin VQFN (RGY) package with exposed thermal pad. Pin 1 is marked by a dot; pins are numbered counterclockwise. The package supports fine-pitch PCB routing and enhanced thermal performance via bottom-side copper exposure.

Pin/Terminal	Circuit Role	Design Meaning
1OE	Active-low enable for Channel 1	Drives entire 1A–1B1–1B4 switch array into high-Z when high; ties to V_CC via pullup for power-up safety.
S1, S0	Binary select inputs	Set 1-of-4 path: S1S0 = 00→1B1, 01→1B2, 10→1B3, 11→1B4 (same for Channel 2 with 2OE).
1A, 2A	Common I/O ports	Bidirectional signal hubs - connect to FPGA I/O banks, ASIC buses, or transceiver lanes.
1B1–1B4, 2B1–2B4	Channel-specific I/O ports	Four independent bidirectional paths per channel; support hot-swap-capable peripheral selection.
GND, V_CC	Power terminals	V_CC (Pin 16) requires local 0.1 µF ceramic bypass; GND (Pin 8) connects to solid ground plane under thermal pad.

Key Features

Feature	Design Value
Dual independent 1-of-4 switches	Enables simultaneous routing of two separate data streams (e.g., PCIe lane + sideband signal) without crosstalk.
5 Ω r_on with rail-to-rail I/O	Preserves signal integrity across full 0–3.3 V swing; eliminates need for external biasing in AC-coupled links.
I_off partial-power-down protection	Blocks backfeed current when V_CC is off but system backplane remains live - critical for modular server backplanes.
Functional equivalence to QS3253	Allows drop-in replacement in legacy designs using QS3253, retaining existing firmware and layout.
Low 0.15 ns propagation delay	Supports >1 Gbps NRZ signaling in short-reach interconnects (e.g., board-to-board, midplane routing).

Applications

Datacenter Server Backplane Switching	Enterprise Network Switch Fabric
Use Scenario: Dynamic reconfiguration of PCIe Gen3/Gen4 lanes between CPU, GPU, and NVMe storage modules during runtime. IC Role / Device Role / Timing Role: Dual 4:1 analog switch providing non-blocking, low-latency path selection between high-speed serial interfaces. Use Value: Enables hardware-accelerated resource pooling with <0.2 ns added jitter and no protocol-aware logic overhead.	Use Scenario: Selecting among four 10G/25G Ethernet PHY outputs to feed a single MAC interface based on link status or QoS priority. IC Role / Device Role / Timing Role: Bidirectional signal router managing physical layer connectivity without disrupting packet flow timing. Use Value: Achieves sub-nanosecond path delay matching across all four PHYs, preserving SERDES eye margin.
Industrial Video Transcoder I/O Multiplexing	Automated Test Equipment (ATE) Signal Path Control
Use Scenario: Routing HDMI 2.0 or DisplayPort 1.4 video streams from multiple sources to a single transcoding ASIC input. IC Role / Device Role / Timing Role: High-bandwidth analog switch maintaining DC-coupled signal fidelity up to 6 Gbps per lane. Use Value: Delivers <5 Ω on-resistance and <20.5 pF off-capacitance to minimize rise-time degradation and intersymbol interference.	Use Scenario: Configuring test head connections to DUT pins during functional test sequences requiring rapid signal path reassignment. IC Role / Device Role / Timing Role: Low-leakage, fast-settling switch enabling <100 ns channel switching for high-throughput parametric testing. Use Value: Guarantees <15 µA I_off and <0.25 ns max t_pd to maintain measurement accuracy and reduce test cycle time.

Datacenter Server Backplane Switching

Enterprise Network Switch Fabric

Use Scenario: Dynamic reconfiguration of PCIe Gen3/Gen4 lanes between CPU, GPU, and NVMe storage modules during runtime.

IC Role / Device Role / Timing Role: Dual 4:1 analog switch providing non-blocking, low-latency path selection between high-speed serial interfaces.

Use Value: Enables hardware-accelerated resource pooling with <0.2 ns added jitter and no protocol-aware logic overhead.

Use Scenario: Selecting among four 10G/25G Ethernet PHY outputs to feed a single MAC interface based on link status or QoS priority.

IC Role / Device Role / Timing Role: Bidirectional signal router managing physical layer connectivity without disrupting packet flow timing.

Use Value: Achieves sub-nanosecond path delay matching across all four PHYs, preserving SERDES eye margin.

Industrial Video Transcoder I/O Multiplexing

Automated Test Equipment (ATE) Signal Path Control

Use Scenario: Routing HDMI 2.0 or DisplayPort 1.4 video streams from multiple sources to a single transcoding ASIC input.

IC Role / Device Role / Timing Role: High-bandwidth analog switch maintaining DC-coupled signal fidelity up to 6 Gbps per lane.

Use Value: Delivers <5 Ω on-resistance and <20.5 pF off-capacitance to minimize rise-time degradation and intersymbol interference.

Use Scenario: Configuring test head connections to DUT pins during functional test sequences requiring rapid signal path reassignment.

IC Role / Device Role / Timing Role: Low-leakage, fast-settling switch enabling <100 ns channel switching for high-throughput parametric testing.

