Texas Instruments SN74CBTLV3383PWR
- Part No.:
- SN74CBTLV3383PWR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 24-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74CBTLV3383PWR.pdf
- Description:
- IC BUS FET EXCH SW 5X2:2 24TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74CBTLV3383 from Texas Instruments is a low-voltage 10-bit FET bus-exchange switch operating from 2.3 V to 3.6 V, featuring 5 Ω typical on-state resistance, rail-to-rail signal switching, and Ioff partial-power-down protection. It functions as either a 10-bit bus switch or a 5-bit bus exchanger (A/B pair swapping), enabling dynamic signal path reconfiguration in high-speed digital interconnects such as rack server backplanes.
For engineers reviewing the SN74CBTLV3383 datasheet, SN74CBTLV3383 pinout, SN74CBTLV3383 application, or SN74CBTLV3383 equivalent, key selection criteria include its bidirectional 128 mA per-channel current rating, sub-0.25 ns propagation delay at 3.3 V, 200 MHz maximum tested frequency, and TSSOP-24 package compatibility with space-constrained communication board layouts.
Technical Context
The SN74CBTLV3383 implements ten independent FET-based transmission gates controlled by two logic inputs: BE (active-low enable) and BX (bus-exchange select). When BE is low, the device routes signals between A- and B-side I/O pairs; when BX is high, it swaps corresponding A1↔B2, A2↔B1 pairs across five dual channels.
Its Ioff specification guarantees <10 µA leakage when VCC = 0 V and I/O voltages range from 0 to 3.6 V, ensuring isolation and preventing backflow during partial power-down - critical for hot-swap-capable rack servers and gaming platform power sequencing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - supports modern low-voltage I/O standards including 2.5 V and 3.3 V systems without level shifting. |
| ron (Typ) | 5 Ω at VCC = 3.3 V - minimizes RC delay and signal distortion for high-fidelity data routing up to 200 MHz. |
| Propagation Delay | 0.15–0.25 ns (A↔B) - enables timing-critical applications like PCIe Gen1/Gen2 sideband switching and memory channel multiplexing. |
| Ioff | <10 µA at VCC = 0 V - ensures safe operation during partial power-down and prevents latch-up in mixed-supply domains. |
| ESD Rating | ±2000 V HBM - meets industrial-grade robustness requirements for communication board handling and field deployment. |
| Continuous Current | ±128 mA per channel - supports driving moderate capacitive loads (e.g., 10–15 pF traces) without derating. |
| Operating Temp | –40 °C to +85 °C - qualified for extended temperature operation in embedded networking and edge compute hardware. |
Pinout & Package
TSSOP-24 package (PW), 7.80 mm × 4.40 mm body size, 1.2 mm max height, 0.65 mm lead pitch, RoHS-compliant NIPDAU finish, MSL Level-1 (unlimited floor life).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BE (Pin 1) | Active-low global enable | Drives all 10 switches into high-impedance state when high; required to be pulled up externally for power-up safety. |
| BX (Pin 13) | Bus-exchange control | Selects functional mode: low = direct A↔B mapping; high = swapped A1↔B2 / A2↔B1 pairing for 5-bit exchange. |
| VCC (Pin 24) | Positive supply | Single 2.3–3.6 V rail powers all internal FETs and logic; no separate I/O voltage required. |
| GND (Pin 12) | Ground reference | Common return for all signal paths and supply current; must be low-inductance connection for noise immunity. |
| A1–A5, B1–B5 (Pins 2–11, 14–23) | Bidirectional I/O pairs | Each A/B pair forms a symmetrical, rail-to-rail analog/digital switch path; no directionality or drive strength asymmetry. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail signal support | Switches signals from 0 V to VCC - preserves full logic swing integrity for 2.5 V/3.3 V LVTTL/LVCMOS interfaces. |
| Bidirectional conduction | Identical ron, capacitance, and timing in both directions - eliminates need for direction control logic in bus arbitration. |
| Ioff partial-power-down | Blocks back-current flow when VCC = 0 V - enables safe insertion/removal of daughter cards in powered-backplane systems. |
| Low input capacitance | 3.5 pF on control pins - reduces loading on upstream drivers and improves timing margin in dense PCB layouts. |
| High ESD robustness | ±2000 V HBM - withstands handling stress in automated assembly and field service without external protection diodes. |
Applications
| Gaming Console I/O Multiplexing | Rack Server Backplane Switching |
|---|---|
Use Scenario: Dynamic routing of GPU/CPU debug interfaces and peripheral control lines across multiple expansion slots. IC Role / Device Role / Timing Role: Bidirectional bus-exchange switch enabling real-time A/B signal pair swapping under firmware control. Use Value: Eliminates need for discrete mux ICs and reduces PCB layer count by consolidating 10 signal paths into one TSSOP-24 device. |
Use Scenario: Hot-plug-capable interconnection between baseboard management controller (BMC) and modular compute nodes. IC Role / Device Role / Timing Role: Isolation switch providing Ioff-enabled power-domain separation during node insertion/removal. Use Value: Prevents backfeeding and system reset events during live maintenance, meeting enterprise reliability SLAs. |
| Communication Board Signal Arbitration | Industrial Ethernet PHY Interface Sharing |
Use Scenario: Sharing a single SFP+ cage interface between two MAC controllers in dual-homed network appliances. IC Role / Device Role / Timing Role: Low-latency 10-bit bus switch toggling physical layer connectivity without packet loss. Use Value: Achieves sub-nanosecond path delay variation, preserving SERDES eye diagram integrity during failover. |
Use Scenario: Time-division multiplexing of a single Ethernet PHY between two real-time PLC processors. IC Role / Device Role / Timing Role: Rail-to-rail analog-capable switch supporting MDI differential pair routing and auxiliary control signals. Use Value: Maintains signal fidelity across 100BASE-TX bandwidth while reducing component count versus relay-based solutions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus-switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3384PWR | 10-bit non-exchange bus switch (no BX pin); identical ron, timing, and Ioff specs. | Lacks bus-exchange functionality - suitable only for fixed-path 10-bit switching, not A/B pair swapping. | Select when signal routing is static and no runtime path inversion is required. |
| PI3CHD3245ZMEX | 10-bit switch with 3.5 Ω ron, 2.5–5.5 V supply range, and integrated ESD protection (±8 kV HBM). | Wider VCC range enables 5 V legacy system integration; higher ESD rating suits harsher environments. | Choose for mixed-voltage designs or where enhanced ESD immunity is mandated beyond JEDEC HBM-2kV. |
Compared with SN74CBTLV3383, SN74CBTLV3384PWR removes bus-exchange capability but retains identical performance for static routing, while PI3CHD3245ZMEX extends supply and ESD margins at the cost of larger TSSOP-24 footprint and different control logic polarity.
