Texas Instruments SN74CBTLV3383DGVR
- Part No.:
- SN74CBTLV3383DGVR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 24-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74CBTLV3383DGVR.pdf
- Description:
- IC BUS FET EXCH SW 5X2:2 24TVSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74CBTLV3383 from Texas Instruments is a low-voltage 10-bit FET bus-exchange switch operating from 2.3 V to 3.6 V, featuring 5 Ω typical on-state resistance, rail-to-rail signal switching, and Ioff partial-power-down protection. It functions as either a 10-bit bus switch or a 5-bit bus exchanger (A/B pair swapping), enabling dynamic signal path reconfiguration in high-speed digital interconnects such as rack server backplanes.
For engineers reviewing the SN74CBTLV3383 datasheet, SN74CBTLV3383 pinout, SN74CBTLV3383 application, or SN74CBTLV3383 equivalent, key selection criteria include its 0.15 ns propagation delay at 2.5 V, ±128 mA channel current rating, bidirectional analog/digital signal support, and TVSOP-24 (DGV) package compatibility with space-constrained PCB layouts.
Technical Context
The SN74CBTLV3383 implements ten independent FET-based transmission gates controlled by two logic inputs: BE (active-low enable) and BX (bus-exchange select). When BE is low, the device enables signal flow; BX determines whether A1–A5 connect to B1–B5 (BX = L) or to B2–B6 (BX = H), implementing true 5-bit signal pair swapping.
Its architecture supports rail-to-rail operation across the full 0 V to VCC range, maintains high-impedance isolation during power-off via Ioff, and delivers sub-nanosecond timing performance - including 1.5 ns enable/disable times and 0.15 ns propagation delay - making it suitable for DDR, PCIe, and parallel bus applications up to 200 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - supports dual-supply systems and low-voltage logic families including LVTTL and LVCMOS. |
| ron (Typ) | 5 Ω at VCC = 2.5 V - ensures minimal voltage drop and signal distortion under 64 mA load per channel. |
| Propagation Delay | 0.15 ns (A↔B) at VCC = 2.5 V - enables timing-critical high-speed data routing without added latency. |
| Channel Current | ±128 mA continuous - sufficient for driving terminated parallel buses and FPGA I/O banks. |
| Ioff | 10 µA max at VCC = 0 V - prevents backflow current and ensures safe hot-insertion in partial-power-down systems. |
| ESD Rating | ±2000 V HBM - meets industrial-grade robustness requirements for board-level handling and system integration. |
| Operating Temp | –40 °C to +85 °C - qualified for extended-temperature industrial and telecom infrastructure environments. |
Pinout & Package
SN74CBTLV3383DGVR uses a 24-pin TVSOP (DGV) package measuring 5.00 mm × 4.40 mm with 0.4 mm lead pitch and 1.2 mm maximum height - optimized for high-density routing and automated assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BE (Pin 1) | Active-low enable input | Drives all 10 switches into high-impedance state when high; required for power sequencing control. |
| BX (Pin 13) | Bus-exchange mode select | Selects signal mapping: BX = L → A1–A5 ↔ B1–B5; BX = H → A1–A5 ↔ B2–B6 (pair swap). |
| VCC (Pin 24) | Positive supply | Single 2.3–3.6 V rail powers all internal FETs and logic; no separate I/O supply needed. |
| GND (Pin 12) | Ground reference | Common return for all signal paths and supply current; must be low-inductance connection. |
| A1–A5, B1–B5 (Pins 2–5, 7–11, 14–15, 16–23) | Bidirectional I/O channels | Each pair (e.g., 1A1/1B1) forms a single-pole single-throw switch; supports analog/digital signals 0–VCC. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog/digital switching | Supports full 0 V to VCC signal swing - preserves integrity of mixed-signal and clock distribution paths. |
| Sub-ns propagation delay | 0.15 ns typical (A↔B) - eliminates timing bottlenecks in high-frequency parallel interfaces like memory buses. |
| Ioff partial-power-down protection | 10 µA max leakage at VCC = 0 V - enables safe operation during hot-swap, sleep-mode, or multi-rail sequencing. |
| 5 Ω low on-resistance | Minimizes insertion loss and crosstalk - critical for maintaining signal integrity in impedance-matched traces. |
| 200 MHz maximum frequency | Validated operation up to 200 MHz - suitable for DDR2/DDR3 address/control routing and PCIe Gen1 sideband signals. |
Applications
| Gaming Console Backplane | Rack Server Interconnect |
|---|---|
|
Use Scenario: Dynamic reconfiguration of GPU–CPU memory-mapped I/O lanes during thermal throttling or firmware updates. IC Role / Device Role / Timing Role: Bidirectional bus-exchange switch enabling real-time A/B lane remapping without interrupting host operation. Use Value: Eliminates need for external multiplexers or FPGA-based routing logic, reducing BOM count and layout complexity. |
Use Scenario: Hot-pluggable module detection and signal path isolation between CPU and expansion cards in 19-inch rack servers. IC Role / Device Role / Timing Role: High-speed isolation switch controlling PCIe configuration space access and SMBus communication during insertion/removal. Use Value: Prevents bus contention and latch-up during live insertion using Ioff-enabled power-down isolation. |
| Communication Board Signal Routing | Industrial PLC I/O Expansion |
|
