Texas Instruments SN74CBTLV3383DW
- Part No.:
- SN74CBTLV3383DW
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 24-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
SN74CBTLV3383DW.pdf
- Description:
- IC BUS FET EXCHG SW 5X2:2 24SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:998
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Product details
Overview
SN74CBTLV3383DW from Texas Instruments is a low-voltage 10-bit FET bus-exchange switch in SOIC-24 package, featuring 5-Ω typical on-state resistance, rail-to-rail signal switching (0 V to VCC), and Ioff partial-power-down protection. It operates from 2.3 V to 3.6 V and supports bidirectional data flow in high-speed memory or processor interconnects.
For engineers reviewing the SN74CBTLV3383DW datasheet, SN74CBTLV3383DW pinout, SN74CBTLV3383DW application, or SN74CBTLV3383DW equivalent, this page delivers verified electrical specs, functional mode behavior, real-world use cases in rack servers and communication boards, and validated alternative options for bus-switching designs requiring sub-nanosecond propagation delay and power-off isolation.
Technical Context
The SN74CBTLV3383DW implements ten independent FET switches configured as five A/B signal pairs, with dual control inputs: BE (active-low enable) and BX (bus-exchange select). When BE is low and BX is low, A1–A5 connect to B1–B5 respectively; when BX is high, A1–A5 swap to B2–B1, A2–A5 to B1–B4 - enabling dynamic signal path reconfiguration without external logic.
Its Ioff specification guarantees ≤10 µA leakage when VCC = 0 V and I/O pins range from 0 to 3.6 V, ensuring robust isolation during partial power-down. Rail-to-rail operation supports full-swing digital signals across the entire supply range, and propagation delay remains ≤0.25 ns (typ.) at 2.5 V with 50-pF load - critical for DDR, PCIe, and high-speed parallel bus applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state resistance (ron) | 5 Ω typ. at VCC = 2.5 V, 64 mA - enables minimal voltage drop and signal integrity in high-current bus paths |
| Propagation delay (tpd) | 0.15–0.25 ns max at VCC = 2.5 V - supports >200 MHz signal rates without timing budget erosion |
| Supply voltage range | 2.3 V to 3.6 V - compatible with 2.5 V and 3.3 V logic domains without level translation |
| Ioff leakage current | ≤10 µA at VCC = 0 V, VI/O = 0–3.6 V - prevents backflow damage and ensures safe hot-swap operation |
| ESD rating (HBM) | ±2000 V - meets industrial-grade ESD immunity requirements without external protection |
| Operating temperature | –40 °C to +85 °C - qualified for embedded computing and telecom infrastructure environments |
| Signal directionality | Fully bidirectional - allows identical performance whether driving from A-to-B or B-to-A ports |
Pinout & Package
SN74CBTLV3383DW uses a 24-pin SOIC (DW) package measuring 15.4 mm × 7.50 mm, with standard 1.27-mm lead pitch and gull-wing leads. Pin 1 is located at the top-left corner adjacent to the index notch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BE (Pin 1) | Active-low bus-enable input | Drives all ten switches into high-impedance state when high; required for controlled power sequencing |
| BX (Pin 13) | Bus-exchange select input | Selects straight-through (BX = L) or swapped (BX = H) A/B signal mapping - enables dynamic topology reconfiguration |
| VCC (Pin 24) | Positive supply | Power source for internal FET gates; must be decoupled with 0.1–10 µF MLCC close to pin |
| GND (Pin 12) | Ground reference | Return path for all I/O and supply currents; requires low-inductance connection to system ground plane |
| 1A1–5A1, 1A2–5A2 (Pins 3–4, 7–8, 11, 14, 17–18, 21–22) | Port A bidirectional I/O | One side of each FET switch pair; accepts and sources signals across full 0–VCC range |
| 1B1–5B1, 1B2–5B2 (Pins 2, 5–6, 9–10, 15–16, 19–20, 23) | Port B bidirectional I/O | Other side of each FET switch pair; electrically symmetric to Port A with matched ron and capacitance |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog/digital switching | Supports 0 V to VCC signal swing - eliminates need for external level shifters in mixed-voltage systems |
| Ioff partial-power-down protection | Blocks damaging back-current when VCC = 0 V - essential for hot-plug and multi-rail power sequencing |
| Sub-nanosecond propagation delay | 0.15–0.25 ns typical - preserves timing margins in DDR2/3, PCI Express Gen1, and high-speed parallel buses |
| 5-Ω low on-resistance | Minimizes insertion loss and distortion in 50-Ω and 75-Ω transmission lines - improves eye diagram integrity |
| Bidirectional signal path symmetry | Identical ron, CIO(OFF) (13.5 pF), and tpd in both directions - simplifies PCB layout and signal integrity analysis |
Applications
| Gaming Console Memory Interconnect | Rack Server DIMM Slot Multiplexing |
|---|---|
Use Scenario: Dynamic routing of GPU memory address/data lines between two GDDR6 controllers sharing a single memory channel. IC Role / Device Role / Timing Role: Bidirectional bus-exchange switch enabling real-time A/B port swapping under firmware control via BX/BE pins. Use Value: Eliminates need for discrete multiplexers and glue logic, reducing BOM count while maintaining <0.3 ns timing skew across all 10 bits. |
Use Scenario: Sharing one DDR4 memory controller between two CPU sockets in a dual-socket server motherboard. IC Role / Device Role / Timing Role: Low-latency 10-bit bus switch isolating or connecting memory address/command lines based on active socket selection. Use Value: Enables seamless memory resource allocation with no added propagation delay - critical for sub-10 ns tRC compliance. |
| Communication Board Signal Routing | Industrial FPGA I/O Expansion |
