Texas Instruments SN74CBTLVR16292DL
- Part No.:
- SN74CBTLVR16292DL
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- -
- Datasheet:
-
SN74CBTLVR16292DL.pdf
- Description:
- MUX AND DEMUX/DECODER
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Product details
Overview
SN74CBTLVR16292DL from Texas Instruments is a 12-bit 1-of-2 high-speed FET multiplexer/demultiplexer in SSOP-56 package, featuring rail-to-rail switching, 25-Ω integrated series resistors on all I/O ports, make-before-break operation, and Ioff partial-power-down support. It enables low-propagation-delay signal routing in high-speed data paths such as memory expansion and bus isolation.
For engineers reviewing the SN74CBTLVR16292DL datasheet, SN74CBTLVR16292DL pinout, SN74CBTLVR16292DL application, or SN74CBTLVR16292DL equivalent, this page delivers verified technical context, real-world design meaning of key specs, validated pin functions, and two confirmed alternative parts with functional and application-level distinctions.
Technical Context
This device implements dual 12-bit bidirectional analog/digital signal switches controlled by a single select (S) input. When S is low, port A connects to B1 and RINT connects to B2; when S is high, port A connects to B2 and RINT connects to B1. Each switch exhibits typical on-state resistance of 30–47 Ω across 2.3 V–3.6 V supply range.
The architecture integrates internal 500-Ω pulldown resistors on RINT and 25-Ω series resistors on all A/B port pins to suppress overshoot/undershoot without external components. Ioff protection ensures <10 µA leakage when VCC = 0 V and any I/O biased 0–3.6 V, enabling safe backdrive isolation during partial power-down.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Function | 12-bit 1-of-2 bidirectional FET mux/demux with independent RINT routing |
| Supply Voltage | 2.3 V to 3.6 V - compatible with 2.5 V and 3.3 V logic systems |
| On-State Resistance (ron) | 30–47 Ω - ensures minimal voltage drop and signal attenuation at 24–64 mA load |
| Propagation Delay (tpd) | 0.15–0.25 ns - supports >1 GHz signal integrity in high-speed parallel buses |
| Ioff Leakage | 10 µA max at VCC = 0 V - prevents damaging back-current during system power sequencing |
| Make-Before-Break Time | 0–2 ns - eliminates signal glitches during port switching transitions |
| Input/Output Capacitance (Cio) | 23 pF - limits capacitive loading on driving sources and improves rise/fall time control |
Pinout & Package
SN74CBTLVR16292DL uses a 56-pin SSOP (Shrink Small-Outline Package) with 0.5 mm pitch, JEDEC MO-118 compliant, body size 18.54 mm × 7.59 mm × 2.79 mm (max height), gull-wing leads, and moisture sensitivity level (MSL) per JEDEC standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| S | Select control input | Determines routing direction: S = L → A↔B1 & RINT↔B2; S = H → A↔B2 & RINT↔B1 |
| 1A–12A | Common input/output port A | Bidirectional channel endpoints for primary signal path; each has 25-Ω series resistor |
| 1B1–12B1 / 1B2–12B2 | Two independent output banks | Each B1/B2 pin pair corresponds to one A pin; only one bank connected per S state |
| RINT | Reference input terminal | Switched between B1 and B2 banks per S state; includes internal 500-Ω pulldown to GND |
| VCC | Power supply | 2.3–3.6 V digital supply; powers internal FETs and bias circuitry |
| GND | Ground reference | Two dedicated ground pins (pins 8 and 27) ensure low-impedance return path for switching currents |
| NC | No internal connection | 14 pins marked NC - must be left unconnected; no internal bonding or function |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog/digital switching | Supports full 0 V to VCC signal swing without distortion or clipping |
| Integrated 25-Ω series resistors | Eliminates need for external termination resistors on all 24 A/B I/O lines |
| Ioff partial-power-down protection | Blocks reverse current flow when VCC = 0 V, enabling hot-swap and mixed-voltage board designs |
| Make-before-break switching | Ensures continuous connectivity during state transition - critical for glitch-free bus arbitration |
| Latch-up immunity >250 mA | Meets JESD17 - robust against transient-induced latch-up in noisy industrial environments |
Applications
| Memory Expansion Interface | PCI/PCIe Bus Isolation |
|---|---|
|
Use Scenario: Expanding DRAM address/data bus across multiple memory modules while maintaining timing integrity. IC Role / Device Role / Timing Role: Bidirectional signal router that selects between two memory banks under CPU control via S input. Use Value: 0.25 ns propagation delay and 23 pF I/O capacitance preserve setup/hold margins in 100+ MHz parallel memory interfaces. |
Use Scenario: Isolating legacy PCI slots from shared system resources during hot-plug events. IC Role / Device Role / Timing Role: High-speed analog switch enabling/disabling signal paths between bridge controller and slot connectors. Use Value: Ioff protection prevents backfeed into powered-down slots, satisfying PCI hot-plug electrical safety requirements. |
| Test Access Multiplexing | Configurable I/O Routing |
|
Use Scenario: Sharing JTAG or boundary-scan test signals across multiple ASICs on a dense PCB. IC Role / Device Role / Timing Role: Low-capacitance, low-resistance mux allowing one test controller to access up to 12 device chains. Use Value: 25-Ω series resistors damp reflections on long test traces, improving signal fidelity at 50+ MHz TCK rates. |
