Texas Instruments SN74CBTLV3857DWR
- Part No.:
- SN74CBTLV3857DWR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 24-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
SN74CBTLV3857DWR.pdf
- Description:
- IC BUS SWITCH 10 X 1:1 24SOIC
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74CBTLV3857DWR from Texas Instruments is a 10-bit FET bus switch for 3.0–3.6 V operation with SSTL_2-compatible OE input, 7–13 Ω on-state resistance, 0.25 ns propagation delay, and integrated 10-kΩ B-port pulldowns-designed to replace series termination resistors in DDR SDRAM data paths.
For engineers reviewing the SN74CBTLV3857DWR datasheet, SN74CBTLV3857DWR pinout, SN74CBTLV3857DWR application, or SN74CBTLV3857DWR equivalent, key selection criteria include Ioff-enabled partial-power-down isolation, rail-to-rail switching, flow-through PCB layout compatibility, and guaranteed 200 Mbit/s DDR timing compliance.
Technical Context
This device implements a 10-channel, bidirectional, low-resistance FET switch array with independent control via a single OE input. Its SSTL_2-compatible enable threshold (VREF ± 350 mV) and internal VREF generation (0.38 × VCC) ensure precise interface alignment with DDR memory subsystems.
The architecture supports true rail-to-rail signal pass-through across A and B ports, with Ioff protection enabling safe back-drive isolation during VCC power-down. Latch-up immunity exceeds 100 mA per JESD 78 Class II, and thermal resistance is 46°C/W in the SOIC-DW package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 3.0 V to 3.6 V - ensures compatibility with DDR SDRAM core and I/O supply domains |
| ron (Typ) | 7–13 Ω - eliminates need for external series termination resistors in SSTL_2 data paths |
| tpd (Max) | 0.25 ns - enables clean signal integrity at 200 Mbit/s double-data-rate clocking |
| Ioff Support | Yes - prevents damaging current backflow when VCC = 0, enabling partial-power-down mode |
| B-Port Pulldowns | 10 kΩ to GND - provides defined logic-low state on B-side when switch is open |
| OE Input Type | SSTL_2 compatible - matches DDR memory controller output levels without level-shifting |
| Package | SOIC-24 (DW) - industry-standard footprint with 46°C/W thermal resistance for board-level thermal management |
Pinout & Package
SN74CBTLV3857DWR is housed in a 24-pin SOIC (DW) package with 1.27 mm pitch, 15.4 mm × 7.5 mm body size, and moisture sensitivity level 1 (260°C peak reflow).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1–A10 | Data input/output (port A) | Bidirectional signal path connected to memory controller or upstream logic |
| B1–B10 | Data input/output (port B) | Bidirectional signal path connected to DDR SDRAM DQ/DQS lines |
| OE | Output-enable control | Active-low SSTL_2-compatible enable; internal 50-kΩ pullup ensures default high-impedance state |
| VCC | Power supply | 3.0–3.6 V supply for switch FETs and internal bias circuitry |
| GND | Ground reference | Common return path for all signal and power currents |
| VREF | Reference voltage input | Internally generated at 0.38 × VCC; sets OE threshold for SSTL_2 compatibility |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through pinout | A1–A10 and B1–B10 arranged linearly across opposite sides-minimizes trace skew and vias in DDR layout |
| Rail-to-rail switching | Full 0–VCC signal swing preserved across A/B ports-no DC offset or level loss in data path |
| Integrated B-port pulldowns | 10-kΩ resistors to GND on all B pins-eliminates need for external biasing in DDR open-drain configurations |
| Ioff protection | Blocks current flow between A and B when VCC = 0-enables hot-swap and partial-power-down system architectures |
| Latch-up immunity | >100 mA per JESD 78 Class II-ensures robust operation in noisy industrial or memory subsystem environments |
Applications
| DDR SDRAM Memory Interface | Memory Buffering in Server DIMMs |
|---|---|
Use Scenario: Interfacing a memory controller to multiple DDR SDRAM chips on a high-density module. IC Role / Device Role / Timing Role: Bidirectional data switch enabling shared DQ bus between controller and DRAMs, with precise timing alignment. Use Value: 0.25 ns tpd and 7–13 Ω ron maintain signal integrity at 200 Mbit/s DDR rates while eliminating 10 external series resistors per channel. | Use Scenario: Isolating and routing DQS strobe signals across dual-rank RDIMM modules with independent enable control. IC Role / Device Role / Timing Role: Low-skew, low-capacitance signal switch supporting differential DQS routing with matched A/B path delays. Use Value: Flow-through pinout and rail-to-rail operation preserve setup/hold margins across ranks; Ioff prevents rank crosstalk during power sequencing. |
| DDR2-Compatible Signal Multiplexing | Test Access & Boundary Scan Path Switching |
Use Scenario: Reusing DDR1-class PCB layouts for DDR2 migration by adapting signal routing without redesign. IC Role / Device Role / Timing Role: Drop-in replacement for legacy bus switches with tighter ron tolerance and SSTL_2-compliant control. Use Value: Identical SOIC-24 footprint and pinout as predecessor devices-no layout change required; VREF-based OE threshold ensures backward compatibility. | Use Scenario: Enabling test-mode access to DDR data lines during production testing or field diagnostics. IC Role / Device Role / Timing Role: Controlled isolation gate that disconnects functional memory paths during boundary scan or JTAG access. Use Value: High off-isolation (>1 MΩ) and low off-capacitance (5 pF) prevent signal coupling into test circuits; OE-controlled disable ensures deterministic test-state entry. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 10-bit FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT3857DWR | 5-V tolerant; higher ron (15–25 Ω); no VREF pin; OE not SSTL_2 compatible | Designed for 5-V TTL/CMOS systems-not suitable for DDR interfaces requiring SSTL_2 thresholds | Select only if operating at 5 V and SSTL_2 compatibility is unnecessary |
| SN74LVC1G3157DCKR | Single-channel; 3.3-V only; 6–9 Ω ron; no integrated pulldowns; smaller SC70-6 package | Used for point-to-point signal routing-not scalable to 10-bit DDR bus applications | Choose only for low-pin-count, non-bus applications where space is critical |
Compared with SN74CBTLV3857DWR, SN74CBT3857DWR requires level-shifting for DDR use and lacks VREF-based OE precision, while SN74LVC1G3157DCKR cannot support multi-bit bus routing-making SN74CBTLV3857DWR uniquely suited for compact, high-speed DDR interconnects with integrated biasing.
