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Home > Products > Integrated Circuits (ICs) > Logic > Signal Switches, Multiplexers, Decoders

Texas Instruments SN74CBTLV3861DW

Name: SN74CBTLV3861DW
Brand: Texas Instruments
SKU: SN74CBTLV3861DW
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: SN74CBTLV3861DW

Manufacturer:: Texas Instruments

Category:: Signal Switches, Multiplexers, Decoders

Package:: 24-SOIC (0.295", 7.50mm Width)

Datasheet:: SN74CBTLV3861DW.pdf

Description:: IC BUS SWITCH 10 X 1:1 24SOIC

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Product details

Overview

SN74CBTLV3861DW from Texas Instruments is a 10-bit high-speed bus switch IC with 5-Ω on-state resistance, rail-to-rail switching capability, and I_off partial-power-down support. It operates from 2.3 V to 3.6 V and delivers sub-nanosecond propagation delay (0.15 ns typical at 2.5 V), enabling low-latency data routing in memory expansion, FPGA I/O bridging, and hot-swap peripheral interfaces.

For engineers reviewing the SN74CBTLV3861DW datasheet, SN74CBTLV3861DW pinout, SN74CBTLV3861DW application, or SN74CBTLV3861DW equivalent, key selection criteria include guaranteed 5-Ω r_on across voltage range, flow-through SOIC-24 layout optimization, isolation during power-off, and latch-up immunity exceeding 100 mA per JESD 78 Class II.

Technical Context

The SN74CBTLV3861DW implements ten independent bilateral FET switches controlled by a single active-low OE input. Its flow-through architecture places A1–A10 and B1–B10 on opposite sides of the SOIC-24 package, minimizing trace crossovers and parasitic capacitance.

Each switch features rail-to-rail conduction with no level-shifting-supporting bidirectional signal integrity for 3.3-V and 2.5-V logic families. The I_off specification (≤10 µA at V_CC = 0 V) ensures robust backflow prevention when upstream/downstream rails are powered independently.

Key Specifications

Parameter	Value and Actual Design Meaning
On-state resistance (r_on)	5 Ω typical at V_CC = 2.5 V, VI = 0 V, II = 24 mA - enables minimal voltage drop and signal distortion in high-speed data paths.
Propagation delay (t_pd)	0.15 ns min / 0.25 ns max at V_CC = 2.5 V - supports >1 GHz effective switching rates without timing budget penalty.
Supply voltage range	2.3 V to 3.6 V - compatible with both 2.5-V and 3.3-V system domains without external level translation.
I_off current	≤10 µA at V_CC = 0 V, VI/VO = 0–3.6 V - prevents damaging back-current during partial power-down sequences.
Input capacitance (C_i)	3 pF - reduces loading on driving logic and preserves edge rate in dense PCB layouts.
Latch-up immunity	>100 mA per JESD 78 Class II - ensures robust operation in noisy industrial or hot-plug environments.

Pinout & Package

SN74CBTLV3861DW uses a 24-pin SOIC (DW) package with 300-mil body width, 1.27-mm lead pitch, and flow-through pin arrangement optimized for straight PCB trace routing. Thermal resistance θ_JA is 46°C/W.

Pin/Terminal	Circuit Role	Design Meaning
1, 24	No-connect (NC)	Internally unconnected; must remain floating or grounded per layout best practice - no electrical function.
2–11 (A1–A10)	Port A data terminal	Bidirectional input/output node for first bus segment; electrically identical to corresponding B pin when switch enabled.
12	GND	Power ground reference for all internal circuitry and switch FET substrates.
13	V_CC	Positive supply input (2.3–3.6 V); powers internal control logic and switch bias networks.
14	OE	Active-low output enable; drives all ten switches simultaneously - low = connect A↔B, high = high-Z isolation.
15–23 (B1–B10)	Port B data terminal	Bidirectional input/output node for second bus segment; mirrors A-side behavior under OE control.

Key Features

Feature	Design Value
Rail-to-rail analog switching	Supports full 0–V_CC signal swing on both A and B ports - preserves logic high/low margins across voltage domains.
Flow-through pinout	A1–A10 on left side, B1–B10 on right side - eliminates layer jumps and vias in 2-layer PCB designs.
I_off partial-power-down protection	Blocks current flow when V_CC = 0 V - enables safe insertion/removal of live backplane cards or daughterboards.
Low 5-Ω on-resistance	Minimizes RC time constant with 30-pF load - maintains signal integrity up to 500 Mbps without equalization.
JESD 78 Class II latch-up immunity	Withstands ≥100 mA transient injection - meets industrial reliability requirements without external protection diodes.

