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Texas Instruments SN74CBTLV3861NSR

Part No.:
SN74CBTLV3861NSR
Manufacturer:
Texas Instruments
Category:
Signal Switches, Multiplexers, Decoders
Package:
24-SOIC (0.209", 5.30mm Width)
Datasheet:
AetrixSN74CBTLV3861NSR.pdf
Description:
IC FET BUS SWITCH LV 10BIT 24SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,798

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Product details

Overview

SN74CBTLV3861NSR from Texas Instruments is a 10-bit high-speed bus switch IC with 5-Ω on-state resistance, rail-to-rail data I/O switching, and Ioff support for partial-power-down mode operation. It enables bidirectional signal routing between two ports (A and B) under OE control and is used in low-latency memory expansion, FPGA I/O bridging, and hot-swap-capable backplane interfaces.

For engineers reviewing the SN74CBTLV3861NSR datasheet, SN74CBTLV3861NSR pinout, SN74CBTLV3861NSR application, or SN74CBTLV3861NSR equivalent, key selection criteria include on-resistance consistency across VCC = 2.3–3.6 V, sub-0.25 ns propagation delay at 3.3 V, Ioff leakage ≤10 µA during power-off, flow-through pin architecture for PCB layout optimization, and latch-up immunity exceeding 100 mA per JESD 78 Class II.

Technical Context

This device implements ten independent FET-based bilateral analog switches in a single SOP-24 package, each controlled by a common OE input. Its rail-to-rail switching supports logic levels from 0 V to VCC, and the Ioff feature actively blocks current backflow when VCC = 0 V while maintaining high-impedance isolation between A and B ports.

The flow-through pinout places A1–A10 on one side and B1–B10 on the opposite side, minimizing trace crossovers. OE and VCC/GND are positioned to allow pull-up resistor termination for power-up/power-down high-impedance safety, and all unused inputs must be tied to VCC or GND per TI SCBA004 guidance.

Key Specifications

Parameter Value and Actual Design Meaning
On-state resistance (ron) 5 Ω typical at VCC = 3 V, enabling minimal voltage drop (<150 mV at 30 mA) and preserving signal integrity in high-speed digital paths.
Propagation delay (tpd) 0.15–0.25 ns at VCC = 3.3 V, ensuring sub-nanosecond timing alignment critical for DDR memory bus extensions and FPGA I/O expansion.
Ioff leakage ≤10 µA at VCC = 0 V and VI/VO = 0–3.6 V, preventing damaging back-current during partial power-down in mixed-voltage systems.
VCC operating range 2.3 V to 3.6 V, compatible with 2.5 V and 3.3 V logic families without level-shifting circuitry.
Input capacitance (Ci) 3 pF per control input, reducing capacitive loading on upstream drivers and supporting >100 MHz toggle rates.
Latch-up immunity Exceeds 100 mA per JESD 78 Class II, eliminating risk of destructive latch-up in industrial and telecom environments.
Package thermal resistance (θJA) 65°C/W for NS package, enabling stable operation up to 85°C ambient without forced airflow in compact board layouts.

Pinout & Package

SOP-24 (NS) package, 15.4 mm × 7.5 mm body, 1.0 mm max height, 0.65 mm lead pitch, RoHS-compliant NiPdAu finish, MSL Level-1 (260°C peak reflow, unlimited floor life).

Pin/Terminal Circuit Role Design Meaning
1, 24 No internal connection (NC) Unused pins; must remain unconnected to avoid parasitic coupling or mechanical stress on leads.
2–11 A1–A10 Port A data terminals; bidirectional I/O nodes connected directly to switch FET sources.
12 GND Power ground reference for internal circuitry and switch substrate biasing.
13 VCC Supply voltage input (2.3–3.6 V); decoupling capacitor (0.1 µF) required within 5 mm.
14 OE Active-low output enable; must be pulled up to VCC via external resistor to ensure high-Z state during power transitions.
15–23 B1–B10 Port B data terminals; bidirectional I/O nodes connected directly to switch FET drains.

Key Features

Feature Design Value
Rail-to-rail analog switching Supports 0 V to VCC signal swing without distortion, enabling direct interface with 2.5 V/3.3 V LVTTL, LVCMOS, and GTL buses.
Flow-through pin architecture A1–A10 and B1–B10 arranged on opposing sides to eliminate layer jumps and reduce crosstalk in dense PCB routing.
Ioff partial-power-down protection Blocks reverse current flow when VCC is off, allowing safe hot insertion/removal in modular backplanes and server DIMM slots.
Low on-capacitance (Cio(OFF)) 5 pF at OE = VCC, minimizing signal degradation and reflections on high-frequency data lines.
Sub-1 ns total enable/disable timing ten ≤ 4.9 ns and tdis ≤ 5.8 ns at VCC = 3.3 V, enabling precise windowing for burst-mode memory access and test instrumentation.

Applications

Memory Expansion Interface FPGA I/O Bridging

Use Scenario: Extending address/data bus width between microcontroller and parallel NOR flash or SRAM.

IC Role / Device Role / Timing Role: Bidirectional 10-bit bus switch enabling dynamic routing without direction control logic.

Use Value: Eliminates need for discrete transceivers or direction pins, reducing BOM count and PCB area by 30% versus dual 74LVC245 implementation.

Use Scenario: Isolating FPGA configuration I/O banks from shared system buses during reconfiguration.

IC Role / Device Role / Timing Role: High-speed, low-latency gate for controlling data path access during partial reconfiguration cycles.

Use Value: Enables <10 ns isolation window, preventing metastability and bus contention during bitstream reload sequences.

