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Texas Instruments SN74CBTS16211DGGR
- Part No.:
- SN74CBTS16211DGGR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 56-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
SN74CBTS16211DGGR.pdf
- Description:
- IC BUS SWITCH 12 X 1:1 56TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,914
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Product details
Overview
SN74CBTS16211DGGR from Texas Instruments is a 24-bit FET bus switch with Schottky diode clamping, designed for high-speed TTL-compatible signal routing in memory and data-path applications. It features 5-Ω on-state resistance, 0.25 ns typical propagation delay at 5 V, and dual independent 12-bit switch banks controlled by separate OE inputs. Used in DDR memory interface buffering and hot-swap backplane signal isolation.
For engineers reviewing the SN74CBTS16211DGGR datasheet, SN74CBTS16211DGGR pinout, SN74CBTS16211DGGR application, or SN74CBTS16211DGGR equivalent, key selection criteria include on-resistance matching across channels, undershoot clamping capability, TSSOP-56 thermal performance (64°C/W θJA), and compatibility with 4–5.5 V supply rails in industrial temperature range (–40°C to 85°C).
Technical Context
The SN74CBTS16211DGGR implements two independent 12-bit FET-based analog switches, each controlled by dedicated OE pins (1OE and 2OE). When an OE is low, its corresponding A-port (e.g., 1A1–1A12) connects bidirectionally to its B-port (1B1–1B12) with minimal RC delay due to low ron and integrated Schottky clamps.
It operates strictly as a passive analog switch - no level translation, no internal logic state retention, and no power sequencing requirements beyond VCC and GND. Input/output pins tolerate –0.5 V to 7 V, supporting undershoot clamping down to –1.2 V (VIK) while maintaining 128 mA continuous channel current capability per path.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state resistance (ron) | 5 Ω typical at VCC = 4.5 V, enabling <10 mV drop at 20 mA per channel - critical for low-voltage signal integrity. |
| Propagation delay (tpd) | 0.25 ns typical at VCC = 5 V, CL = 50 pF - supports >1 GHz signal switching without timing skew. |
| Supply voltage range | 4 V to 5.5 V - compatible with 5 V TTL and mixed-voltage 4.5 V systems; not 3.3 V tolerant. |
| Input clamp voltage (VIK) | –1.2 V at II = –18 mA - actively suppresses negative transients below ground using integrated Schottky diodes. |
| Channel current rating | 128 mA continuous per switch path - sufficient for driving 50 pF loads at 100 MHz with <1% distortion. |
| Operating temperature | –40°C to +85°C - qualified for industrial-grade embedded control and telecom infrastructure use. |
| Package thermal resistance (θJA) | 64°C/W for TSSOP-56 (DGG) - requires moderate PCB copper area for sustained 100+ mA switching without derating. |
Pinout & Package
TSSOP-56 (DGG) package: 12.0 mm × 6.1 mm × 1.2 mm body, 0.5 mm pitch, exposed pad not present, JEDEC MO-153 compliant. Pin 1 located at top-left corner with index area marking.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A12, 2A1–2A12 | Input/Output Port A (Bank 1 & 2) | Bidirectional analog signal terminals; internally connected to FET source/drain - no directionality or drive strength limitation. |
| 1B1–1B12, 2B1–2B12 | Input/Output Port B (Bank 1 & 2) | Paired with respective A-port; identical electrical characteristics - enables mirror-image board layout for differential or parallel buses. |
| 1OE, 2OE | Enable Control Inputs | Active-low TTL-compatible enables; must be tied to VCC or GND when unused to prevent floating states and leakage. |
| VCC | Power Supply | Single 4–5.5 V rail powers all 24 switches and clamp diodes; no separate I/O supply required. |
| GND (Pins 8, 23, 39, 52) | Ground Reference | Four dedicated ground pins minimize ground bounce across 24-channel operation; distributed placement reduces return-path inductance. |
| NC (Pins 1, 56) | No Internal Connection | Unbonded die pads - must remain unconnected; no routing or thermal relief needed. |