Applications

Memory Expansion Interface	FPGA I/O Bridging
Use Scenario: Expanding DRAM address/data bus between controller and additional memory modules in embedded systems. IC Role / Device Role / Timing Role: Bidirectional bus switch isolating secondary memory banks during access arbitration; enables dynamic bank enable without signal contention. Use Value: 5-Ω r_on and 0.15-ns t_pd preserve setup/hold timing margins across 16-bit wide DDR2-compatible paths.	Use Scenario: Interfacing heterogeneous I/O standards (e.g., LVCMOS25 ↔ LVCMOS33) between FPGA and peripheral ASICs. IC Role / Device Role / Timing Role: Voltage-transparent signal router enabling protocol-agnostic data transfer without level shifters or delay penalties. Use Value: Rail-to-rail conduction and 3-pF C_i maintain signal fidelity across 100-MHz parallel buses with <100-ps skew.
Hot-Swap Peripheral Hub	Test Access Multiplexer
Use Scenario: Enabling safe insertion/removal of USB or PCIe add-in cards while main system remains powered. IC Role / Device Role / Timing Role: Isolation switch placed between host controller and peripheral slot; OE controlled by power-good sequencer. Use Value: I_off ≤10 µA prevents backfeed into unpowered peripherals - eliminates risk of damage during hot-plug events.	Use Scenario: Sharing JTAG or boundary-scan test signals among multiple ASICs on a shared board. IC Role / Device Role / Timing Role: Multiplexed signal path selector allowing one test controller to access individual device TAP controllers sequentially. Use Value: Sub-nanosecond t_pd and high-Z isolation between selections ensure deterministic scan chain timing and prevent signal leakage.

Memory Expansion Interface

FPGA I/O Bridging

Use Scenario: Expanding DRAM address/data bus between controller and additional memory modules in embedded systems.

IC Role / Device Role / Timing Role: Bidirectional bus switch isolating secondary memory banks during access arbitration; enables dynamic bank enable without signal contention.

Use Value: 5-Ω r_on and 0.15-ns t_pd preserve setup/hold timing margins across 16-bit wide DDR2-compatible paths.

Use Scenario: Interfacing heterogeneous I/O standards (e.g., LVCMOS25 ↔ LVCMOS33) between FPGA and peripheral ASICs.

IC Role / Device Role / Timing Role: Voltage-transparent signal router enabling protocol-agnostic data transfer without level shifters or delay penalties.

Use Value: Rail-to-rail conduction and 3-pF C_i maintain signal fidelity across 100-MHz parallel buses with <100-ps skew.

Hot-Swap Peripheral Hub

Test Access Multiplexer

Use Scenario: Enabling safe insertion/removal of USB or PCIe add-in cards while main system remains powered.

IC Role / Device Role / Timing Role: Isolation switch placed between host controller and peripheral slot; OE controlled by power-good sequencer.

Use Value: I_off ≤10 µA prevents backfeed into unpowered peripherals - eliminates risk of damage during hot-plug events.

Use Scenario: Sharing JTAG or boundary-scan test signals among multiple ASICs on a shared board.

IC Role / Device Role / Timing Role: Multiplexed signal path selector allowing one test controller to access individual device TAP controllers sequentially.

Use Value: Sub-nanosecond t_pd and high-Z isolation between selections ensure deterministic scan chain timing and prevent signal leakage.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74CBTLV3861DWR	Identical electrical specs and pinout; supplied in tape-and-reel (2000 pcs) vs. tube (25 pcs) packaging.	No functional difference - selected for automated SMT assembly instead of manual prototyping.	Choose DWR for volume production; DW for evaluation or low-volume builds.
SN74CBTLV3861PWR	TSSOP-24 package (4.4 mm width); 6.95-mm A0 cavity vs. DW's 10.75 mm - requires different land pattern and stencil design.	Same r_on, t_pd, and I_off; smaller footprint suits space-constrained portable designs but increases thermal resistance (θ_JA = 88°C/W).	Select PWR only when board area is critical and thermal margin allows higher junction temperature rise.

Compared with SN74CBTLV3861DWR and SN74CBTLV3861PWR, the SN74CBTLV3861DW offers optimal thermal performance (θ_JA = 46°C/W) and mechanical robustness for manual handling and rework, making it preferred for development, qualification, and medium-volume industrial deployments where thermal headroom and assembly flexibility are prioritized.

