Texas Instruments SN74GTLP817DGVR
- Part No.:
- SN74GTLP817DGVR
- Manufacturer:
- Texas Instruments
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
SN74GTLP817DGVR.pdf
- Description:
- IC TRANSLATOR BIDIR 24TVSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74GTLP817DGVR from Texas Instruments is a bidirectional GTLP-to-LVTTL fanout driver in a 24-pin TVSOP (DGV) package, supporting 1-to-6 GTLP-to-LVTTL translation and 1-to-2 LVTTL-to-GTLP translation with inverting polarity, ±12 mA LVTTL drive, 50 mA GTLP drive, and adjustable edge-rate control (ERC) for optimized backplane signal integrity.
For engineers reviewing the SN74GTLP817DGVR datasheet, SN74GTLP817DGVR pinout, SN74GTLP817DGVR application, or SN74GTLP817DGVR equivalent, this device is selected for high-speed backplane interfacing where GTLP noise margin, hot-insertion support, distributed-load timing, and dual-voltage-level translation are required.
Technical Context
The SN74GTLP817DGVR implements two independent translation paths: GTLP-to-LVTTL (1-to-6 fanout via AO1–AO6) and LVTTL-to-GTLP (1-to-2 fanout via BO1/BO2), both with inverting logic polarity. It uses separate ground pins (GNDT for TTL, GNDG for GTLP) and a dedicated VREF input to set differential GTLP receiver threshold.
Edge-rate control is implemented via the ERC pin, selecting between fast (ERC = GND) and slow (ERC = VCC) B-port rise/fall times - 1.0 ns / 1.6 ns (fast) or 1.8 ns / 2.0 ns (slow) under distributed RLC load - enabling tuning for specific backplane impedance and settling behavior.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Supply | 3.15 V to 3.45 V - powers LVTTL-side circuitry and enables Ioff hot-insertion protection |
| VTT Termination | 1.5 V (GTLP mode) - sets GTLP bus termination voltage and defines output swing & noise margin |
| VREF Input | 1.0 V (GTLP mode) - establishes differential GTLP receiver reference, critical for noise-immune backplane reception |
| AO Output Drive | ±12 mA - sufficient for driving multiple LVTTL loads without external buffering |
| BO Output Drive | 50 mA - supports incident-wave switching on heavily loaded backplanes down to 19 Ω equivalent impedance |
| Propagation Delay | 3.2 ns (AI→BO, fast ERC) - enables >300 MHz data rates on distributed backplane loads |
| Ioff Current | <10 µA at VCC = 0 - prevents backflow current during hot insertion, protecting powered-backplane systems |
Pinout & Package
SN74GTLP817DGVR is housed in a 24-pin Thin Very Small Outline Package (TVSOP), JEDEC MO-153 compliant, with 0.4 mm lead pitch, 4.4 mm width, and 7.8 mm length - optimized for high-density backplane interface cards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| AI | LVTTL input | Single LVTTL signal source for 1-to-2 GTLP fanout; 5-V tolerant |
| BI | GTLP input | Single GTLP signal source for 1-to-6 LVTTL fanout; referenced to VREF |
| AO1–AO6 | LVTTL outputs | Six inverted LVTTL copies of BI; each drives ±12 mA into LVTTL loads |
| BO1, BO2 | GTLP outputs | Two inverted GTLP copies of AI; jointly drive ≤11 Ω equivalent load when tied |
| OEAB | Output enable (A→B) | Active-low control for BO1/BO2; high-Z when high |
| OEBA | Output enable (B→A) | Active-low control for AO1–AO6; high-Z when high |
| ERC | Edge-rate control | Selects BO rise/fall time: GND = fast (1.0/1.6 ns), VCC = slow (1.8/2.0 ns) |
| VREF | GTLP reference | Differential input threshold setting for BI port; typically 1.0 V in GTLP mode |
| GNDT / GNDG | Separate grounds | Isolates TTL and GTLP return paths to minimize crosstalk and ground bounce |
Key Features
| Feature | Design Value |
|---|---|
| OEC™ circuitry | Reduces bus settling time and electromagnetic interference on multi-drop GTLP backplanes |
