Texas Instruments SN74CBTR16861DGGR
- Part No.:
- SN74CBTR16861DGGR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 48-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
SN74CBTR16861DGGR.pdf
- Description:
- IC BUS SWITCH 10 X 1:1 48TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,862
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Product details
Overview
SN74CBTR16861DGGR from Texas Instruments is a 20-bit FET bus switch organized as two independent 10-bit switches with separate OE controls, featuring 25-Ω on-state resistance, TTL-compatible inputs, and operation from 4 V to 5.5 V. It enables high-speed, low-noise bidirectional signal routing in memory expansion and data-path isolation applications.
For engineers reviewing the SN74CBTR16861DGGR datasheet, SN74CBTR16861DGGR pinout, SN74CBTR16861DGGR application, or SN74CBTR16861DGGR equivalent, this page delivers verified electrical parameters, package-specific thermal data, functional truth table behavior, ESD/latch-up compliance details, and real-world use context for PCB-level integration and signal integrity planning.
Technical Context
The SN74CBTR16861DGGR implements dual 10-bit FET-based analog switches with independent OE control per bank, supporting bidirectional signal flow between port A and port B when OE is low. Its 25-Ω typical on-resistance ensures minimal propagation delay (1.25 ns at VCC = 4 V) and reduces signal reflection noise without external termination.
It operates across –40°C to 85°C with supply voltage from 4 V to 5.5 V, meets JESD 78 Class II latch-up immunity (>100 mA), and exceeds JESD 22 ESD ratings (2000-V HBM, 200-V MM). Input clamp current is –50 mA, and continuous channel current is rated at 128 mA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state resistance (ron) | 20–47 Ω typical; ensures low insertion loss and preserves signal edge integrity in high-speed digital buses. |
| Propagation delay (tpd) | 1.25 ns at VCC = 4 V; enables sub-ns timing alignment in DDR and parallel memory interfaces. |
| Supply voltage range | 4 V to 5.5 V; compatible with 5-V TTL and mixed-voltage system backplanes. |
| Input voltage range (VI) | –0.5 V to 7 V; supports hot-swap tolerant I/O with robust overvoltage margin. |
| Latch-up immunity | >100 mA per JESD 78 Class II; guarantees reliability under transient fault conditions in industrial environments. |
| ESD protection | 2000-V HBM, 200-V MM; eliminates need for external TVS diodes in board-level ESD design. |
| Thermal impedance (θJA) | 70°C/W (DGG); defines maximum power dissipation limit (≈71 mW at 50°C ambient rise) for thermal layout planning. |
Pinout & Package
TSSOP-48 package (DGG), 12.6 mm × 6.2 mm × 1.2 mm body, 0.5-mm pitch, RoHS-compliant CU NIPDAU finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A10, 2A1–2A10 | Port A input/output terminals (Bank 1 & 2) | Bidirectional signal paths; connect to upstream logic or memory data lines. |
| 1B1–1B10, 2B1–2B10 | Port B input/output terminals (Bank 1 & 2) | Bidirectional signal paths; connect to downstream peripherals or expansion slots. |
| 1OE, 2OE | Output-enable control inputs | Active-low enables corresponding 10-bit switch bank; allows independent gating of data lanes. |
| VCC | Power supply | Single 4–5.5 V rail powers both banks; no separate I/O or core voltage required. |
| GND | Ground reference | Two dedicated GND pins (pins 11 & 22) reduce ground bounce in high-frequency switching. |
| NC | No internal connection | Pins 1, 24, 47, 48 are unconnected; must be left floating or tied to GND for mechanical stability only. |
Key Features
| Feature | Design Value |
|---|---|
| 25-Ω series-equivalent switch resistance | Eliminates need for external 25-Ω or 50-Ω termination resistors on parallel buses, reducing BOM count and PCB area. |
| Dual independent 10-bit banks | Enables selective isolation of two distinct data groups (e.g., address vs. data) using separate OE signals without cross-talk. |
| TTL-compatible input thresholds | VIH = 2 V min, VIL = 0.8 V max ensures reliable interfacing with legacy 5-V CMOS/TTL logic without level shifters. |
| High-speed enable/disable timing | ten = 2.7–9 ns, tdis = 2.3–6.9 ns at VCC = 5 V enables precise windowing of data bursts in burst-mode memory access. |
| Low quiescent supply current | ICC = 3 µA max at VCC = 5.5 V minimizes standby power in always-on system management functions. |
Applications
| Memory Expansion Interface | Data Path Isolation |
|---|---|
Use Scenario: Adding secondary SRAM or Flash memory to a microcontroller with limited address/data pins. IC Role / Device Role / Timing Role: Bidirectional bus switch enabling time-multiplexed sharing of data/address lines between primary and expansion memory. Use Value: Eliminates need for glue logic or multiplexers while preserving signal integrity up to 800 Mbps due to 25-Ω Ron and sub-ns tpd. | Use Scenario: Isolating test equipment I/O from production line controllers during calibration sequences. IC Role / Device Role / Timing Role: High-speed signal gate controlled by system supervisor logic to prevent unintended data coupling during reconfiguration. Use Value: Achieves >60 dB off-isolation at 100 MHz and zero-latency enable/disable response for deterministic test sequencing. |
| Hot-Swappable Module Backplane | Legacy System Bus Bridging |
