Texas Instruments SN74CBTLV3861DBQR

Overview

SN74CBTLV3861DBQR from Texas Instruments is a 10-bit high-speed bus switch IC with 5-Ω on-state resistance, rail-to-rail signal switching, and I_off partial-power-down support. It operates from 2.3 V to 3.6 V and delivers sub-nanosecond propagation delay (0.15 ns typ at 2.5 V), enabling low-latency interconnect in memory expansion, FPGA I/O bridging, and hot-swap data path isolation.

For engineers reviewing the SN74CBTLV3861DBQR datasheet, SN74CBTLV3861DBQR pinout, SN74CBTLV3861DBQR application, or SN74CBTLV3861DBQR equivalent, key selection criteria include guaranteed 5 Ω r_on at 2.5 V/3.3 V, 10 µA I_off leakage at V_CC = 0 V, flow-through pinout for PCB layout optimization, and JESD78 Class II latch-up immunity.

Technical Context

This device implements a 10-bit bidirectional analog switch architecture with independent A/B port connectivity controlled by a single active-low OE input. Its CMOS transmission-gate design enables rail-to-rail voltage transfer without level shifting, supporting both digital and analog signal pass-through up to 3.6 V.

The I_off feature actively blocks current backflow when V_CC = 0 V, ensuring system-level isolation during partial power-down sequences. Latch-up immunity exceeds 100 mA per JESD 78 Class II, and the flow-through package layout minimizes trace crosstalk and stub length in high-speed routing.

Key Specifications

Pinout & Package

SN74CBTLV3861DBQR is housed in a 24-pin SSOP (DBQ) package with 0.65 mm pitch, 7.9 mm × 6.2 mm body size, and 1.2 mm maximum height. The flow-through pin arrangement places A1–A10 on pins 2–11, B1–B10 on pins 14–23, OE on pin 13, V_CC on pin 12, and GND on pin 11 - minimizing PCB trace length and skew between corresponding A/B pairs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Compared with SN74CBTLV3245DBQR and SN74CBT3245DBQR, SN74CBTLV3861DBQR uniquely delivers 10-bit width with I_off-enabled partial-power-down safety and 2.3–3.6 V operation - making it the sole option for modern low-voltage, high-density bus isolation where bit count and power sequencing integrity are jointly critical.

Availability

SN74CBTLV3861DBQR is available at Aetrix Electronics and suitable for memory expansion interfaces, FPGA I/O bridging, hot-swap backplane interconnects, and PCIe lane multiplexing requiring stable component supply, long-term industrial lifecycle support, and RoHS-compliant packaging.

Supply support for SN74CBTLV3861DBQR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of expertise in high-speed interface ICs and industrial-grade reliability.

The SN74CBTLV3861DBQR belongs to TI's CBTLV (ColdBond™ Low-Voltage) logic family, engineered specifically for low-voltage, high-bandwidth bus switching in space-constrained, thermally demanding applications such as networking equipment and programmable logic systems.

FAQ

What is the maximum continuous current rating per channel for SN74CBTLV3861DBQR?

The SN74CBTLV3861DBQR supports a continuous channel current of 128 mA per switch path. This rating is validated under thermal conditions defined in the absolute maximum ratings table and ensures reliable operation without derating when used within the recommended 2.3 V–3.6 V supply range and −40°C to +85°C ambient temperature. Exceeding this current may cause thermal runaway or permanent damage to the SN74CBTLV3861DBQR.

Does SN74CBTLV3861DBQR support true bidirectional signal flow without direction control pins?

Yes, SN74CBTLV3861DBQR provides fully bidirectional analog switching between A and B ports with no direction pin required. Its transmission-gate architecture allows signals to pass equally well from A to B or B to A when OE is low. This eliminates timing-critical direction control logic and simplifies PCB routing - a core design advantage confirmed in the functional table and logic diagram of the SN74CBTLV3861DBQR datasheet.

How should the OE pin be handled during power-up to prevent undefined states on SN74CBTLV3861DBQR?

To ensure high-impedance state at power-up, OE on SN74CBTLV3861DBQR must be tied to V_CC through an external pullup resistor. TI specifies the minimum resistor value based on the current-sinking capability of the driving source - typically 10 kΩ suffices for most microcontroller GPIOs. Leaving OE floating or uncontrolled risks unintended conduction and potential bus contention, which is explicitly warned against in the SN74CBTLV3861DBQR datasheet.

Is SN74CBTLV3861DBQR compatible with 1.8 V logic systems?

No, SN74CBTLV3861DBQR is not rated for 1.8 V operation. Its recommended supply range is strictly 2.3 V to 3.6 V, and its input thresholds (VIH = 1.7 V min at V_CC = 2.3 V) do not guarantee reliable recognition of 1.8 V logic highs. Attempting to operate SN74CBTLV3861DBQR below 2.3 V may result in increased r_on, timing violations, or functional failure. For 1.8 V systems, consider TI's SN74AVC series instead.

What is the thermal resistance (θ_JA) of the SN74CBTLV3861DBQR in its DBQ package?

The junction-to-ambient thermal resistance (θ_JA) for SN74CBTLV3861DBQR in the DBQ package is 61°C/W, as specified in the absolute maximum ratings table. This value assumes standard JEDEC test board conditions (2-layer board, 1-in² copper). Actual thermal performance depends on PCB layout - adding thermal vias under the exposed pad (if present) and increasing copper area can reduce effective θ_JA by up to 20°C/W in optimized designs.