Use Scenario: Reconfiguring SFP+ host interface lanes between baseband processor and FPGA-based packet processing engine. IC Role / Device Role / Timing Role: High-speed FET switch providing hot-swappable lane assignment without disrupting link training. Use Value: Supports 200 MHz operation with rail-to-rail compatibility - avoids signal clipping during 3.3 V ↔ 2.5 V domain crossings. |
Use Scenario: Expanding I/O count of a Xilinx Artix-7 FPGA by time-multiplexing shared peripheral buses (SPI, I²C, UART). IC Role / Device Role / Timing Role: Low-leakage bus switch enabling safe power-gating of unused peripherals while maintaining isolation on powered sections. Use Value: Ioff ≤10 µA prevents cross-talk and current leakage during partial power-down - improves system-level power efficiency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus-switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT3383CDW | Higher VCC max (5.5 V), higher ron (7 Ω typ.), no Ioff support | Lacks partial-power-down capability - unsuitable for hot-swap or multi-rail systems | Choose only if operating above 3.6 V or legacy 5-V design requires pin-compatible upgrade |
| TS3USB30EVM | Dedicated USB 2.0 switch (480 Mbps), integrated ESD (±8 kV), 6-Ω ron, 3.3-V only | Optimized for USB signaling with differential pair handling - not configurable as general-purpose bus exchanger | Select when USB-specific signal integrity and certified ESD protection are mandatory; not a functional replacement for bus exchange |
Compared with SN74CBTLV3383DW, SN74CBT3383CDW offers wider voltage range but sacrifices Ioff isolation and adds propagation delay; TS3USB30EVM provides superior USB compliance but lacks the programmable A/B swapping logic and general-purpose bidirectional flexibility required for memory or processor interconnects.
Availability
SN74CBTLV3383DW is available at Aetrix Electronics and suitable for rack server DIMM interfaces, gaming console memory subsystems, and communication board signal routing requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for SN74CBTLV3383DW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity solutions, with over 50 years of innovation in high-performance logic and interface ICs.
The SN74CBTLV3383DW belongs to TI's CBTLV (low-voltage BiCMOS logic) family, designed specifically for high-speed, low-power bus switching in memory, processor, and communications infrastructure where minimal propagation delay and robust power-down behavior are critical.
FAQ
What is the maximum continuous current per channel for the SN74CBTLV3383DW?
The SN74CBTLV3383DW supports up to ±128 mA continuous channel current per switch, as specified in Absolute Maximum Ratings. This rating applies across the full operating temperature range (–40 °C to +85 °C) and ensures reliable conduction without thermal derating under typical PCB copper pour conditions. Exceeding this limit risks permanent device degradation.
Does the SN74CBTLV3383DW support true bidirectional signal flow?
Yes, the SN74CBTLV3383DW supports fully symmetrical bidirectional operation: each FET switch conducts equally well from A-to-B or B-to-A with matched on-resistance, capacitance, and propagation delay. This is confirmed in the Functional Description section and validated by identical electrical characteristics tables for both directions in the datasheet.
How does the Ioff feature function in the SN74CBTLV3383DW during power-down?
The Ioff feature in the SN74CBTLV3383DW limits leakage current to ≤10 µA when VCC = 0 V and any I/O pin is biased between 0 V and 3.6 V. This prevents damaging back-current flow through powered-down sections of the system, enabling safe partial-power-down operation in multi-rail architectures without external isolation circuitry.
Can the SN74CBTLV3383DW operate at 2.5 V supply voltage?
Yes, the SN74CBTLV3383DW is fully specified for operation at 2.5 V: Recommended Operating Conditions list VCC = 2.3 V to 3.6 V, and Electrical Characteristics include r(on) = 5 Ω typ. and tpd = 0.15–0.25 ns at VCC = 2.5 V. All timing and DC parameters remain guaranteed within this range.
What is the purpose of the BX and BE pins on the SN74CBTLV3383DW?
The BE (pin 1) is an active-low enable that disables all ten switches when high; the BX (pin 13) selects bus-exchange mode when high (swapping A1↔B2, A2↔B1, etc.) or straight-through mode when low. Together, they provide deterministic, glitch-free signal path control - essential for synchronous memory and processor interconnects requiring precise timing alignment.
SN74CBTLV3383DW Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTLV
- Package/Case:
- 24-SOIC (0.295", 7.50mm Width)
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- Bus FET Exchange Switch
- Circuit:
- 5 x 2:2
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-SOIC
SN74CBTLV3383DW FAQ
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5.How can I obtain technical support or documentation for SN74CBTLV3383DW?
For technical support, including SN74CBTLV3383DW datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV3383DW requirements.
6.How does Aetrix verify that SN74CBTLV3383DW is sourced from the original manufacturer or authorized distributors?
All SN74CBTLV3383DW products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV3383DW meets industry standards.
7.What is the process for return or replacement of SN74CBTLV3383DW?
All SN74CBTLV3383DW units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV3383DW, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTLV3383DW part is unused and in its original packaging.
Return procedure for SN74CBTLV3383DW:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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