Use Scenario: Multiplexing between redundant Ethernet PHYs and MAC controllers in carrier-grade routers. IC Role / Device Role / Timing Role: Low-latency 10-bit bus switch selecting active PHY interface while maintaining signal integrity up to 100 MHz. Use Value: Achieves <1 ns skew across all 10 lanes - meeting IEEE 802.3 compliance for auto-negotiation timing margins. |
Use Scenario: Isolating field I/O modules (digital input/output, analog sensor inputs) from main controller during firmware upgrades. IC Role / Device Role / Timing Role: Fail-safe signal gate ensuring zero backfeed current when controller VCC is removed or browned out. Use Value: Meets IEC 61000-4-5 surge immunity requirements by blocking transients from propagating upstream. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus-switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3384DGVR | 10-bit non-exchange bus switch (no BX pin); identical ron, timing, and package. | Lacks bus-exchange functionality - suitable only for static point-to-point switching, not A/B pair swapping. | Choose when signal routing is fixed and no runtime path reconfiguration is required. |
| SN74LVC1G3157DCKR | Single-channel SPDT analog switch; 6 Ω ron, 3.3 V only, SC70-6 package. | Requires 10 discrete units to match 10-bit capability; higher board area and routing overhead. | Use only for low-channel-count prototyping or where TVSOP footprint is unavailable. |
Compared with SN74CBTLV3384DGVR and SN74LVC1G3157DCKR, the SN74CBTLV3383DGVR uniquely integrates 10-channel exchange capability in a single TVSOP-24 package - reducing component count by 90% versus discrete solutions and enabling dynamic signal topology changes impossible with fixed-path alternatives.
Availability
SN74CBTLV3383DGVR is available at Aetrix Electronics and suitable for rack server interconnects, gaming console backplanes, and communication board signal routing requiring stable component supply across extended product lifecycles.
Supply support for SN74CBTLV3383DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability IC design.
The SN74CBTLV3383 belongs to TI's CBTLV (low-voltage bus switch) product line, engineered specifically for high-speed, low-distortion signal routing in computing, networking, and industrial control systems.
FAQ
What is the maximum operating frequency supported by the SN74CBTLV3383DGVR?
The SN74CBTLV3383DGVR is characterized and tested up to 200 MHz, with verified performance in DDR2/DDR3 address/control bus applications. Its 0.15 ns propagation delay and 5 Ω on-resistance ensure minimal signal degradation at these frequencies, provided PCB trace impedance and termination match design guidelines.
Does the SN74CBTLV3383DGVR support hot-swap or partial-power-down operation?
Yes, the SN74CBTLV3383DGVR features Ioff circuitry that limits leakage to 10 µA when VCC = 0 V, preventing damaging backflow current during hot-swap events or multi-rail power sequencing. This allows safe isolation of powered and unpowered subsystems without external protection circuitry.
How does the bus-exchange function work on the SN74CBTLV3383DGVR?
The SN74CBTLV3383DGVR implements bus exchange via the BX pin: when BE is low and BX is high, A1–A5 connect to B2–B6 instead of B1–B5, effectively swapping adjacent signal pairs. This enables dynamic lane remapping in protocols like PCIe or custom parallel buses without changing physical layout.
What is the recommended power supply decoupling for the SN74CBTLV3383DGVR?
Texas Instruments recommends a 0.1 µF to 10 µF ceramic capacitor placed as close as possible to the VCC (Pin 24) and GND (Pin 12) pins of the SN74CBTLV3383DGVR. Multi-layer ceramic capacitors (MLCCs) with low ESR/ESL are preferred to suppress high-frequency switching noise and maintain signal integrity across all 10 channels.
Can the SN74CBTLV3383DGVR handle analog signals such as clocks or audio?
Yes, the SN74CBTLV3383DGVR supports rail-to-rail analog signal switching from 0 V to VCC due to its FET-based architecture and symmetric on-resistance. It has been used successfully for low-jitter clock distribution and analog sensor multiplexing, provided signal bandwidth remains within the 200 MHz limit and load capacitance stays below 10 pF per channel.
SN74CBTLV3383DGVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTLV
- Package/Case:
- 24-TFSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus FET Exchange Switch
- Circuit:
- 5 x 2:2
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TVSOP
SN74CBTLV3383DGVR FAQ
1.How can I place an order for SN74CBTLV3383DGVR through Aetrix?
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For technical support, including SN74CBTLV3383DGVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV3383DGVR requirements.
6.How does Aetrix verify that SN74CBTLV3383DGVR is sourced from the original manufacturer or authorized distributors?
All SN74CBTLV3383DGVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV3383DGVR meets industry standards.
7.What is the process for return or replacement of SN74CBTLV3383DGVR?
All SN74CBTLV3383DGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV3383DGVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTLV3383DGVR part is unused and in its original packaging.
Return procedure for SN74CBTLV3383DGVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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