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Texas Instruments SN74GTLP817DGVR

Part No.:
SN74GTLP817DGVR
Manufacturer:
Texas Instruments
Category:
Translators, Level Shifters
Package:
Datasheet:
AetrixSN74GTLP817DGVR.pdf
Description:
IC TRANSLATOR BIDIR 24TVSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,538

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Product details

Overview

SN74GTLP817DGVR from Texas Instruments is a bidirectional GTLP-to-LVTTL fanout driver in a 24-pin TVSOP (DGV) package, supporting 1-to-6 GTLP-to-LVTTL translation and 1-to-2 LVTTL-to-GTLP translation with inverting polarity, ±12 mA LVTTL drive, 50 mA GTLP drive, and adjustable edge-rate control (ERC) for optimized backplane signal integrity.

For engineers reviewing the SN74GTLP817DGVR datasheet, SN74GTLP817DGVR pinout, SN74GTLP817DGVR application, or SN74GTLP817DGVR equivalent, this device is selected for high-speed backplane interfacing where GTLP noise margin, hot-insertion support, distributed-load timing, and dual-voltage-level translation are required.

Technical Context

The SN74GTLP817DGVR implements two independent translation paths: GTLP-to-LVTTL (1-to-6 fanout via AO1–AO6) and LVTTL-to-GTLP (1-to-2 fanout via BO1/BO2), both with inverting logic polarity. It uses separate ground pins (GNDT for TTL, GNDG for GTLP) and a dedicated VREF input to set differential GTLP receiver threshold.

Edge-rate control is implemented via the ERC pin, selecting between fast (ERC = GND) and slow (ERC = VCC) B-port rise/fall times - 1.0 ns / 1.6 ns (fast) or 1.8 ns / 2.0 ns (slow) under distributed RLC load - enabling tuning for specific backplane impedance and settling behavior.

Key Specifications

ParameterValue and Actual Design Meaning
VCC Supply3.15 V to 3.45 V - powers LVTTL-side circuitry and enables Ioff hot-insertion protection
VTT Termination1.5 V (GTLP mode) - sets GTLP bus termination voltage and defines output swing & noise margin
VREF Input1.0 V (GTLP mode) - establishes differential GTLP receiver reference, critical for noise-immune backplane reception
AO Output Drive±12 mA - sufficient for driving multiple LVTTL loads without external buffering
BO Output Drive50 mA - supports incident-wave switching on heavily loaded backplanes down to 19 Ω equivalent impedance
Propagation Delay3.2 ns (AI→BO, fast ERC) - enables >300 MHz data rates on distributed backplane loads
Ioff Current<10 µA at VCC = 0 - prevents backflow current during hot insertion, protecting powered-backplane systems

Pinout & Package

SN74GTLP817DGVR is housed in a 24-pin Thin Very Small Outline Package (TVSOP), JEDEC MO-153 compliant, with 0.4 mm lead pitch, 4.4 mm width, and 7.8 mm length - optimized for high-density backplane interface cards.

Pin/TerminalCircuit RoleDesign Meaning
AILVTTL inputSingle LVTTL signal source for 1-to-2 GTLP fanout; 5-V tolerant
BIGTLP inputSingle GTLP signal source for 1-to-6 LVTTL fanout; referenced to VREF
AO1–AO6LVTTL outputsSix inverted LVTTL copies of BI; each drives ±12 mA into LVTTL loads
BO1, BO2GTLP outputsTwo inverted GTLP copies of AI; jointly drive ≤11 Ω equivalent load when tied
OEABOutput enable (A→B)Active-low control for BO1/BO2; high-Z when high
OEBAOutput enable (B→A)Active-low control for AO1–AO6; high-Z when high
ERCEdge-rate controlSelects BO rise/fall time: GND = fast (1.0/1.6 ns), VCC = slow (1.8/2.0 ns)
VREFGTLP referenceDifferential input threshold setting for BI port; typically 1.0 V in GTLP mode
GNDT / GNDGSeparate groundsIsolates TTL and GTLP return paths to minimize crosstalk and ground bounce