Availability

SN74CBTLV3861DW is available at Aetrix Electronics and suitable for memory expansion interfaces, FPGA I/O bridging, hot-swap peripheral hubs, test access multiplexers, and industrial backplane interconnects requiring stable component supply and long-term manufacturability.

Supply support for SN74CBTLV3861DW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on reliability, precision, and energy efficiency.

The SN74CBTLV3861DW belongs to TI's CBTLV (Crossbar Bus Transceiver Low-Voltage) family, engineered for high-speed, low-distortion signal routing in mixed-voltage digital systems where timing integrity and power sequencing safety are critical.

FAQ

What is the maximum operating frequency supported by the SN74CBTLV3861DW?

The SN74CBTLV3861DW does not specify a maximum clock frequency, as it is an analog bus switch-not a clocked device. Its 0.15-ns typical propagation delay and 5-Ω r_on support clean signal transmission up to 500 Mbps in parallel bus applications. Actual usable data rate depends on trace length, load capacitance, and driver strength, but the SN74CBTLV3861DW itself introduces negligible timing uncertainty.

Can the SN74CBTLV3861DW be used for bidirectional level shifting between 2.5 V and 3.3 V domains?

No-the SN74CBTLV3861DW is a passive analog switch with rail-to-rail conduction, not a level shifter. It passes signals transparently within its V_CC range (2.3–3.6 V), so both A and B ports must operate at the same voltage domain. For true level translation, use dedicated devices like TXB0108 or SN74AVCH series, not the SN74CBTLV3861DW.

How should the OE pin be driven to ensure proper power-up behavior of the SN74CBTLV3861DW?

To guarantee high-impedance state during power-up, OE must be held high (V_CC) until V_CC stabilizes. TI recommends tying OE to V_CC via a pullup resistor; minimum value is determined by the current-sinking capability of the controlling driver. Do not leave OE floating-uncontrolled states may cause bus contention. This requirement applies specifically to the SN74CBTLV3861DW and all variants in the family.

Does the SN74CBTLV3861DW support hot-plug operation with powered-backplane insertion?

Yes-the SN74CBTLV3861DW supports hot-plug via its I_off feature: when V_CC = 0 V, leakage current is limited to ≤10 µA even if A or B pins are biased to 3.6 V. This prevents damaging back-current flow during live insertion. However, OE must be held high (isolated) during insertion, and system-level sequencing must ensure SN74CBTLV3861DW V_CC ramps after signal rails stabilize.

Is there a pin-compatible automotive-grade version of the SN74CBTLV3861DW?

Yes-the SN74CBTLV3861-Q1 is the AEC-Q100 qualified automotive variant. It shares identical pinout, electrical specifications, and SOIC-24 (DW) package with the SN74CBTLV3861DW but is tested for extended temperature range (−40°C to +125°C), enhanced reliability, and zero-defect manufacturing. No PCB redesign is needed to migrate from SN74CBTLV3861DW to SN74CBTLV3861-Q1 in automotive applications.

SN74CBTLV3861DW Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: 74CBTLV

Package/Case:: 24-SOIC (0.295", 7.50mm Width)

Packaging:: Bulk

Product Status:: Active

Type:: Bus Switch

Circuit:: 10 x 1:1

Independent Circuits:: 1

Current - Output High, Low:: -

Voltage Supply Source:: Single Supply

Voltage - Supply:: 2.3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 24-SOIC

SN74CBTLV3861DW FAQ

1.How can I place an order for SN74CBTLV3861DW through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74CBTLV3861DW on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74CBTLV3861DW reliable?

The price and inventory of SN74CBTLV3861DW are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTLV3861DW is usually 5 days.

3.What payment methods are accepted for SN74CBTLV3861DW?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74CBTLV3861DW transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SN74CBTLV3861DW?

SN74CBTLV3861DW orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74CBTLV3861DW order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74CBTLV3861DW?

For technical support, including SN74CBTLV3861DW datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV3861DW requirements.

6.How does Aetrix verify that SN74CBTLV3861DW is sourced from the original manufacturer or authorized distributors?

All SN74CBTLV3861DW products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV3861DW meets industry standards.

7.What is the process for return or replacement of SN74CBTLV3861DW?

All SN74CBTLV3861DW units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV3861DW, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74CBTLV3861DW part is unused and in its original packaging.

Return procedure for SN74CBTLV3861DW:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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