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Texas Instruments SN74CBTS16212DGGR

Part No.:
SN74CBTS16212DGGR
Manufacturer:
Texas Instruments
Category:
Signal Switches, Multiplexers, Decoders
Package:
56-TFSOP (0.240", 6.10mm Width)
Datasheet:
AetrixSN74CBTS16212DGGR.pdf
Description:
IC BUS FET EXC SW 12X2:2 56TSSOP
Quantity:
Payment:
Payment
Shipping:
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Inventory:4,712

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Product details

Overview

SN74CBTS16212DGGR from Texas Instruments is a 24-bit FET bus-exchange switch with Schottky diode clamping, designed for high-speed TTL-compatible data routing in memory and bus interface applications. It features 5-Ω on-state resistance, 0.25 ns propagation delay at 5 V, and supports bidirectional 12-bit data exchange across four ports via S0–S2 select inputs.

For engineers reviewing the SN74CBTS16212DGGR datasheet, SN74CBTS16212DGGR pinout, SN74CBTS16212DGGR application, or SN74CBTS16212DGGR equivalent, this device is selected for low-latency, latch-up-resistant bus switching in industrial control backplanes, FPGA I/O expansion, and legacy parallel interface bridging where undershoot protection and TTL-level compatibility are critical.

Technical Context

The SN74CBTS16212DGGR implements a dual 12-bit configurable bus switch architecture: it operates either as a 24-bit transparent path (A↔B) or as a 12-bit exchanger that routes A1/B1 and A2/B2 pairs based on 3-bit select logic (S0–S2). Its FET-based switch core delivers symmetric bidirectional conduction without direction pins.

Each I/O channel integrates Schottky clamping diodes to suppress negative undershoot below –1.2 V, while meeting JESD 17 latch-up immunity (>250 mA) and JESD 22 ESD ratings (2000-V HBM, 200-V MM). Control inputs are TTL-compatible (VIH = 2 V, VIL = 0.8 V) and require termination to VCC or GND for stable operation.

Key Specifications

Parameter Value and Actual Design Meaning
On-state resistance (ron) 4 Ω typical at VCC = 4.5 V, enabling minimal voltage drop (<200 mV at 50 mA) and low power loss in signal paths.
Propagation delay (tpd) 0.25 ns max at VCC = 5 V, CL = 50 pF - ensures sub-nanosecond timing integrity for high-speed parallel buses.
Supply voltage range 4 V to 5.5 V - compatible with standard 5-V TTL and mixed-voltage systems with tight regulation.
Input clamp voltage (VIK) –1.2 V at II = –18 mA - actively limits negative transients to protect downstream logic from undershoot damage.
Channel current rating 128 mA continuous per switch - supports robust drive capability for capacitive bus loads up to 50 pF.
ESD protection 2000-V HBM, 200-V MM - exceeds JEDEC standards for handling and board-level reliability in manufacturing environments.
Operating temperature –40°C to +85°C - qualified for industrial-grade deployment in embedded controllers and communications equipment.

Pinout & Package

TSSOP-56 (DGG) package: 13.9 mm × 6.1 mm × 1.2 mm height, lead pitch 0.5 mm, RoHS-compliant NiPdAu finish, MSL Level-1.

Pin/Terminal Circuit Role Design Meaning
S0, S1, S2 Bus exchange select inputs 3-bit binary control determining port mapping (e.g., S2S1S0 = 111 routes A1↔B2 and A2↔B1); TTL-compatible thresholds.
A1–A12, B1–B12 Switched I/O terminals (24 total) Bidirectional signal paths with integrated Schottky clamps; no direction pin required; 5-Ω ron enables low-distortion transmission.
VCC Power supply Single 4–5.5 V rail powers all switches and logic; decoupling recommended near Pin 27 per layout guidelines.
GND Ground reference Two dedicated ground pins (Pins 8 and 20) reduce ground bounce; must be connected to low-impedance system ground plane.
NC No-connect Pins 1–7, 9–19, 21–26, 29–56 are functional I/O or power; no NC pins exist - all 56 pins assigned per top-view diagram.

Key Features

Feature Design Value
24-bit bus exchange capability Configurable as either 24-bit pass-through or dual 12-bit crosspoint switch via S0–S2, eliminating need for external multiplexers in memory/data-path reconfiguration.
Schottky diode clamping on all I/Os Clamps negative undershoot to –1.2 V, preventing false triggering or damage in hot-swap or noisy bus environments.
5-Ω low on-resistance Minimizes RC delay and signal attenuation - maintains signal integrity for 100+ MHz parallel bus operation with <50 pF load.
TTL-compatible control inputs Accepts standard 0.8 V / 2.0 V logic thresholds without level shifters, simplifying integration with legacy microcontrollers and FPGAs.
Latch-up immunity >250 mA Meets JESD 17 specification, ensuring robustness against transient current injection during power sequencing or ESD events.

Applications

Memory Interfacing FPGA I/O Expansion

Use Scenario: Routing address/data between dual-port SRAM and microcontroller in real-time control systems.

IC Role / Device Role / Timing Role: Bidirectional bus switch enabling time-multiplexed access to shared memory banks with sub-nanosecond latency.

Use Value: Eliminates bus contention and reduces PCB layer count by replacing discrete logic gates and buffers with single-chip switching.

Use Scenario: Extending limited FPGA I/O pins to drive multiple peripheral interfaces (e.g., LCD, keypad, ADC).

IC Role / Device Role / Timing Role: Configurable 12-bit exchanger dynamically assigning FPGA GPIO banks to different peripherals via S0–S2.

Use Value: Enables flexible pin reuse without FPGA recompilation; Schottky clamping protects FPGA I/O from peripheral-induced undershoot.