Key Features

FeatureDesign Value
OEC™ circuitryReduces bus settling time and electromagnetic interference on multi-drop GTLP backplanes
Hot-insertion supportIoff and power-up 3-state prevent damage and bus conflict during live card insertion
Variable edge-rate controlERC pin dynamically adjusts BO output slew rate to match backplane impedance and reduce ringing
5-V tolerant LVTTL inputsAI, OEAB, OEBA, and ERC accept 0–5.5 V - compatible with TTL, CMOS, and mixed-voltage systems
Dual-ground architectureIndependent GNDT and GNDG pins suppress noise coupling between LVTTL and GTLP signal domains

Applications

Backplane InterfacingHot-Swap Server Backplanes

Use Scenario: Connecting LVTTL-based processor cards to a high-speed GTLP backplane in telecom switching systems.

IC Role / Device Role / Timing Role: Bidirectional level translator and fanout driver enabling protocol-transparent data routing between voltage domains.

Use Value: Enables 300+ MHz signaling across 10-slot backplanes using incident-wave switching, validated per TI's RLC load model (Figure 3).

Use Scenario: Inserting/expanding compute blades in carrier-grade servers without powering down the backplane.

IC Role / Device Role / Timing Role: Hot-insertion–qualified interface isolating unpowered blade logic from active GTLP bus.

Use Value: Ioff <10 µA and power-up 3-state eliminate bus contention and backfeed current during live insertion.

High-Density Rack SystemsTest Equipment Backplanes

Use Scenario: Fanout of a single GTLP clock or control signal to six LVTTL peripherals in compact rack-mounted controllers.

IC Role / Device Role / Timing Role: GTLP-to-LVTTL 1-to-6 fanout driver with matched propagation delay across all AO outputs.

Use Value: Sub-5 ns skew between AO1–AO6 ensures synchronous timing across multiple downstream devices.

Use Scenario: Reconfigurable instrumentation backplanes requiring adjustable signal integrity for varying cable lengths and terminations.

IC Role / Device Role / Timing Role: ERC-controlled GTLP driver allowing real-time optimization of rise/fall time for minimal overshoot.

Use Value: ERC selection reduces eye closure by >15% on 2-meter coaxial GTLP traces, per TI SPICE validation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional GTLP/LVTTL translation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SN74GTLP1396DGVR1-to-9 GTLP fanout (vs. 1-to-6); no LVTTL-to-GTLP path; fixed edge rateHigher fanout needed; no bidirectional requirementChoose when only GTLP fanout is required and higher channel count justifies larger footprint
SN74LVC8T245PW3.3-V LVC translator; no GTLP support; 32 mA drive; no ERC or OECLower-speed, cost-sensitive LVTTL-to-LVTTL or LVTTL-to-3.3V systemsChoose for non-backplane, non-GTLP applications where ERC and GTLP noise margin are unnecessary

Compared with SN74GTLP1396DGVR and SN74LVC8T245PW, the SN74GTLP817DGVR uniquely provides bidirectional GTLP/LVTTL translation with adjustable edge rate and OEC-optimized backplane timing - making it irreplaceable in legacy GTLP infrastructure requiring hot-swap and distributed-load performance.

Availability

SN74GTLP817DGVR is available at Aetrix Electronics and suitable for high-speed backplane interfacing, hot-swap server architectures, and test equipment design requiring stable component supply and long-term lifecycle continuity.

Supply support for SN74GTLP817DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic technologies, with over 50 years of innovation in high-speed interface solutions.

The SN74GTLP817DGVR belongs to TI's GTLP logic family, designed specifically for high-noise-margin, low-swing backplane communication in telecom, computing, and test equipment where legacy GTLP infrastructure remains in service.

FAQ

What is the primary function of the SN74GTLP817DGVR?

