Texas Instruments SN74CBTLV3857DGVR
- Part No.:
- SN74CBTLV3857DGVR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 24-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74CBTLV3857DGVR.pdf
- Description:
- IC BUS SWITCH 10 X 1:1 24TVSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74CBTLV3857DGVR from Texas Instruments is a 10-bit FET bus switch designed for 3-V to 3.6-V operation with SSTL_2-compatible enable input, 7–13 Ω on-state resistance, rail-to-rail switching, and integrated 10-kΩ B-port pulldowns-optimized for DDR SDRAM data-path termination in high-speed memory interfaces.
For engineers reviewing the SN74CBTLV3857DGVR datasheet, SN74CBTLV3857DGVR pinout, SN74CBTLV3857DGVR application, or SN74CBTLV3857DGVR equivalent, key selection criteria include on-resistance matching for SSTL_2 series termination replacement, Ioff-enabled partial-power-down isolation, flow-through PCB layout compatibility, and TVSOP-24 thermal performance (θJA = 86°C/W).
Technical Context
This device implements a 10-channel bidirectional FET switch array with independent OE control, where each channel exhibits low and symmetric on-resistance (7–13 Ω at VCC = 3 V) and sub-nanosecond propagation delay (0.25 ns typical). The internal 10-kΩ pulldown resistors on all B-port pins and 50-kΩ pullup on OE support SSTL_2 logic level compliance without external biasing.
It supports rail-to-rail signal switching across A/B ports, features Ioff protection for backflow current suppression during partial power-down, and meets JESD 78 Class II latch-up immunity (>100 mA). Its flow-through pinout minimizes trace skew and layer transitions in DDR memory routing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 3 V to 3.6 V - defines compatible DDR I/O supply domain and ensures stable operation with SSTL_2 reference voltage generation (VREF = 0.38 × VCC). |
| ron (Typ) | 7–13 Ω - enables direct replacement of discrete 22–33 Ω series termination resistors in DDR SDRAM data lines. |
| tpd (Max) | 0.25 ns - guarantees minimal signal distortion and timing budget impact in 200 Mbit/s double-data-rate paths. |
| Ioff Support | Yes - prevents damaging current flow between powered and unpowered system domains during hot-swap or partial shutdown. |
| Cio(OFF) | 5 pF - ensures low capacitive loading on disabled channels, preserving signal integrity in high-frequency bus sharing. |
| θJA | 86°C/W - specifies thermal performance for TVSOP-24 package under standard JEDEC PCB conditions. |
Pinout & Package
SN74CBTLV3857DGVR is housed in a 24-pin TVSOP (Thin Very Small Outline Package) with 0.4 mm lead pitch and exposed pad-less construction, optimized for high-density DDR memory subsystem layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1–A10 | Data input/output port A | Bidirectional signal path connected to controller or memory-side traces; rail-to-rail capable. |
| B1–B10 | Data input/output port B | Bidirectional signal path with internal 10-kΩ pulldown to GND; connects to DDR SDRAM DQ/DQS lines. |
| OE | Output-enable control | Active-low SSTL_2-compatible input with 50-kΩ internal pullup; controls all 10 switches simultaneously. |
| VCC | Power supply | 3.0–3.6 V supply for switch core and internal bias circuitry; decoupling required per high-speed layout guidelines. |
| GND | Ground reference | Common return path for all signals and internal pulldowns; must be low-inductance connection. |
| VREF | Reference voltage input | Input for generating SSTL_2 threshold (VREF = 0.38 × VCC); used internally for VIH/VIL level definition. |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through architecture | Pinout aligns A1–A10 and B1–B10 in linear sequence across opposite sides, enabling straight PCB trace routing and minimizing stub length in DDR buses. |
| SSTL_2-compatible OE | Accepts AC/DC VIH/VIL thresholds referenced to VREF (±350 mV AC, ±180 mV DC), eliminating level-shifter need in DDR memory interfaces. |
| Integrated B-port pulldowns | 10-kΩ resistors on all B1–B10 pins ensure defined logic-low state when DDR device is unpowered or tri-stated. |
| Rail-to-rail switching | Supports full 0–VCC signal swing on both A and B ports, preserving signal fidelity for SSTL_2-compliant data and strobe signals. |
Applications
| DDR SDRAM Memory Interface | Memory Buffering in Embedded Systems |
|---|---|
Use Scenario: Interfacing memory controller to DDR SDRAM chips in industrial PLCs requiring reliable 200 Mbit/s data transfer. IC Role / Device Role / Timing Role: Bidirectional bus switch providing on-demand signal path enable/disable with sub-nanosecond timing control and series-termination replacement. Use Value: Eliminates 10 discrete 22–33 Ω series resistors while maintaining signal integrity and reducing BOM count and PCB area. | Use Scenario: Isolating memory subsystem during firmware update or sleep mode in medical imaging devices. IC Role / Device Role / Timing Role: High-impedance disconnect switch enabling safe power sequencing and preventing backfeed between active and dormant domains. Use Value: Ioff functionality ensures no damaging current flows when VCC is off, meeting IEC 62368-1 safety requirements for partial power-down. |
| High-Speed Test Access Multiplexing | Logic-Level Translation in Mixed-Voltage Systems |
Use Scenario: Sharing test access lines among multiple DDR modules on a production test board. IC Role / Device Role / Timing Role: Low-capacitance (5 pF), low-on-resistance switch enabling clean signal routing without added jitter or reflection. Use Value: Cio(OFF) ≤ 5 pF and tpd ≤ 0.25 ns preserve edge rate and eye margin for automated test equipment (ATE) signal integrity. | Use Scenario: Bridging 3.3-V controller logic to 2.5-V DDR memory in legacy industrial gateways. IC Role / Device Role / Timing Role: Voltage-transparent bidirectional switch supporting rail-to-rail signal pass-through without level-shifting circuitry. Use Value: Enables interoperability between 3.3-V and 2.5-V domains using only passive termination, avoiding active translators and associated latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT3857PWR | Higher on-resistance (15–25 Ω), no VREF pin, TTL-compatible OE, operates at 4.5–5.5 V. | Designed for 5-V LVTTL systems, not SSTL_2; lacks internal pulldowns and Ioff support. | Select only for legacy 5-V memory expansion where SSTL_2 compliance and partial-power-down are not required. |
| PI3CHD3857LEX | Lower on-resistance (5–9 Ω), supports 1.8–3.6 V, includes ESD protection (±8 kV HBM), but no internal pulldowns. | Targeted at portable DDR2/DDR3 designs with tighter power budgets; requires external B-port biasing. | Prefer when lower Ron and enhanced ESD robustness are critical, and external 10-kΩ pulldowns can be accommodated. |
Compared with SN74CBTLV3857DGVR, SN74CBT3857PWR requires higher supply voltage and lacks SSTL_2 support, while PI3CHD3857LEX offers better Ron and ESD rating but shifts B-port bias responsibility to external components-making SN74CBTLV3857DGVR optimal for drop-in DDR SDRAM termination in 3.3-V industrial systems.