Hot-Swap Backplane Slot Test Instrumentation Signal Routing

Use Scenario: Providing isolated signal paths in modular telecom line cards that support live insertion/removal.

IC Role / Device Role / Timing Role: Power-fail-safe bus switch maintaining high-Z state during VCC ramp-up/down sequences.

Use Value: Prevents backfeeding into powered-down modules, satisfying GR-1089-CORE ESD and surge immunity requirements.

Use Scenario: Multiplexing calibration signals between DUT and precision ADC/DAC channels in automated test equipment.

IC Role / Device Role / Timing Role: Low-ron, low-Ci analog switch preserving signal fidelity in 100+ MHz RF and timing measurement paths.

Use Value: Delivers <0.01% gain error and <1 ps jitter contribution, meeting IEEE 1149.4 boundary-scan accuracy targets.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74CBT3245APW 8-bit, 3.3 V only, ron = 5.5 Ω typical, no Ioff support, TSSOP-24 package. Lacks partial-power-down capability; unsuitable for hot-swap or mixed-voltage domains requiring VCC = 0 V isolation. Select when only 8-bit width and fixed 3.3 V operation are needed, and power sequencing is fully controlled.
SN74LVC1G3157DBVR Single-pole double-throw (SPDT), ron = 6 Ω typical, VCC = 1.65–5.5 V, SOT-23-6 package. Not scalable to 10-bit parallel operation; requires 10 discrete units plus OE logic for functional equivalence. Choose for point-to-point analog/digital signal routing where space constraints preclude SOP-24 footprint.

Compared with SN74CBTLV3861NSR, SN74CBT3245APW offers identical speed but lacks Ioff and voltage flexibility, while SN74LVC1G3157DBVR provides wider VCC range but incurs 3× board area and routing complexity for 10-bit use - making SN74CBTLV3861NSR optimal for integrated, power-aware parallel bus switching.

Availability

SN74CBTLV3861NSR is available at Aetrix Electronics and suitable for memory expansion interfaces, FPGA I/O bridging, hot-swap backplane slots, and test instrumentation signal routing requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.

Supply support for SN74CBTLV3861NSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability IC design and manufacturing.

The SN74CBTLV3861NSR belongs to TI's CBTLV family of low-voltage bus switches, engineered specifically for high-speed, low-power, and power-aware digital interconnect in computing, communications, and industrial control systems.

FAQ

What is the maximum continuous current rating per channel for the SN74CBTLV3861NSR?

The SN74CBTLV3861NSR supports a continuous channel current of 128 mA per switch, verified under absolute maximum ratings. This allows reliable operation at 30–50 mA typical drive levels in memory and FPGA bus applications without thermal derating at 85°C ambient. The device maintains specified ron and timing performance within this limit.

Does the SN74CBTLV3861NSR require external pull-up resistors on the OE pin?

Yes - to ensure high-impedance state during power-up or power-down, OE must be tied to VCC through an external pull-up resistor. The minimum value depends on the driver's current-sinking capability, as specified in the TI application report SCBA004. For standard 3.3 V systems, a 10 kΩ resistor is commonly used and validated in TI reference designs.

Can the SN74CBTLV3861NSR operate with a 2.5 V supply and interface with 3.3 V logic signals?

Yes - the SN74CBTLV3861NSR operates across VCC = 2.3 V to 3.6 V and supports rail-to-rail switching. At VCC = 2.5 V, it safely passes 3.3 V-tolerant signals on A/B ports because its absolute maximum input voltage is 4.6 V, and its Ioff protection remains active even when VCC is below applied signal levels.

Is the SN74CBTLV3861NSR pin-compatible with other packages in the same family?

No - the SN74CBTLV3861NSR uses the SOP-24 (NS) package with specific pinout and thermal characteristics. While functionally identical to SN74CBTLV3861DWR (SOIC-24) and SN74CBTLV3861PWR (TSSOP-24), mechanical compatibility requires separate footprint validation due to differing lead pitch (0.65 mm vs. 1.27 mm), body dimensions, and solder mask requirements per IPC-7351.

What is the latch-up immunity specification for the SN74CBTLV3861NSR?

The SN74CBTLV3861NSR exceeds 100 mA latch-up immunity per JESD 78 Class II, verified by TI through standardized stress testing. This ensures robust operation in electrically noisy environments such as industrial motor drives and telecom base stations where transient-induced latch-up could otherwise cause system lockup or permanent damage.

SN74CBTLV3861NSR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74CBTLV
Package/Case:
24-SOIC (0.209", 5.30mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Bus Switch
Circuit:
10 x 1:1
Independent Circuits:
1
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
2.3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-SO

SN74CBTLV3861NSR FAQ

1.How can I place an order for SN74CBTLV3861NSR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74CBTLV3861NSR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74CBTLV3861NSR reliable?

The price and inventory of SN74CBTLV3861NSR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTLV3861NSR is usually 5 days.

3.What payment methods are accepted for SN74CBTLV3861NSR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74CBTLV3861NSR transactions.

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4.How is shipping managed for SN74CBTLV3861NSR?

SN74CBTLV3861NSR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74CBTLV3861NSR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74CBTLV3861NSR?

For technical support, including SN74CBTLV3861NSR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTLV3861NSR requirements.

6.How does Aetrix verify that SN74CBTLV3861NSR is sourced from the original manufacturer or authorized distributors?

All SN74CBTLV3861NSR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTLV3861NSR meets industry standards.

7.What is the process for return or replacement of SN74CBTLV3861NSR?

All SN74CBTLV3861NSR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLV3861NSR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74CBTLV3861NSR part is unused and in its original packaging.

Return procedure for SN74CBTLV3861NSR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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