| Hot-insertion support | Ioff and power-up 3-state prevent damage and bus conflict during live card insertion |
| Variable edge-rate control | ERC pin dynamically adjusts BO output slew rate to match backplane impedance and reduce ringing |
| 5-V tolerant LVTTL inputs | AI, OEAB, OEBA, and ERC accept 0–5.5 V - compatible with TTL, CMOS, and mixed-voltage systems |
| Dual-ground architecture | Independent GNDT and GNDG pins suppress noise coupling between LVTTL and GTLP signal domains |
Applications
| Backplane Interfacing | Hot-Swap Server Backplanes |
|---|---|
Use Scenario: Connecting LVTTL-based processor cards to a high-speed GTLP backplane in telecom switching systems. IC Role / Device Role / Timing Role: Bidirectional level translator and fanout driver enabling protocol-transparent data routing between voltage domains. Use Value: Enables 300+ MHz signaling across 10-slot backplanes using incident-wave switching, validated per TI's RLC load model (Figure 3). | Use Scenario: Inserting/expanding compute blades in carrier-grade servers without powering down the backplane. IC Role / Device Role / Timing Role: Hot-insertion–qualified interface isolating unpowered blade logic from active GTLP bus. Use Value: Ioff <10 µA and power-up 3-state eliminate bus contention and backfeed current during live insertion. |
| High-Density Rack Systems | Test Equipment Backplanes |
Use Scenario: Fanout of a single GTLP clock or control signal to six LVTTL peripherals in compact rack-mounted controllers. IC Role / Device Role / Timing Role: GTLP-to-LVTTL 1-to-6 fanout driver with matched propagation delay across all AO outputs. Use Value: Sub-5 ns skew between AO1–AO6 ensures synchronous timing across multiple downstream devices. | Use Scenario: Reconfigurable instrumentation backplanes requiring adjustable signal integrity for varying cable lengths and terminations. IC Role / Device Role / Timing Role: ERC-controlled GTLP driver allowing real-time optimization of rise/fall time for minimal overshoot. Use Value: ERC selection reduces eye closure by >15% on 2-meter coaxial GTLP traces, per TI SPICE validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional GTLP/LVTTL translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74GTLP1396DGVR | 1-to-9 GTLP fanout (vs. 1-to-6); no LVTTL-to-GTLP path; fixed edge rate | Higher fanout needed; no bidirectional requirement | Choose when only GTLP fanout is required and higher channel count justifies larger footprint |
| SN74LVC8T245PW | 3.3-V LVC translator; no GTLP support; 32 mA drive; no ERC or OEC | Lower-speed, cost-sensitive LVTTL-to-LVTTL or LVTTL-to-3.3V systems | Choose for non-backplane, non-GTLP applications where ERC and GTLP noise margin are unnecessary |
Compared with SN74GTLP1396DGVR and SN74LVC8T245PW, the SN74GTLP817DGVR uniquely provides bidirectional GTLP/LVTTL translation with adjustable edge rate and OEC-optimized backplane timing - making it irreplaceable in legacy GTLP infrastructure requiring hot-swap and distributed-load performance.
Availability
SN74GTLP817DGVR is available at Aetrix Electronics and suitable for high-speed backplane interfacing, hot-swap server architectures, and test equipment design requiring stable component supply and long-term lifecycle continuity.
Supply support for SN74GTLP817DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic technologies, with over 50 years of innovation in high-speed interface solutions.
The SN74GTLP817DGVR belongs to TI's GTLP logic family, designed specifically for high-noise-margin, low-swing backplane communication in telecom, computing, and test equipment where legacy GTLP infrastructure remains in service.
FAQ
What is the primary function of the SN74GTLP817DGVR?