Key Features
| Feature | Design Value |
|---|---|
| 24-bit bidirectional switching | Supports full-width data bus isolation (e.g., 24-bit address/data multiplexing) without direction control logic or buffers. |
| Schottky diode clamping | Integrated clamps limit negative undershoot to –1.2 V - eliminates need for external TVS diodes in ESD-prone backplane interfaces. |
| Dual independent enable control | 1OE and 2OE allow time-staggered or function-segregated switching of two 12-bit segments - essential for burst-mode memory access control. |
| 5 Ω low on-resistance | Ensures <50 mV voltage drop at 10 mA, preserving TTL logic thresholds across long PCB traces or connector paths. |
| TTL-compatible I/O levels | Accepts 0.8 V / 2.0 V VIH/VIL thresholds and drives VOH ≥ 4.5 V / VOL ≤ 0.3 V at 5 V - interoperable with legacy 5 V logic families. |
Applications
| Memory Bus Isolation | Hot-Swap Backplane Interface |
|---|---|
|
Use Scenario: Isolating DRAM address/data lines during system boot or memory reconfiguration to prevent bus contention. IC Role / Device Role / Timing Role: Bidirectional analog switch enabling/disabling signal paths between controller and memory modules without adding propagation delay or logic inversion. Use Value: Maintains sub-nanosecond timing alignment across all 24 bits, avoiding setup/hold violations in DDR1/DDR2 memory subsystems. |
Use Scenario: Protecting live backplane slots from transient injection during card insertion/removal in telecom chassis. IC Role / Device Role / Timing Role: Signal gate that disconnects I/O before power sequencing begins, enforced by OE-controlled shutdown prior to hot-swap event detection. Use Value: Integrated Schottky clamps absorb –1.2 V undershoot spikes, preventing latch-up in upstream ASICs during connector arcing. |
| Legacy System Bus Expansion | Test Access Multiplexer |
|
Use Scenario: Adding peripheral expansion to 5 V ISA or PCI-X legacy systems where bus loading must remain within spec. IC Role / Device Role / Timing Role: Low-ron pass-through switch inserted between host bridge and add-in card, transparent to protocol timing. Use Value: 5 Ω ron adds <0.5% impedance mismatch to 50 Ω trace environments - preserves signal integrity up to 200 MHz. |
Use Scenario: Routing JTAG or boundary-scan signals between multiple test instruments and DUTs in automated test equipment. IC Role / Device Role / Timing Role: Channel-selectable signal router with independent enables allowing one instrument to drive multiple devices sequentially. Use Value: Dual OE control permits deterministic switching sequence - avoids bus contention during test vector transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT16211DGGR | Omits Schottky clamping; higher VIK = –0.5 V; otherwise identical pinout, ron, and timing. | Not suitable for systems with aggressive undershoot (e.g., long cables, unterminated stubs); requires external clamping. | Select SN74CBT16211DGGR only if board-level ESD protection already exists and signal edges are tightly controlled. |
| SN74CBTLV16211DGGR | 3.3 V only (2.3–3.6 V); lower ron (3 Ω); no Schottky clamps; different VIH/VIL thresholds. | Designed for LVTTL/LVCMOS systems; incompatible with 5 V buses; cannot replace SN74CBTS16211DGGR in mixed-voltage designs. | Choose SN74CBTLV16211DGGR only for new 3.3 V-only architectures requiring lower on-resistance and reduced power. |
Compared with SN74CBTS16211DGGR, SN74CBT16211DGGR trades undershoot protection for marginally lower cost and same footprint, while SN74CBTLV16211DGGR shifts to 3.3 V operation with improved ron but zero clamping - neither is pin-compatible nor functionally substitutable without schematic and layout revision.
Availability
SN74CBTS16211DGGR is available at Aetrix Electronics and suitable for memory bus isolation, hot-swap backplane interfaces, and legacy system bus expansion requiring stable component supply across industrial temperature range and long-lifecycle programs.
