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Texas Instruments SN74CBTLV3257RGYR
- Part No.:
- SN74CBTLV3257RGYR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 16-VFQFN Exposed Pad
- Datasheet:
-
SN74CBTLV3257RGYR.pdf
- Description:
- IC MUX/DEMUX 4 X 1:2 16VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:43,724
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Product details
Overview
SN74CBTLV3257 from Texas Instruments is a low-voltage 4-bit 1-of-2 FET multiplexer/demultiplexer with 5Ω on-state resistance, rail-to-rail switching capability, and Ioff partial-power-down support. It operates from 2.3V to 3.6V, delivers sub-nanosecond propagation delay (tpd ≤ 0.25 ns at VCC = 2.5V), and isolates ports during power-off-enabling robust bus sharing in high-speed digital interconnects for enterprise servers and wired networking equipment.
For engineers reviewing the SN74CBTLV3257 datasheet, SN74CBTLV3257 pinout, SN74CBTLV3257 application, or SN74CBTLV3257 equivalent, key selection criteria include its 5Ω switch RON, ±128mA channel current rating, 200MHz maximum signal frequency, JESD 78 Class II latch-up immunity (>100mA), and VQFN-16 (RGY) package thermal performance (RθJA = 78.4°C/W).
Technical Context
The SN74CBTLV3257 implements four independent bidirectional analog/digital switches controlled by a single select (S) input and global active-low output-enable (OE). Each switch connects one common A-port (1A–4A) to either of two B-ports (B1/B2), enabling 4-channel 2:1 multiplexing or demultiplexing without directionality constraints.
Its FET-based architecture supports rail-to-rail signal swing across all I/O ports, maintains high-impedance isolation when OE = high or VCC = 0, and guarantees Ioff leakage ≤15µA under partial-power-down conditions-ensuring no backflow current between unpowered and powered system domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state resistance (RON) | 5 Ω typical at VCC = 2.5V, 64mA - enables minimal voltage drop and signal attenuation in high-speed data paths. |
| Propagation delay (tpd) | 0.15–0.25 ns at VCC = 2.5V - supports >200MHz operation with negligible timing skew across 4-bit buses. |
| Supply voltage range | 2.3V to 3.6V - compatible with 2.5V and 3.3V logic systems while maintaining full rail-to-rail I/O swing. |
| Ioff leakage current | ≤15 µA at VCC = 0 - prevents damaging backflow current during hot-swap or partial-power-down sequences. |
| Channel current rating | ±128 mA per switch - sufficient for driving terminated transmission lines and moderate capacitive loads. |
| ESD protection | 2000V HBM, 200V MM - meets industrial-grade ESD robustness requirements without external protection. |
| Operating temperature | –40°C to +85°C - qualified for enterprise computing and wired infrastructure environments. |
Pinout & Package
VQFN-16 (RGY) package: 4.00 mm × 3.50 mm body, 0.5 mm pitch, exposed thermal pad. Designed for low-inductance grounding and enhanced thermal dissipation in space-constrained PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1B2 | I/O | Channel 1 B-side port 2 - bidirectional signal path paired with 1A under S = low. |
| 1A | I/O | Channel 1 common A-port - connects to B1 (S = low) or B2 (S = high); shared by both switch paths. |
| 2B1 | I/O | Channel 2 B-side port 1 - active when S = low; routes 2A to this node. |
| 2B2 | I/O | Channel 2 B-side port 2 - active when S = high; routes 2A to this node. |
| 2A | I/O | Channel 2 common A-port - bidirectional interface shared across both B-path selections. |
| GND | Power | Ground reference - must be connected to PCB ground plane; thermal pad tied to GND for optimal heat transfer. |
| 3A | I/O | Channel 3 common A-port - identical functional role to 1A/2A/4A; supports independent 4-channel routing. |
| 3B2 | I/O | Channel 3 B-side port 2 - selected when S = high; provides second path for 3A signals. |
| 3B1 | I/O | Channel 3 B-side port 1 - selected when S = low; provides first path for 3A signals. |
| 4A | I/O | Channel 4 common A-port - completes 4-bit bus interface; electrically isolated from other channels. |
| 4B2 | I/O | Channel 4 B-side port 2 - activated by S = high; enables simultaneous 4-channel 2:1 mux/demux. |
| 4B1 | I/O | Channel 4 B-side port 1 - activated by S = low; supports full 4-bit parallel switching control. |
| OE | Input | Active-low output enable - disables all switches (high-impedance state) when driven high; requires pullup to VCC. |