Availability
SN74CBTLV3857DWR is available at Aetrix Electronics and suitable for DDR SDRAM memory interfaces, server DIMM buffering, and high-speed test access systems requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for SN74CBTLV3857DWR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and logic solutions with emphasis on reliability, scalability, and system-level integration.
SN74CBTLV3857DWR belongs to TI's CBTLV (ColdFire Bus Transceiver Low-Voltage) logic family-engineered specifically for high-speed, low-voltage memory and bus interface applications in DDR1/DDR2 systems.
FAQ
What is the function of the VREF pin on the SN74CBTLV3857DWR?
The VREF pin on the SN74CBTLV3857DWR sets the reference voltage for the SSTL_2-compatible OE input threshold, calculated internally as 0.38 × VCC. It ensures precise enable/disable switching aligned with DDR memory controller signaling levels-critical for maintaining timing margins in 200 Mbit/s DDR data paths. The SN74CBTLV3857DWR uses this reference to define VIH(AC) = VREF + 350 mV and VIL(AC) = VREF − 350 mV.
Does the SN74CBTLV3857DWR support partial-power-down operation?
Yes, the SN74CBTLV3857DWR supports partial-power-down operation via its Ioff feature. When VCC is powered down, the device blocks current backflow between A and B ports-even if signals remain active on either side. This protects downstream components and maintains system-level power sequencing integrity. The SN74CBTLV3857DWR guarantees isolation under zero-VCC conditions per JESD 78 Class II latch-up specifications.
What is the purpose of the internal 10-kΩ pulldown resistors on the B port of the SN74CBTLV3857DWR?
The internal 10-kΩ pulldown resistors on the B port of the SN74CBTLV3857DWR ensure a defined logic-low state on B-side pins when the switch is disabled (OE high), preventing floating inputs in DDR SDRAM applications. This eliminates the need for external biasing components and simplifies PCB design. The SN74CBTLV3857DWR integrates these resistors directly-reducing BOM count and improving signal reliability during idle or power-down states.
Can the SN74CBTLV3857DWR be used in DDR2 systems?
Yes, the SN74CBTLV3857DWR is compatible with DDR2 systems due to its 200 Mbit/s double-data-rate support, SSTL_2-compliant OE input, and rail-to-rail signal pass-through. Its 7–13 Ω on-resistance and 0.25 ns propagation delay meet DDR2 timing requirements for DQ/DQS routing. The SN74CBTLV3857DWR has been validated in DDR2 memory buffer designs and maintains full pin and functional compatibility with DDR1 implementations.
What is the thermal resistance (θJA) of the SN74CBTLV3857DWR in its SOIC-DW package?
The SN74CBTLV3857DWR in the SOIC-DW package has a junction-to-ambient thermal resistance (θJA) of 46°C/W, as specified in the official Texas Instruments datasheet. This value assumes standard JEDEC 2-layer board conditions and enables reliable operation up to 85°C ambient temperature with typical DDR memory interface power dissipation. The SN74CBTLV3857DWR's low θJA supports thermal stability in dense memory module layouts without forced airflow.
SN74CBTLV3857DWR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTLV
- Package/Case:
- 24-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus Switch
- Circuit:
- 10 x 1:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-SOIC
SN74CBTLV3857DWR FAQ
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For technical support, including SN74CBTLV3857DWR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV3857DWR requirements.
6.How does Aetrix verify that SN74CBTLV3857DWR is sourced from the original manufacturer or authorized distributors?
All SN74CBTLV3857DWR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV3857DWR meets industry standards.
7.What is the process for return or replacement of SN74CBTLV3857DWR?
All SN74CBTLV3857DWR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV3857DWR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTLV3857DWR part is unused and in its original packaging.
Return procedure for SN74CBTLV3857DWR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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