Texas Instruments SN74GTLP817DW

Overview

SN74GTLP817DW from Texas Instruments is a bidirectional GTLP-to-LVTTL fanout driver with 1-to-6 GTLP-to-LVTTL and 1-to-2 LVTTL-to-GTLP translation, medium-drive GTLP outputs (50 mA), ±12 mA LVTTL outputs, and adjustable edge-rate control (ERC) for optimized signal integrity on distributed backplanes. It enables high-speed communication between LVTTL cards and GTLP backplanes in telecom and computing systems.

For engineers reviewing the SN74GTLP817DW datasheet, SN74GTLP817DW pinout, SN74GTLP817DW application, or SN74GTLP817DW equivalent, key selection criteria include its dual-direction level translation capability, hot-insertion support via Ioff and power-up 3-state, 24-pin SOIC (DW) package, ERC-adjustable B-port edge rates (1.0–2.5 ns rise/fall), and compliance with JESD 8-3 GTLP standard at VTT = 1.5 V / VREF = 1 V.

Technical Context

The SN74GTLP817DW implements two independent translation paths: GTLP-to-LVTTL (1-to-6 fanout, inverted, controlled by OEBA) and LVTTL-to-GTLP (1-to-2 fanout, inverted, controlled by OEAB). Its OEC™ circuitry minimizes bus settling time and supports incident-wave switching into backplane loads as low as 11 Ω when BO1/BO2 are paralleled.

It features separate GNDT (TTL output ground) and GNDG (GTLP output ground) pins to reduce high-speed switching noise, and supports both GTL (VTT = 1.2 V) and GTLP (VTT = 1.5 V) signaling standards. ERC input selects fast (GND) or slow (VCC) B-port edge rates, enabling tuning for data-transfer rate vs. signal integrity trade-offs in real-world backplane topologies.

Key Specifications

Pinout & Package

SN74GTLP817DW uses a 24-pin SOIC (DW) package per JEDEC MO-153, with 7.70 mm × 12.80 mm body dimensions, 1.20 mm max height, and 0.65 mm lead pitch. Distributed VCC/GND pins minimize simultaneous switching noise.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional GTLP/LVTTL translation applications.

Compared with SN74GTLP1396DW and SN74GTL16622DGGR, the SN74GTLP817DW uniquely combines bidirectional translation, ERC adjustability, and robust hot-insertion support in a compact 24-pin SOIC - making it optimal for modular, mixed-signal backplane architectures requiring design flexibility and field-serviceability.

Availability

SN74GTLP817DW is available at Aetrix Electronics and suitable for telecom backplane interfaces, high-speed computing modules, and industrial PLC backplanes requiring stable component supply, long-term lifecycle management, and traceable sourcing.

Supply support for SN74GTLP817DW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 50 years of innovation in high-speed interface technologies.

The SN74GTLP817DW belongs to TI's GTLP logic family, designed specifically for high-reliability, high-speed backplane interconnects in telecom infrastructure, enterprise computing, and modular instrumentation systems.

FAQ

What is the primary function of the SN74GTLP817DW?

The SN74GTLP817DW is a bidirectional fanout driver that translates signals between GTLP (1.5 V VTT) and LVTTL (3.3 V) logic families. It provides 1-to-6 GTLP-to-LVTTL translation and 1-to-2 LVTTL-to-GTLP translation in a single 24-pin SOIC package, supporting high-speed backplane interconnects with adjustable edge-rate control and hot-insertion capability.

Does the SN74GTLP817DW support hot insertion?

Yes, the SN74GTLP817DW supports hot insertion via integrated Ioff and power-up 3-state circuitry. When VCC is at 0 V, Ioff disables all outputs to prevent damaging current backflow. During power-up or power-down (VCC = 0–1.5 V), outputs remain in high-impedance state, eliminating bus conflicts - a critical feature for modular telecom and test equipment systems using the SN74GTLP817DW.

How does the ERC pin affect SN74GTLP817DW performance?

The ERC (Edge-Rate Control) pin on the SN74GTLP817DW selects GTLP output edge speed: tying ERC to GND enables fast edges (~1.0 ns rise/fall), optimizing for maximum data rate; tying ERC to VCC enables slower edges (~2.5 ns), improving signal integrity on lossy or unterminated backplanes. This real-time tuning allows designers to balance timing margin and reflection control without hardware changes to the SN74GTLP817DW layout.

What are the ground pin configurations on the SN74GTLP817DW?

The SN74GTLP817DW uses separate ground pins: GNDT (pins 3, 7, 11, 12, 24) for LVTTL outputs and GNDG (pins 15, 17, 21) for GTLP outputs. This dual-ground architecture isolates return currents, minimizing ground bounce and crosstalk between logic domains - a key design feature confirmed in the SN74GTLP817DW datasheet for noise-sensitive backplane applications.

Can the SN74GTLP817DW operate with GTL (1.2 V) instead of GTLP (1.5 V) signaling?

Yes, the SN74GTLP817DW is specified for both GTL (VTT = 1.2 V, VREF = 0.8 V) and GTLP (VTT = 1.5 V, VREF = 1.0 V) standards per JESD 8-3. While AC specifications are guaranteed only at GTLP, the device's input thresholds and output drive are compatible with GTL operation - allowing system designers to use the same SN74GTLP817DW across multiple backplane voltage schemes without redesign.