| S | Input | Select control - determines B1/B2 path for all four channels simultaneously (S = low → B1, S = high → B2). |
| VCC | Power | Positive supply - powers internal circuitry and defines logic thresholds; bypass capacitor required near pin. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low on-resistance | 5Ω typical ensures <50mV drop at 10mA - preserves signal integrity in precision analog and high-speed digital paths. |
| Rail-to-rail I/O switching | Supports full 0V to VCC voltage swing on all ports - eliminates level-shifting needs in mixed-voltage systems. |
| Ioff partial-power-down | Blocks current flow when VCC = 0 - enables safe insertion/removal in live backplanes and hot-swap server modules. |
| Latch-up immunity | Exceeds 100mA per JESD 78 Class II - prevents destructive latch-up during transient overvoltage events. |
| Low capacitive loading | 3pF input capacitance (Ci) and ≤10.5pF off-state I/O capacitance - minimizes signal distortion and crosstalk in GHz-range traces. |
Applications
| Datacenter Server Backplane Switching | Industrial Ethernet PHY Multiplexing |
|---|---|
Use Scenario: Selecting between two redundant 4-bit control buses connected to BMC and baseboard management controller in 1U rack servers. IC Role / Device Role / Timing Role: Bidirectional 4-bit 2:1 mux providing glitch-free bus arbitration with sub-ns propagation delay and zero hold-time dependency. Use Value: Enables failover without software intervention; Ioff isolation prevents backfeeding during BMC reset cycles. | Use Scenario: Sharing a single 4-bit MDIO interface between dual Ethernet PHYs in programmable logic controllers (PLCs). IC Role / Device Role / Timing Role: Low-latency, direction-agnostic switch allowing host MCU to configure either PHY via same MDIO lines. Use Value: Reduces PCB layer count and BOM cost vs dual-MDIO implementation; rail-to-rail swing ensures compatibility with 2.5V/3.3V PHYs. |
| Automated Test Equipment (ATE) Signal Routing | High-Speed Memory Interposer |
Use Scenario: Routing test patterns from pattern generator to DUT pins through configurable 4-bit paths in boundary-scan test fixtures. IC Role / Device Role / Timing Role: Precision analog/digital switch with 5Ω RON and <0.3ns tpd - preserves edge fidelity for 200MHz+ test vectors. Use Value: Eliminates relay-based switching latency and wear-out; ESD-hardened design withstands repeated probe contact. | Use Scenario: Isolating DDR4 memory command/address bus between controller and two LPDDR4 modules in mobile SoC reference designs. IC Role / Device Role / Timing Role: High-speed bus switch enabling dynamic memory module selection without clock domain crossing or buffering. Use Value: Maintains timing margins with <0.25ns skew across all 4 bits; thermal pad ensures stable operation under sustained 1.2V/1.8V mixed-supply loads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET multiplexer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3257PWR | TSSOP-16 (5.00mm × 4.40mm); RθJA = 129.1°C/W - higher thermal resistance than RGY. | Better suited for prototyping with through-hole adapters; less optimal for thermally dense server PCBs. | Choose PWR for breadboarding or legacy TSSOP footprints; RGY preferred for production thermal performance. |
| SN74CBTLV3257DGVR | TVSOP-16 (3.60mm × 4.40mm); RθJA = 123.1°C/W - smaller footprint but higher junction-to-ambient resistance than RGY. | Fits tighter pitch layouts where 4.0×3.5mm VQFN clearance is unavailable; lower current derating above 60°C. | Select DGVR only when board area is constrained beyond RGY's 4.0×3.5mm envelope; verify thermal margin at full load. |
Compared with SN74CBTLV3257PWR and SN74CBTLV3257DGVR, the SN74CBTLV3257RGYR offers the lowest thermal resistance (78.4°C/W) and smallest height profile among production-qualified variants-making it optimal for thermally demanding, space-constrained 4-bit bus switching in enterprise and industrial systems.
Availability
SN74CBTLV3257RGYR is available at Aetrix Electronics and suitable for datacenter server backplanes, industrial Ethernet PHY interfaces, automated test equipment signal routing, and high-speed memory interposers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for SN74CBTLV3257RGYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 90 years of innovation in high-reliability components.