Use Scenario: Enabling safe insertion/removal of PCIe or CompactPCI modules without disrupting host CPU bus activity. IC Role / Device Role / Timing Role: Bidirectional isolation barrier with overvoltage-tolerant I/O (–0.5 V to 7 V) and latch-up immunity. Use Value: Prevents bus contention and ground-loop faults during hot-plug events while maintaining full 5-V TTL compatibility. | Use Scenario: Interfacing modern FPGA I/O banks (3.3 V LVTTL) to legacy 5-V ISA bus peripherals. IC Role / Device Role / Timing Role: Voltage-agnostic signal pass-through device with no level translation-relies on TTL input compatibility. Use Value: Enables direct connection without level shifters or resistive dividers, reducing latency and component count in retro-fit designs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT16210DGGR | 24-bit single-bank switch; no dual OE; higher Ron (26 Ω typ); same DGG package. | Lacks independent bank control; unsuitable for split-bus isolation but offers higher bit density. | Select when full 24-bit concurrency is needed and separate enable control is unnecessary. |
| SN74CBTLV16210DGGR | 24-bit, 3.3-V optimized; lower Ron (12 Ω typ); VIH/VIL shifted for LVTTL; not 5-V tolerant. | Requires 3.3-V supply only; incompatible with 5-V systems; superior speed/power trade-off below 3.6 V. | Select for new 3.3-V designs prioritizing lower Ron and reduced dynamic power over 5-V interoperability. |
Compared with SN74CBTR16861DGGR, SN74CBT16210DGGR provides more bits per package but sacrifices independent bank control, while SN74CBTLV16210DGGR improves on-resistance and speed at the cost of 5-V tolerance-making SN74CBTR16861DGGR uniquely suited for mixed-voltage, dual-domain isolation tasks.
Availability
SN74CBTR16861DGGR is available at Aetrix Electronics and suitable for memory expansion interfaces, hot-swappable backplanes, legacy bus bridging, and data path isolation requiring stable component supply across industrial temperature ranges.
Supply support for SN74CBTR16861DGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and logic solutions with emphasis on reliability, scalability, and system-level integration.
The SN74CBTR16861DGGR belongs to TI's Widebus™ family of high-speed bus switches, designed specifically for low-latency, low-noise signal routing in memory subsystems and modular interconnect architectures.
FAQ
What is the maximum operating temperature range for the SN74CBTR16861DGGR?
The SN74CBTR16861DGGR is rated for operation from –40°C to +85°C ambient temperature. This industrial-grade range is validated per the recommended operating conditions in the official datasheet (SCDS078D), and applies to all TSSOP-packaged variants including SN74CBTR16861DGGR. Thermal performance is further defined by θJA = 70°C/W, allowing accurate junction temperature estimation under load.
Does the SN74CBTR16861DGGR support hot-swap operation?
Yes, the SN74CBTR16861DGGR supports hot-swap operation due to its –0.5 V to 7 V input voltage rating, 2000-V HBM ESD protection, and latch-up immunity exceeding 100 mA per JESD 78 Class II. These specifications allow safe insertion into live 5-V backplanes without risk of damage or bus disruption, provided OE is held high until power stabilization.
Can the SN74CBTR16861DGGR be used with 3.3-V logic systems?
The SN74CBTR16861DGGR is specified for 4 V to 5.5 V supply operation and features TTL-compatible inputs (VIH ≥ 2 V, VIL ≤ 0.8 V), making it compatible with 3.3-V outputs driving high-level inputs. However, its output swing follows VCC, so 3.3-V systems require level-shifting on outputs unless interfacing with 5-V-tolerant receivers. For native 3.3-V operation, consider SN74CBTLV16210DGGR instead.
How many independent enable controls does the SN74CBTR16861DGGR have?
The SN74CBTR16861DGGR has two independent active-low output-enable inputs: 1OE controls the first 10-bit switch bank (1A/1B), and 2OE controls the second 10-bit bank (2A/2B). This allows asynchronous gating of two distinct data groups-for example, isolating address and data lines separately-without shared timing constraints.
What is the typical on-state resistance of the SN74CBTR16861DGGR and why does it matter?
The typical on-state resistance (ron) of the SN74CBTR16861DGGR is 25 Ω, with a guaranteed range of 20–47 Ω across process/voltage/temperature. This low resistance minimizes voltage drop and signal distortion, enabling clean transmission of fast edges (e.g., in 100-MHz+ parallel buses) and eliminating the need for external series termination resistors-reducing BOM cost and layout complexity.
SN74CBTR16861DGGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTR
- Package/Case:
- 48-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Bus Switch
- Circuit:
- 10 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSSOP
SN74CBTR16861DGGR FAQ
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7.What is the process for return or replacement of SN74CBTR16861DGGR?
All SN74CBTR16861DGGR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTR16861DGGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTR16861DGGR part is unused and in its original packaging.
Return procedure for SN74CBTR16861DGGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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