Texas Instruments SN74CBTLV3384DBQR
- Part No.:
- SN74CBTLV3384DBQR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 24-SSOP (0.154", 3.90mm Width)
- Datasheet:
-
SN74CBTLV3384DBQR.pdf
- Description:
- IC BUS SWITCH 5 X 1:1 24SSOP
- Quantity:
- Payment:

- Shipping:

Inventory:3,463
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Product details
Overview
SN74CBTLV3384DBQR from Texas Instruments is a low-voltage 10-bit FET bus switch in a 24-pin QSOP (DBQ) package, featuring 5-Ω typical on-state resistance, rail-to-rail switching, and Ioff support for partial-power-down mode. It operates from 2.3 V to 3.6 V and delivers sub-nanosecond propagation delay (0.15 ns typ at 2.5 V), enabling high-speed data routing in memory expansion and processor interconnect applications.
For engineers reviewing the SN74CBTLV3384DBQR datasheet, SN74CBTLV3384DBQR pinout, SN74CBTLV3384DBQR application, or SN74CBTLV3384DBQR equivalent, key selection criteria include guaranteed 5-Ω ron, dual 5-bit independent enable control, Ioff-enabled isolation during power-down, and JEDEC-compliant ESD protection (2000-V HBM).
Technical Context
This device implements two independent 5-bit FET bus switches with separate OE inputs, allowing flexible configuration as either two 5-bit switches or one 10-bit switch. Each switch provides bidirectional, noninverting signal flow between A and B ports with no level translation.
Rail-to-rail operation supports input/output voltages from GND to VCC, while the Ioff feature limits backflow current to ≤10 μA when VCC = 0 V and any port is biased 0–3.6 V - critical for hot-swap and mixed-voltage system interoperability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - enables compatibility with 2.5 V and 3.3 V logic domains without level shifters. |
| ron (Typ) | 5 Ω - ensures minimal voltage drop and signal distortion under 24 mA load, preserving signal integrity in high-speed buses. |
| tpd (Typ) | 0.15 ns at 2.5 V - enables <1 GHz effective switching bandwidth for DDR memory buffering and FPGA I/O expansion. |
| Ioff | 10 μA max at VCC = 0 V - guarantees safe isolation during partial power-down, preventing backdrive damage in multi-rail systems. |
| ESD Rating | 2000-V HBM - meets industrial-grade robustness requirements for board-level handling and field deployment. |
| Propagation Delay Variation | ±0.1 ns over temperature - supports deterministic timing closure in synchronous parallel bus architectures. |
| Input Capacitance | 4.5 pF - minimizes loading on driving sources, reducing driver power consumption and skew in fanout-heavy designs. |
Pinout & Package
SN74CBTLV3384DBQR uses a 24-pin QSOP (DBQ) package with 0.65 mm pitch, 7.7 mm × 4.9 mm body size, and 1.2 mm max height per JEDEC MO-153. Pin 1 is located in quadrant Q1 per tape-and-reel orientation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE | Enable input for first 5-bit switch (1A1–1A5 ↔ 1B1–1B5) | Active-low control: drives switch ON when low; high-impedance state when high - enables independent gating of first bus segment. |
| 2OE | Enable input for second 5-bit switch (2A1–2A5 ↔ 2B1–2B5) | Independent active-low control allows time-multiplexed or domain-isolated switching of second bus segment. |
| 1A1–1A5, 2A1–2A5 | Input/Output terminals (Port A) | Bidirectional, rail-to-rail I/O pins - connect to upstream logic (e.g., CPU data bus) without direction control logic. |
| 1B1–1B5, 2B1–2B5 | Input/Output terminals (Port B) | Bidirectional, rail-to-rail I/O pins - interface to downstream peripherals (e.g., SRAM, flash) with matched impedance. |
| VCC | Positive supply | Single 2.3–3.6 V rail powers all internal FETs and control logic - eliminates need for auxiliary supplies. |
| GND | Ground reference | Common return path for all signal and supply currents - requires low-inductance connection to minimize ground bounce. |
Key Features
| Feature | Design Value |
|---|---|
| Low on-state resistance | 5 Ω typical ensures <0.12 V drop at 24 mA, maintaining TTL/CMOS logic thresholds across full VCC range. |
| Rail-to-rail switching | Supports 0 V to VCC signal swing on both ports - eliminates level-shifter requirement in mixed-voltage memory interfaces. |
| Ioff partial-power-down protection | Blocks >99.9% of backflow current (≤10 μA) when VCC = 0 V - prevents data corruption and latch-up in powered-down subsystems. |
| Latch-up immunity | Exceeds 250 mA per JESD 17 - ensures robust operation in noisy industrial environments with transient coupling. |
| High-speed propagation | 0.15 ns typical tpd enables use in >500 MHz data paths without timing budget penalty. |
Applications
| Memory Expansion Interface | Processor Local Bus Isolation |
|---|---|
|
Use Scenario: Adding external SRAM or Flash to an MCU with limited address/data pins. IC Role / Device Role / Timing Role: Bidirectional 10-bit data bus switch enabling time-shared access between CPU and memory devices. Use Value: Eliminates need for discrete transceivers or CPLDs; 5-Ω ron preserves setup/hold margins at 100+ MHz bus speeds. |
Use Scenario: Isolating debug/test interfaces from main processor bus during firmware updates. IC Role / Device Role / Timing Role: Controlled gate for 10-bit address/data lines, activated only during JTAG/SWD programming cycles. Use Value: Prevents unintended memory writes or peripheral activation; Ioff blocks leakage when debug controller is unpowered. |
| FPGA I/O Expansion Hub | Hot-Swappable Peripheral Interconnect |
|