Availability
SN74CBTLV3857DGVR is available at Aetrix Electronics and suitable for DDR SDRAM memory interface design, industrial embedded controller interconnects, and high-speed test access multiplexing requiring stable component supply, long-term lifecycle assurance, and consistent TVSOP-24 packaging.
Supply support for SN74CBTLV3857DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability industrial and automotive electronics.
SN74CBTLV3857DGVR belongs to TI's CBTLV (Crossbar TTL) family of low-voltage FET bus switches, engineered specifically for DDR memory subsystems requiring precise impedance matching, fast switching, and robust power-domain isolation.
FAQ
What is the function of the VREF pin on the SN74CBTLV3857DGVR?
The VREF pin on the SN74CBTLV3857DGVR sets the reference voltage for SSTL_2-compatible input thresholds (VIH = VREF + 350 mV, VIL = VREF − 350 mV). It is internally derived as 0.38 × VCC but may be externally driven to fine-tune noise margins. This pin ensures accurate enable-level detection in DDR memory interfaces without external level-shifting circuitry, and its use is mandatory for compliant SN74CBTLV3857DGVR operation in SSTL_2 systems.
Does the SN74CBTLV3857DGVR support partial-power-down operation?
Yes, the SN74CBTLV3857DGVR supports partial-power-down via its Ioff feature. When VCC is powered down, the switch isolates A and B ports to prevent backflow current, protecting upstream and downstream circuitry. This behavior is verified per JESD 78 Class II latch-up testing and is essential for hot-swap and low-power sleep modes in industrial DDR memory systems using SN74CBTLV3857DGVR.
What is the maximum data rate supported by the SN74CBTLV3857DGVR?
The SN74CBTLV3857DGVR is explicitly designed for 200 Mbit/s double-data-rate (DDR) SDRAM applications, with a maximum propagation delay of 0.25 ns and low on-state resistance (7–13 Ω) that preserves signal integrity at this rate. Its 5-pF OFF-capacitance and rail-to-rail switching further support clean eye diagrams in real-world DDR layouts using SN74CBTLV3857DGVR as a bus switch.
Are the B-port pins of the SN74CBTLV3857DGVR internally pulled down?
Yes, the SN74CBTLV3857DGVR includes internal 10-kΩ pulldown resistors on all B1–B10 pins. This ensures a defined logic-low state when the DDR SDRAM device is unpowered or in high-impedance mode, preventing floating inputs and improving system reliability. These resistors are factory-integrated and require no external components-confirming their presence in every SN74CBTLV3857DGVR unit shipped.
What package type is used for the SN74CBTLV3857DGVR?
The SN74CBTLV3857DGVR uses a 24-pin TVSOP (Thin Very Small Outline Package) with 0.4 mm lead pitch and no exposed thermal pad. This package provides compact footprint and excellent high-frequency performance (θJA = 86°C/W), making it ideal for space-constrained DDR memory modules. The TVSOP-24 pinout matches the flow-through architecture documented in the official SN74CBTLV3857DGVR datasheet.
SN74CBTLV3857DGVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTLV
- Package/Case:
- 24-TFSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Bus Switch
- Circuit:
- 10 x 1:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TVSOP
SN74CBTLV3857DGVR FAQ
1.How can I place an order for SN74CBTLV3857DGVR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CBTLV3857DGVR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of SN74CBTLV3857DGVR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTLV3857DGVR is usually 5 days.
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5.How can I obtain technical support or documentation for SN74CBTLV3857DGVR?
For technical support, including SN74CBTLV3857DGVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV3857DGVR requirements.
6.How does Aetrix verify that SN74CBTLV3857DGVR is sourced from the original manufacturer or authorized distributors?
All SN74CBTLV3857DGVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV3857DGVR meets industry standards.
7.What is the process for return or replacement of SN74CBTLV3857DGVR?
All SN74CBTLV3857DGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV3857DGVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTLV3857DGVR part is unused and in its original packaging.
Return procedure for SN74CBTLV3857DGVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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