Use Value: Guarantees <15 µA I_off and <0.25 ns max t_pd to maintain measurement accuracy and reduce test cycle time.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FET multiplexer applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74CBTLV3253D	SOIC-16 package (9.9 mm × 3.9 mm); R_θJA = 102.5 °C/W; same electrical specs and pinout.	Preferred for through-hole prototyping or legacy board compatibility where VQFN reflow is unavailable.	Select SN74CBTLV3253D only if manual soldering or wave-solder process is required; not suitable for space-constrained designs.
QS3253M	Functionally identical per TI documentation; different marking and packaging (SOIC); no RGY variant offered.	Used in older telecom line cards where QS-series branding is mandated by design inheritance.	Choose QS3253M only when cross-reference compliance with legacy QS3253-based schematics is mandatory.

Compared with SN74CBTLV3253D and QS3253M, the SN74CBTLV3253RGYR provides superior thermal performance (78.4 vs. 102.5/116.6 °C/W) and 45% smaller footprint - making it optimal for thermally dense, high-density PCB layouts in next-gen infrastructure gear.

Availability

SN74CBTLV3253RGYR is available at Aetrix Electronics and suitable for datacenter server backplanes, enterprise network switch fabrics, and industrial video transcoder I/O multiplexing requiring stable component supply across multi-year production cycles.

Supply support for SN74CBTLV3253RGYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of innovation in high-performance logic and interface solutions.

The SN74CBTLV3253RGYR belongs to TI's CBTLV low-voltage FET switch family, engineered for high-speed, low-distortion signal routing in infrastructure-grade computing and communications systems.

FAQ

What is the maximum operating frequency supported by SN74CBTLV3253RGYR?

The SN74CBTLV3253RGYR does not specify a hard maximum frequency limit but delivers 0.15 ns minimum propagation delay at V_CC = 2.5 V with 30 pF load. Its 5 Ω r_on and 20.5 pF C_io(OFF) yield an RC time constant <100 ps, supporting reliable operation up to 1+ GHz in well-designed transmission lines. Actual bandwidth depends on PCB layout, termination, and source/load impedances.

Does SN74CBTLV3253RGYR support hot-swap operation?

Yes, SN74CBTLV3253RGYR supports hot-swap via its I_off feature: when V_CC = 0 V, back-current is limited to 15 µA even if I/O pins are biased to 0–3.6 V. This prevents damage during live insertion/removal in modular backplanes. External pullup on 1OE/2OE is recommended to ensure default high-Z state at power-up.

Can SN74CBTLV3253RGYR interface directly with 1.8 V logic?

No - SN74CBTLV3253RGYR requires V_CC ≥ 2.3 V per datasheet specifications. While I/O pins tolerate up to 4.6 V regardless of V_CC, control inputs (S0, S1, OE) require VIH ≥ 1.7 V at V_CC = 2.3–2.7 V. Direct 1.8 V logic driving would violate VIH min; a level shifter or compatible 2.5 V domain is required.

What is the thermal pad connection requirement for SN74CBTLV3253RGYR?

The exposed thermal pad on SN74CBTLV3253RGYR must be soldered to a dedicated PCB thermal plane using ≥4 thermal vias (0.3 mm diameter) spaced evenly beneath the pad. TI specifies R_θJB = 21.74 °C/W only when the pad is properly connected; floating or unconnected pads degrade thermal performance by >3× and risk junction overheating under sustained 128 mA per channel.

Is SN74CBTLV3253RGYR pin-compatible with other packages in the same family?

Yes - SN74CBTLV3253RGYR shares identical pin numbering and function mapping with SN74CBTLV3253D (SOIC), SN74CBTLV3253DBQ (SSOP), and SN74CBTLV3253DGV (TVSOP), as confirmed in Figures 4-1 and 4-2 of the datasheet. However, mechanical keepouts, thermal pad requirements, and reflow profiles differ significantly between VQFN and leaded packages.

SN74CBTLV3253RGYR Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: 74CBTLV

Package/Case:: 16-VFQFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Type:: Multiplexer/Demultiplexer

Circuit:: 2 x 4:1

Independent Circuits:: 1

Current - Output High, Low:: -

Voltage Supply Source:: Single Supply

Voltage - Supply:: 2.3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 16-VQFN (4x3.5)

SN74CBTLV3253RGYR FAQ

1.How can I place an order for SN74CBTLV3253RGYR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74CBTLV3253RGYR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74CBTLV3253RGYR reliable?

The price and inventory of SN74CBTLV3253RGYR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTLV3253RGYR is usually 5 days.

3.What payment methods are accepted for SN74CBTLV3253RGYR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74CBTLV3253RGYR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SN74CBTLV3253RGYR?

SN74CBTLV3253RGYR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74CBTLV3253RGYR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74CBTLV3253RGYR?

For technical support, including SN74CBTLV3253RGYR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV3253RGYR requirements.

6.How does Aetrix verify that SN74CBTLV3253RGYR is sourced from the original manufacturer or authorized distributors?

All SN74CBTLV3253RGYR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV3253RGYR meets industry standards.

7.What is the process for return or replacement of SN74CBTLV3253RGYR?

All SN74CBTLV3253RGYR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV3253RGYR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74CBTLV3253RGYR part is unused and in its original packaging.

Return procedure for SN74CBTLV3253RGYR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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