Use Scenario: Routing configurable I/O signals from FPGA bank to multiple daughterboards. IC Role / Device Role / Timing Role: Low-latency, directionless signal bridge between FPGA I/O and modular peripheral connectors. Use Value: Sub-ns tpd avoids re-timing logic; rail-to-rail operation accommodates 2.5 V and 3.3 V I/O standards simultaneously. |
Use Scenario: Enabling live insertion/removal of PCIe add-in cards in server backplanes. IC Role / Device Role / Timing Role: Signal isolation element placed between host slot and hot-plug connector to manage power sequencing. Use Value: Ioff prevents backfeed into powered-down card; 2000-V HBM withstands ESD events during manual handling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3384DWR | Same silicon die in SOIC-24 package; higher θJA (46°C/W vs. 61°C/W) and tube packaging (25 pcs). | Preferred for prototyping or low-volume PCB assembly where hand-soldering or socketing is used. | Select DWR when thermal margin >10°C is available and reel automation is not required. |
| SN74CBTLV3384PWR | Same functionality in TSSOP-24; identical ron and timing, but thinner profile (1.2 mm vs. 1.75 mm) and 88°C/W θJA. | Suitable for space-constrained consumer electronics where board thickness is critical. | Choose PWR when Z-height <1.3 mm is mandatory and thermal derating to 85°C ambient is acceptable. |
Compared with SN74CBTLV3384DWR and SN74CBTLV3384PWR, the SN74CBTLV3384DBQR offers optimal balance of thermal performance (61°C/W), automated assembly compatibility (2500-piece tape-and-reel), and industry-standard QSOP footprint - making it the default choice for volume production of industrial and telecom equipment.
Availability
SN74CBTLV3384DBQR is available at Aetrix Electronics and suitable for memory expansion interfaces, processor local bus isolation, and FPGA I/O expansion requiring stable component supply, long-term lifecycle assurance, and JEDEC-compliant ESD robustness.
Supply support for SN74CBTLV3384DBQR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of expertise in high-speed interface ICs and industrial-grade reliability.
The SN74CBTLV3384DBQR belongs to TI's CBTLV (low-voltage BiCMOS transistor logic) bus switch family, engineered for zero-delay, bidirectional signal routing in 2.5 V/3.3 V digital systems where power efficiency and signal fidelity are critical.
FAQ
What is the maximum operating frequency supported by SN74CBTLV3384DBQR?
The SN74CBTLV3384DBQR does not specify a clock frequency limit because it is a passive FET switch, not a clocked device. Its 0.15 ns typical propagation delay supports reliable operation in data paths up to 500–800 MHz, depending on trace length, load capacitance, and drive strength. System-level bandwidth is determined by RC time constant using its 5 Ω ron and external load.
Does SN74CBTLV3384DBQR require external pull-up resistors on OE pins?
Yes - to ensure high-impedance state during power-up/power-down, OE pins must be tied to VCC via pull-up resistors. The minimum value depends on the driver's current-sinking capability; TI recommends verifying against the specific control source's IOL. Leaving OE floating risks undefined switch states and potential bus contention.
Can SN74CBTLV3384DBQR interface between 2.5 V and 3.3 V logic domains?
Yes - SN74CBTLV3384DBQR supports rail-to-rail switching, meaning its A and B ports accept and pass signals from 0 V to VCC. When powered at 3.3 V, it safely buffers 2.5 V signals without level translation; when powered at 2.5 V, it correctly passes 2.5 V logic levels. Voltage translation is not performed - only isolation and routing.
What is the thermal resistance (θJA) of SN74CBTLV3384DBQR in its DBQ package?
The SN74CBTLV3384DBQR in the QSOP (DBQ) package has a specified junction-to-ambient thermal resistance (θJA) of 61°C/W under standard JEDEC test conditions. This value assumes a 2-layer board with 1 in² copper pour; actual performance improves with enhanced PCB copper area and thermal vias.
Is SN74CBTLV3384DBQR compatible with lead-free reflow processes?
Yes - SN74CBTLV3384DBQR is RoHS-compliant with NIPDAU lead finish and rated for MSL Level-2 (260°C peak reflow, 1-year floor life). Its DBQ package is qualified for standard Pb-free soldering profiles per JEDEC J-STD-020, including ramp rates and time-above-liquidus specifications.
SN74CBTLV3384DBQR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTLV
- Package/Case:
- 24-SSOP (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus Switch
- Circuit:
- 5 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-SSOP
SN74CBTLV3384DBQR FAQ
1.How can I place an order for SN74CBTLV3384DBQR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CBTLV3384DBQR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CBTLV3384DBQR reliable?
The price and inventory of SN74CBTLV3384DBQR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTLV3384DBQR is usually 5 days.
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Once your SN74CBTLV3384DBQR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CBTLV3384DBQR?
For technical support, including SN74CBTLV3384DBQR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV3384DBQR requirements.
6.How does Aetrix verify that SN74CBTLV3384DBQR is sourced from the original manufacturer or authorized distributors?
All SN74CBTLV3384DBQR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV3384DBQR meets industry standards.
7.What is the process for return or replacement of SN74CBTLV3384DBQR?
All SN74CBTLV3384DBQR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV3384DBQR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTLV3384DBQR part is unused and in its original packaging.
Return procedure for SN74CBTLV3384DBQR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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