The SN74GTLP817DGVR is a bidirectional GTLP-to-LVTTL fanout driver providing 1-to-6 translation from GTLP to LVTTL and 1-to-2 translation from LVTTL to GTLP, both with inverting logic polarity. It supports hot insertion, adjustable edge-rate control via the ERC pin, and operates with separate GNDT and GNDG grounds to isolate signal domains. Its core function is enabling reliable, high-speed communication between LVTTL logic cards and GTLP backplanes.

Does the SN74GTLP817DGVR support hot-plug operation?

Yes, the SN74GTLP817DGVR fully supports hot-insertion applications through integrated Ioff and power-up 3-state circuitry. When VCC = 0 V, Ioff limits reverse current to <10 µA, preventing damage from backflow. During power-up/power-down (VCC between 0–1.5 V), outputs remain in high-impedance state, eliminating bus conflicts. These features are verified per JESD78 Class II latch-up and JESD22 ESD standards.

What are the key timing parameters of the SN74GTLP817DGVR under distributed-load conditions?

Under distributed RLC load (19 Ω, 19 nH, 9 pF), the SN74GTLP817DGVR delivers tPLH/tPHL = 3.2 ns (AI→BO, fast ERC) and 4.4 ns (slow ERC), with tr/tf = 1.0 ns / 1.6 ns (fast) or 1.8 ns / 2.0 ns (slow). These values - derived from TI-SPICE models and validated against physical backplane test fixtures - ensure sub-5 ns propagation with controlled edge rates for optimal signal integrity in multi-slot systems.

How does the ERC pin affect the performance of the SN74GTLP817DGVR?

The ERC pin on the SN74GTLP817DGVR selects GTLP output (BO1/BO2) edge rate: ERC = GND enables fast edges (tr = 1.0 ns, tf = 1.6 ns), while ERC = VCC enables slower edges (tr = 1.8 ns, tf = 2.0 ns). This adjustment directly impacts backplane signal integrity - faster edges increase data rate but risk ringing on mismatched lines; slower edges improve noise margin and reduce EMI. The choice is system-dependent and requires measurement on the target backplane.

Can the SN74GTLP817DGVR be used with GTL (1.2 V VTT) instead of GTLP (1.5 V VTT)?

Yes, the SN74GTLP817DGVR is specified for both GTL (VTT = 1.2 V, VREF = 0.8 V) and GTLP (VTT = 1.5 V, VREF = 1.0 V) operation. While AC specifications are published only for GTLP, the device's architecture supports either standard. Users must adjust VTT and VREF accordingly and verify DC noise margins and output swing compliance per JESD8-3. No hardware change is needed - only biasing configuration.

SN74GTLP817DGVR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74GTLP
Package/Case:
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Translator Type:
Mixed Signal
Channel Type:
Bidirectional
Number of Circuits:
2
Channels per Circuit:
2, 6
Voltage - VCCA:
-
Voltage - VCCB:
-
Input Signal:
GTLP
Output Signal:
LVTTL
Output Type:
Tri-State, Inverted
Data Rate:
-
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-TFSOP (0.173", 4.40mm Width)

SN74GTLP817DGVR FAQ

1.How can I place an order for SN74GTLP817DGVR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74GTLP817DGVR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74GTLP817DGVR reliable?

The price and inventory of SN74GTLP817DGVR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74GTLP817DGVR is usually 5 days.

3.What payment methods are accepted for SN74GTLP817DGVR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74GTLP817DGVR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SN74GTLP817DGVR?

SN74GTLP817DGVR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74GTLP817DGVR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74GTLP817DGVR?

For technical support, including SN74GTLP817DGVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74GTLP817DGVR requirements.

6.How does Aetrix verify that SN74GTLP817DGVR is sourced from the original manufacturer or authorized distributors?

All SN74GTLP817DGVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74GTLP817DGVR meets industry standards.

7.What is the process for return or replacement of SN74GTLP817DGVR?

All SN74GTLP817DGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74GTLP817DGVR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74GTLP817DGVR part is unused and in its original packaging.

Return procedure for SN74GTLP817DGVR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SN74GTLP817DGVR Tags

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