Supply support for SN74CBTS16211DGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in industrial, automotive, and communications markets.
The Widebus™ family - including SN74CBTS16211DGGR - was engineered for high-speed, low-distortion signal routing in memory subsystems and backplane interconnects, emphasizing minimal propagation delay and robust transient suppression.
FAQ
What is the maximum undershoot voltage the SN74CBTS16211DGGR can safely clamp?
The SN74CBTS16211DGGR integrates Schottky diodes that clamp input/output undershoot to –1.2 V when II = –18 mA, as specified in the absolute maximum ratings table. This protects downstream 5 V logic from negative transients caused by transmission-line reflections or connector arcing. The SN74CBTS16211DGGR maintains this clamping behavior across its full operating temperature range (–40°C to 85°C) without degradation.
Can the SN74CBTS16211DGGR operate with a 3.3 V supply?
No, the SN74CBTS16211DGGR requires a minimum VCC of 4 V and is rated for 4–5.5 V operation only. At 3.3 V, the device fails to meet guaranteed ron, propagation delay, and output drive specifications. For 3.3 V systems, TI recommends the SN74CBTLV16211DGGR instead - but it lacks Schottky clamping and is not pin-compatible with the SN74CBTS16211DGGR.
How many ground pins does the SN74CBTS16211DGGR have, and why are they distributed?
The SN74CBTS16211DGGR has four dedicated GND pins (pins 8, 23, 39, and 52) placed at strategic locations across the TSSOP-56 package. This distribution minimizes ground loop inductance and prevents localized voltage rise during simultaneous switching of multiple channels. Each GND pin services adjacent groups of I/Os, ensuring stable reference for all 24 switch paths in high-speed operation - a design necessity confirmed in TI's PCB layout guidelines for the SN74CBTS16211DGGR.
Is the SN74CBTS16211DGGR pin-compatible with other members of the Widebus™ family?
The SN74CBTS16211DGGR shares the same TSSOP-56 (DGG) footprint and pinout with SN74CBT16211DGGR and SN74CBTLV16211DGGR, but functional differences exist. While mechanical mounting is identical, SN74CBT16211DGGR omits Schottky clamps, and SN74CBTLV16211DGGR uses 3.3 V logic thresholds - so direct substitution requires validation of clamping needs and voltage compatibility. The SN74CBTS16211DGGR remains unique in its combination of 5 V operation and integrated undershoot protection.
What is the recommended handling for unused OE pins on the SN74CBTS16211DGGR?
All unused OE inputs on the SN74CBTS16211DGGR must be hard-wired to either VCC or GND - floating OE pins cause undefined switch states and increased ICC leakage. TI's SCBA004 application report explicitly mandates this for proper operation. Leaving 1OE or 2OE unconnected risks partial conduction, signal corruption, and elevated supply current. The SN74CBTS16211DGGR datasheet confirms this requirement under "Recommended Operating Conditions" and must be implemented in every design using the SN74CBTS16211DGGR.
SN74CBTS16211DGGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTS
- Package/Case:
- 56-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Bus Switch
- Circuit:
- 12 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSSOP
SN74CBTS16211DGGR FAQ
1.How can I place an order for SN74CBTS16211DGGR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CBTS16211DGGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CBTS16211DGGR reliable?
The price and inventory of SN74CBTS16211DGGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTS16211DGGR is usually 5 days.
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SN74CBTS16211DGGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74CBTS16211DGGR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CBTS16211DGGR?
For technical support, including SN74CBTS16211DGGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTS16211DGGR requirements.
6.How does Aetrix verify that SN74CBTS16211DGGR is sourced from the original manufacturer or authorized distributors?
All SN74CBTS16211DGGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTS16211DGGR meets industry standards.
7.What is the process for return or replacement of SN74CBTS16211DGGR?
All SN74CBTS16211DGGR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTS16211DGGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CBTS16211DGGR part is unused and in its original packaging.
Return procedure for SN74CBTS16211DGGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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