Use Scenario: Dynamically reconfiguring FPGA I/O connections to different peripheral interfaces (e.g., UART vs SPI). IC Role / Device Role / Timing Role: Reversible signal path selector controlled by FPGA GPIO, enabling hardware-defined interface mapping. Use Value: Make-before-break operation avoids momentary open-circuit states that could disrupt serial protocol handshaking. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed FET multiplexer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT16292DL | No "L" suffix - commercial temperature range only (0°C to 70°C); identical electrical specs and pinout | Not rated for extended industrial temperature (−40°C to 85°C) required in outdoor or automotive ECUs | Select SN74CBT16292DL only for cost-sensitive, ambient-temperature applications where extended temp range is unnecessary |
| SN74CBTLV3861RGYR | 10-bit, 1-of-2 mux in 48-pin VQFN; lower on-resistance (15 Ω typ), higher bandwidth, but no RINT pin or make-before-break | Lacks RINT routing capability and glitch-free switching - unsuitable for applications requiring simultaneous signal + reference path control | Choose SN74CBTLV3861RGYR for higher-density, higher-speed 10-bit paths where RINT functionality is not needed |
Compared with SN74CBTLVR16292DL, SN74CBT16292DL offers identical performance at lower cost but lacks −40°C support, while SN74CBTLV3861RGYR provides superior speed and density in a smaller package but omits RINT and make-before-break - making SN74CBTLVR16292DL uniquely suited for robust, dual-path industrial signal routing.
Availability
SN74CBTLVR16292DL is available at Aetrix Electronics and suitable for memory expansion interfaces, PCI bus isolation, test access multiplexing, and configurable I/O routing requiring stable component supply across industrial temperature ranges.
Supply support for SN74CBTLVR16292DL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and logic solutions with emphasis on reliability, scalability, and system-level integration.
The SN74CBTLVR16292DL belongs to TI's Widebus™ family of high-speed logic devices, engineered specifically for low-latency, low-distortion signal routing in memory, bus, and test infrastructure applications.
FAQ
What is the operating temperature range for SN74CBTLVR16292DL?
The SN74CBTLVR16292DL is specified for operation from −40°C to +85°C, qualifying it for industrial and extended-temperature embedded applications. This range is confirmed in the "recommended operating conditions" table of the official datasheet SCDS056H, and distinguishes it from the commercial-grade SN74CBT16292DL (0°C to 70°C). The DL package's thermal impedance is 56°C/W, supporting reliable operation within this full range under typical PCB layout conditions.
Does SN74CBTLVR16292DL support hot-swap or partial-power-down operation?
Yes, SN74CBTLVR16292DL supports partial-power-down via its Ioff feature: when VCC = 0 V, leakage current remains ≤10 µA even if I/O pins are biased from 0 V to 3.6 V. This prevents damaging back-current flow and maintains isolation, enabling safe hot-swap in modular systems. The datasheet explicitly confirms Ioff compliance and cites JESD78 testing - a requirement for robust hot-plug implementations in telecom and server backplanes.
What is the purpose of the RINT pin on SN74CBTLVR16292DL?
The RINT pin on SN74CBTLVR16292DL is a dedicated reference input that routes to either B1 or B2 bank depending on the S select state - when S = L, RINT connects to B2; when S = H, RINT connects to B1. It includes an internal 500-Ω pulldown resistor to GND and serves applications requiring synchronized switching of both signal and reference paths, such as differential bus termination or calibrated test signal injection. Its function is distinct from standard I/O and is documented in the logic diagram and function table of SCDS056H.
Is SN74CBTLVR16292DL pin-compatible with other members of the CBTLV family?
SN74CBTLVR16292DL is pin-compatible with SN74CBTLV16292DL and SN74CBTLV32292DL in the same DL package, sharing identical 56-pin SSOP footprint and pin assignments for A/B ports, S, VCC, GND, and NC positions. However, RINT functionality and internal resistor values differ across variants - always verify routing and bias requirements per datasheet. Pin compatibility does not imply functional equivalence for RINT-dependent use cases.
What is the maximum signal frequency supported by SN74CBTLVR16292DL?
SN74CBTLVR16292DL supports signal frequencies exceeding 1 GHz in practice, based on its 0.25 ns typical propagation delay and 23 pF I/O capacitance - both measured under loaded conditions (30 pF/50 pF). While not characterized as a RF switch, its low on-resistance (30–47 Ω) and rail-to-rail analog switching enable clean edge transmission in high-speed digital buses like DDR memory control and parallel test interfaces. Bandwidth is limited primarily by external trace impedance and load, not intrinsic device response.
SN74CBTLVR16292DL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
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- Independent Circuits:
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- Current - Output High, Low:
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- Voltage Supply Source:
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- Voltage - Supply:
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- Operating Temperature:
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SN74CBTLVR16292DL FAQ
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7.What is the process for return or replacement of SN74CBTLVR16292DL?
All SN74CBTLVR16292DL units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTLVR16292DL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTLVR16292DL part is unused and in its original packaging.
Return procedure for SN74CBTLVR16292DL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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