Availability
SN74CBTLV3383PWR is available at Aetrix Electronics and suitable for rack server backplanes, gaming console I/O subsystems, and communication board signal arbitration requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant TSSOP packaging.
Supply support for SN74CBTLV3383PWR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a U.S.-based semiconductor company specializing in analog, embedded processing, and logic solutions, with over 90 years of innovation in high-reliability electronic components.
The SN74CBTLV3383 belongs to TI's CBTLV (low-voltage BiCMOS logic) bus-switch family, designed specifically for high-speed, low-distortion signal routing in next-generation computing and communications infrastructure.
FAQ
What is the maximum operating frequency supported by the SN74CBTLV3383?
The SN74CBTLV3383 has been tested up to 200 MHz in typical applications. Its sub-0.25 ns propagation delay and 5 Ω on-resistance ensure minimal signal degradation at this frequency, making it suitable for PCIe Gen1/Gen2 sideband, DDR clock forwarding, and high-speed serial link multiplexing where jitter accumulation must be minimized. Performance remains stable across the full –40 °C to +85 °C temperature range.
Does the SN74CBTLV3383 require external pull-up resistors on its control pins?
Yes - the BE pin of the SN74CBTLV3383 must be tied to VCC through an external pull-up resistor to ensure high-impedance state during power-up or brownout conditions. TI recommends a resistor value determined by the driver's current-sinking capability; typical values range from 4.7 kΩ to 10 kΩ. The BX pin may be driven directly but benefits from clean, low-noise logic sources to avoid unintended bus-exchange activation.
Can the SN74CBTLV3383 interface with 5-V logic systems?
No - the SN74CBTLV3383 is rated for absolute maximum input voltage of 4.6 V and operates only from 2.3 V to 3.6 V. While its I/O pins are overvoltage tolerant up to 4.6 V, sustained 5 V signaling violates absolute maximum ratings and risks permanent damage. For 5 V systems, consider TI's SN74CBT3383 or Diodes Inc.'s PI3CHD3245ZMEX, which support wider supply ranges.
How does the Ioff feature of the SN74CBTLV3383 protect downstream circuitry?
The Ioff feature of the SN74CBTLV3383 limits leakage current to less than 10 µA when VCC = 0 V and I/O pins are biased between 0 V and 3.6 V. This prevents damaging back-current flow from powered sections into unpowered domains - a critical safeguard during hot-swap operations in rack servers or modular gaming platforms where partial power-down is routine. The device maintains full signal isolation without requiring external blocking components.
What is the thermal resistance (RθJA) of the SN74CBTLV3383PWR in its TSSOP package?
The SN74CBTLV3383PWR in TSSOP-24 (PW) package has a junction-to-ambient thermal resistance (RθJA) of 90.1 °C/W under standard JEDEC test conditions. This value assumes a 1-inch² copper pad with two vias; actual thermal performance improves significantly with enhanced PCB copper area and thermal vias. For continuous 128 mA per-channel operation, junction temperature rise remains within safe limits up to +85 °C ambient when layout guidelines are followed.
SN74CBTLV3383PWR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTLV
- Package/Case:
- 24-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus FET Exchange Switch
- Circuit:
- 5 x 2:2
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TSSOP
SN74CBTLV3383PWR FAQ
1.How can I place an order for SN74CBTLV3383PWR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CBTLV3383PWR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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5.How can I obtain technical support or documentation for SN74CBTLV3383PWR?
For technical support, including SN74CBTLV3383PWR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV3383PWR requirements.
6.How does Aetrix verify that SN74CBTLV3383PWR is sourced from the original manufacturer or authorized distributors?
All SN74CBTLV3383PWR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV3383PWR meets industry standards.
7.What is the process for return or replacement of SN74CBTLV3383PWR?
All SN74CBTLV3383PWR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV3383PWR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTLV3383PWR part is unused and in its original packaging.
Return procedure for SN74CBTLV3383PWR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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