Legacy Parallel Interface Bridging Industrial Backplane Switching

Use Scenario: Adapting ISA or PC/104 bus signals between legacy host and modern controller modules.

IC Role / Device Role / Timing Role: 24-bit transparent switch isolating voltage domains while preserving TTL timing margins and noise immunity.

Use Value: Maintains full 8-MHz ISA timing compliance with <0.35 ns tpd, avoiding timing closure issues in retro-fit designs.

Use Scenario: Reconfiguring signal paths in modular PLC backplanes supporting hot-swappable I/O cards.

IC Role / Device Role / Timing Role: Fault-tolerant bus exchange switch enabling dynamic re-routing of sensor/actuator data streams under firmware control.

Use Value: Latch-up immunity and 2000-V HBM ESD rating ensure operational continuity in electrically harsh factory-floor environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus-switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74CBT16212DGGR Omits Schottky clamping diodes; otherwise identical pinout, ron (~5 Ω), and timing (0.25 ns tpd). Not suitable for undershoot-prone environments (e.g., hot-swap, long traces); requires external clamping if VIK < –0.5 V is violated. Select SN74CBT16212DGGR only when board-level transient suppression is already implemented and cost reduction is prioritized.
74LVC1G3157DCKR Single-channel SPDT analog switch; 5-V compatible but higher ron (6 Ω typ), no bus-exchange logic or multi-bit coordination. Limited to point-to-point signal routing; cannot perform 12-bit parallel exchange or support S0–S2 control scheme. Use 74LVC1G3157DCKR only for low-pin-count, non-bus applications requiring minimal footprint - not a functional substitute for SN74CBTS16212DGGR.

Compared with SN74CBT16212DGGR and 74LVC1G3157DCKR, the SN74CBTS16212DGGR uniquely combines integrated Schottky clamping, 24-bit coordinated switching, and programmable bus exchange - making it irreplaceable in high-reliability, multi-bit parallel interface designs where signal integrity and configuration flexibility are co-dependent requirements.

Availability

SN74CBTS16212DGGR is available at Aetrix Electronics and suitable for industrial backplane switching, FPGA I/O expansion, memory interfacing, and legacy parallel interface bridging requiring stable component supply across extended product lifecycles.

Supply support for SN74CBTS16212DGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in high-reliability interface solutions.

The SN74CBTS16212DGGR belongs to TI's Widebus™ family of high-speed bus switches, engineered specifically for low-latency, noise-immune data routing in industrial, computing, and communications infrastructure.

FAQ

What is the maximum operating frequency supported by the SN74CBTS16212DGGR?

The SN74CBTS16212DGGR does not specify a maximum clock frequency, as it is an analog bus switch-not a clocked device. Its 0.25 ns propagation delay at 5 V enables reliable operation with parallel bus data rates exceeding 100 MHz, provided trace capacitance remains ≤50 pF and signal rise times are ≥1 ns. System-level timing must account for total path delay including PCB routing.

Does the SN74CBTS16212DGGR require external pull-up or pull-down resistors on its control inputs?

Yes - all unused S0, S1, and S2 inputs of the SN74CBTS16212DGGR must be terminated to either VCC or GND to prevent floating states that could cause undefined switching behavior or increased ICC. TI recommends using 10-kΩ resistors; direct connection is acceptable if system logic guarantees stable levels during power-up and operation.

Can the SN74CBTS16212DGGR operate with a 3.3-V supply?

No - the SN74CBTS16212DGGR is specified only for 4 V to 5.5 V operation. At 3.3 V, the device fails to meet guaranteed ron, tpd, and VIH/VIL thresholds; output drive strength degrades significantly, and Schottky clamping may become ineffective. For 3.3-V systems, consider TI's SN74LVC1G3157 or similar LVC-family switches.

How does the Schottky clamping in the SN74CBTS16212DGGR improve system reliability?

The Schottky clamping diodes on every I/O of the SN74CBTS16212DGGR limit negative undershoot to –1.2 V at –18 mA, preventing sub-threshold conduction in downstream CMOS inputs and avoiding latch-up triggers. This is especially critical in hot-swap scenarios, long trace runs, or systems with inductive loads where ground bounce or crosstalk induces transient negativity.

Is the SN74CBTS16212DGGR pin-compatible with other members of the Widebus™ family?

The SN74CBTS16212DGGR shares the same TSSOP-56 (DGG) footprint and pinout with SN74CBT16212DGGR and SN74CBTD16212DGGR, differing only in internal clamping and drive strength. However, substitution requires verification of Schottky diode necessity, as SN74CBT16212DGGR lacks clamping and SN74CBTD16212DGGR adds series resistors for EMI reduction.

SN74CBTS16212DGGR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74CBTS
Package/Case:
56-TFSOP (0.240", 6.10mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Type:
Bus FET Exchange Switch
Circuit:
12 x 2:2
Independent Circuits:
1
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSSOP

SN74CBTS16212DGGR FAQ

1.How can I place an order for SN74CBTS16212DGGR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74CBTS16212DGGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74CBTS16212DGGR reliable?

The price and inventory of SN74CBTS16212DGGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CBTS16212DGGR is usually 5 days.

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SN74CBTS16212DGGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74CBTS16212DGGR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74CBTS16212DGGR?

For technical support, including SN74CBTS16212DGGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CBTS16212DGGR requirements.

6.How does Aetrix verify that SN74CBTS16212DGGR is sourced from the original manufacturer or authorized distributors?

All SN74CBTS16212DGGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CBTS16212DGGR meets industry standards.

7.What is the process for return or replacement of SN74CBTS16212DGGR?

All SN74CBTS16212DGGR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CBTS16212DGGR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74CBTS16212DGGR part is unused and in its original packaging.

Return procedure for SN74CBTS16212DGGR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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