The SN74CBTLV3257 belongs to TI's CBTLV low-voltage FET switch family, engineered for high-speed, low-distortion signal routing in enterprise computing, wired networking, and industrial automation systems where rail-to-rail operation and power-down safety are critical.
FAQ
What is the maximum operating frequency supported by the SN74CBTLV3257RGYR?
The SN74CBTLV3257RGYR is characterized for operation up to 200MHz, verified through switching tests with 30pF/50pF loads and propagation delays as low as 0.15ns at VCC = 2.5V. Real-world bandwidth depends on PCB layout, trace impedance, and capacitive loading-TI recommends controlled-impedance routing and minimizing stub lengths to sustain full-frequency performance. The SN74CBTLV3257RGYR's 5Ω RON and <11pF off-capacitance help preserve signal integrity at these rates.
How does the Ioff feature protect the SN74CBTLV3257RGYR during partial-power-down?
The Ioff feature in the SN74CBTLV3257RGYR limits leakage current to ≤15µA when VCC = 0V, preventing damaging backflow from powered I/O ports into the unpowered device. This enables safe hot-swap operation in modular systems like server blades or field-replaceable units. The SN74CBTLV3257RGYR maintains high-impedance isolation on all switches during power-off, eliminating risk of latch-up or cross-talk-critical for systems with mixed-voltage domains or staggered power sequencing.
Can the SN74CBTLV3257RGYR handle 4.6V inputs while powered at 3.3V?
Yes-the SN74CBTLV3257RGYR supports overvoltage-tolerant inputs up to 4.6V regardless of VCC setting (2.3V–3.6V), as specified in Absolute Maximum Ratings. This allows interfacing with higher-voltage peripherals without level shifters. However, output voltage swing remains rail-to-rail within the VCC range (0V to VCC), so the SN74CBTLV3257RGYR cannot drive 4.6V signals-it only tolerates them on inputs. All I/O pins maintain ESD protection (2000V HBM) under these conditions.
What is the recommended decoupling strategy for the SN74CBTLV3257RGYR?
Texas Instruments specifies a 0.1µF ceramic decoupling capacitor placed as close as possible to the VCC pin of the SN74CBTLV3257RGYR, with short, low-inductance connections to the ground plane. For systems with multiple power domains or high noise susceptibility, adding a parallel 1µF capacitor improves low-frequency filtering. The exposed thermal pad on the SN74CBTLV3257RGYR must be soldered to a solid ground plane to serve as both thermal sink and low-impedance return path-failure to do so degrades both thermal performance and decoupling effectiveness.
Is the SN74CBTLV3257RGYR pin-compatible with other packages in the same family?
No-the SN74CBTLV3257RGYR (VQFN-16) has a unique pinout versus SSOP (DBQ), TSSOP (PW), and TVSOP (DGV) variants, as confirmed by Figures 4-1 and 4-2 in the datasheet. While all share identical logic functionality and electrical specs, the RGY package reorders pins (e.g., S at pin 15, OE at pin 13) to accommodate the VQFN layout. Therefore, SN74CBTLV3257RGYR requires a dedicated footprint and cannot be substituted without PCB revision. Always verify pin mapping using TI's SCDS040N datasheet before layout.
SN74CBTLV3257RGYR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTLV
- Package/Case:
- 16-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Multiplexer/Demultiplexer
- Circuit:
- 4 x 1:2
- Independent Circuits:
- 4
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-VQFN (4x3.5)
SN74CBTLV3257RGYR FAQ
1.How can I place an order for SN74CBTLV3257RGYR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CBTLV3257RGYR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CBTLV3257RGYR reliable?
The price and inventory of SN74CBTLV3257RGYR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTLV3257RGYR is usually 5 days.
3.What payment methods are accepted for SN74CBTLV3257RGYR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74CBTLV3257RGYR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74CBTLV3257RGYR?
SN74CBTLV3257RGYR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74CBTLV3257RGYR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CBTLV3257RGYR?
For technical support, including SN74CBTLV3257RGYR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV3257RGYR requirements.
6.How does Aetrix verify that SN74CBTLV3257RGYR is sourced from the original manufacturer or authorized distributors?
All SN74CBTLV3257RGYR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV3257RGYR meets industry standards.
7.What is the process for return or replacement of SN74CBTLV3257RGYR?
All SN74CBTLV3257RGYR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV3257RGYR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTLV3257RGYR part is unused and in its original packaging.
Return procedure for SN74CBTLV3257RGYR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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