The SN74GTLP817DGVR is a bidirectional GTLP-to-LVTTL fanout driver providing 1-to-6 translation from GTLP to LVTTL and 1-to-2 translation from LVTTL to GTLP, both with inverting logic polarity. It supports hot insertion, adjustable edge-rate control via the ERC pin, and operates with separate GNDT and GNDG grounds to isolate signal domains. Its core function is enabling reliable, high-speed communication between LVTTL logic cards and GTLP backplanes.
Does the SN74GTLP817DGVR support hot-plug operation?
Yes, the SN74GTLP817DGVR fully supports hot-insertion applications through integrated Ioff and power-up 3-state circuitry. When VCC = 0 V, Ioff limits reverse current to <10 µA, preventing damage from backflow. During power-up/power-down (VCC between 0–1.5 V), outputs remain in high-impedance state, eliminating bus conflicts. These features are verified per JESD78 Class II latch-up and JESD22 ESD standards.
What are the key timing parameters of the SN74GTLP817DGVR under distributed-load conditions?
Under distributed RLC load (19 Ω, 19 nH, 9 pF), the SN74GTLP817DGVR delivers tPLH/tPHL = 3.2 ns (AI→BO, fast ERC) and 4.4 ns (slow ERC), with tr/tf = 1.0 ns / 1.6 ns (fast) or 1.8 ns / 2.0 ns (slow). These values - derived from TI-SPICE models and validated against physical backplane test fixtures - ensure sub-5 ns propagation with controlled edge rates for optimal signal integrity in multi-slot systems.
How does the ERC pin affect the performance of the SN74GTLP817DGVR?
The ERC pin on the SN74GTLP817DGVR selects GTLP output (BO1/BO2) edge rate: ERC = GND enables fast edges (tr = 1.0 ns, tf = 1.6 ns), while ERC = VCC enables slower edges (tr = 1.8 ns, tf = 2.0 ns). This adjustment directly impacts backplane signal integrity - faster edges increase data rate but risk ringing on mismatched lines; slower edges improve noise margin and reduce EMI. The choice is system-dependent and requires measurement on the target backplane.
Can the SN74GTLP817DGVR be used with GTL (1.2 V VTT) instead of GTLP (1.5 V VTT)?
Yes, the SN74GTLP817DGVR is specified for both GTL (VTT = 1.2 V, VREF = 0.8 V) and GTLP (VTT = 1.5 V, VREF = 1.0 V) operation. While AC specifications are published only for GTLP, the device's architecture supports either standard. Users must adjust VTT and VREF accordingly and verify DC noise margins and output swing compliance per JESD8-3. No hardware change is needed - only biasing configuration.
SN74GTLP817DGVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74GTLP
- Package/Case:
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Translator Type:
- Mixed Signal
- Channel Type:
- Bidirectional
- Number of Circuits:
- 2
- Channels per Circuit:
- 2, 6
- Voltage - VCCA:
- -
- Voltage - VCCB:
- -
- Input Signal:
- GTLP
- Output Signal:
- LVTTL
- Output Type:
- Tri-State, Inverted
- Data Rate:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFSOP (0.173", 4.40mm Width)
SN74GTLP817DGVR FAQ
1.How can I place an order for SN74GTLP817DGVR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74GTLP817DGVR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74GTLP817DGVR reliable?
The price and inventory of SN74GTLP817DGVR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74GTLP817DGVR is usually 5 days.
3.What payment methods are accepted for SN74GTLP817DGVR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74GTLP817DGVR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74GTLP817DGVR?
SN74GTLP817DGVR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74GTLP817DGVR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74GTLP817DGVR?
For technical support, including SN74GTLP817DGVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74GTLP817DGVR requirements.
6.How does Aetrix verify that SN74GTLP817DGVR is sourced from the original manufacturer or authorized distributors?
All SN74GTLP817DGVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74GTLP817DGVR meets industry standards.
7.What is the process for return or replacement of SN74GTLP817DGVR?
All SN74GTLP817DGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74GTLP817DGVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74GTLP817DGVR part is unused and in its original packaging.
Return procedure for SN74GTLP817DGVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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