Texas Instruments SN74GTLP817DWR

Overview

SN74GTLP817DWR from Texas Instruments is a bidirectional GTLP-to-LVTTL fanout driver with 1-to-6 GTLP-to-LVTTL and 1-to-2 LVTTL-to-GTLP translation, medium-drive GTLP outputs (50 mA), ±12 mA LVTTL outputs, and variable edge-rate control (ERC) for optimized signal integrity on distributed backplanes. It enables high-speed communication between LVTTL cards and GTLP backplanes in telecom and computing infrastructure.

For engineers reviewing the SN74GTLP817DWR datasheet, SN74GTLP817DWR pinout, SN74GTLP817DWR application, or SN74GTLP817DWR equivalent, key selection criteria include GTLP/LVTTL bidirectional level translation capability, ERC-adjustable B-port rise/fall times (1.0–2.5 ns), hot-insertion support via Ioff and power-up 3-state, 3.15–3.45 V VCC operation, and SOIC-24 DW package compatibility.

Technical Context

The SN74GTLP817DWR implements dual-path bidirectional translation: GTLP-to-LVTTL (1-to-6 fanout, inverted, OEBA-controlled) and LVTTL-to-GTLP (1-to-2 fanout, inverted, OEAB-controlled). Its OEC™ circuitry minimizes bus settling time across distributed RLC backplane loads down to 11 Ω equivalent impedance.

It supports two GTLP operating modes (VTT = 1.2 V/GTL or 1.5 V/GTLP) with corresponding VREF = 0.8 V or 1.0 V, while A-port inputs and controls remain 5-V tolerant. ERC input selects fast (GND) or slow (VCC) B-port edge rates, directly tuning propagation delay (3.2–4.4 ns typical into RLC load) and EMI performance.

Key Specifications

Pinout & Package

SN74GTLP817DWR uses a 24-pin SOIC (DW) package with 300-mil body width, 1.27-mm lead pitch, and JEDEC MO-153 compliance. Distributed V_CC and GND pins minimize high-speed switching noise; separate GND_T (TTL) and GND_G (GTLP) grounds enable quiet mixed-signal operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional GTLP/LVTTL translation applications.

Compared with SN74GTLP1396DWR and SN74GTLP1850PWR, SN74GTLP817DWR uniquely balances fanout flexibility (6 LVTTL + 2 GTLP), precise edge-rate tuning via ERC, and superior thermal performance in SOIC-24-making it optimal for timing-critical, thermally constrained backplane interfaces.

Availability

SN74GTLP817DWR is available at Aetrix Electronics and suitable for telecom backplane interfaces, modular computing chassis, high-density data center switch fabrics, and industrial PLC backplanes requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for SN74GTLP817DWR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 50 years of innovation in high-speed interface ICs and industrial-grade components.

The SN74GTLP817DWR belongs to TI's GTLP logic family, designed specifically for high-speed, low-noise backplane interconnect in telecom, computing, and industrial systems requiring robust hot-swap capability and precise signal integrity control.

FAQ

What is the primary function of the SN74GTLP817DWR in a backplane system?

The SN74GTLP817DWR serves as a bidirectional GTLP-to-LVTTL level translator and fanout driver. It converts LVTTL signals from cards to GTLP levels for transmission across the backplane (1-to-2 fanout) and regenerates GTLP signals from the backplane to LVTTL for local processing (1-to-6 fanout). Its OEC™ circuitry and ERC input ensure signal integrity across distributed loads, making SN74GTLP817DWR essential for high-speed, noise-sensitive telecom and computing backplanes.

How does the ERC pin affect timing performance of the SN74GTLP817DWR?

The ERC pin on the SN74GTLP817DWR selects B-port output edge rate: ERC = GND yields fast rise/fall times (~1.0 ns / ~1.6 ns), minimizing propagation delay (3.2 ns typical into RLC load); ERC = VCC yields slower edges (~1.8 ns / ~2.0 ns), reducing EMI and improving noise margin. This allows designers to tune SN74GTLP817DWR behavior to match specific backplane impedance and length without hardware changes.

Can the SN74GTLP817DWR operate with both GTL and GTLP voltage standards?

Yes, the SN74GTLP817DWR supports both GTL (VTT = 1.2 V, VREF = 0.8 V) and GTLP (VTT = 1.5 V, VREF = 1.0 V) standards. The device's AC specifications are guaranteed for GTLP, but its architecture allows full functionality at GTL levels. VREF must be set accordingly, and SN74GTLP817DWR maintains specified drive strength and timing across both configurations.

What grounding configuration is required for optimal noise performance of the SN74GTLP817DWR?

SN74GTLP817DWR requires separate GND_T (for LVTTL outputs AO1–AO6) and GND_G (for GTLP outputs BO1/BO2) connections to minimize ground bounce coupling between logic domains. These grounds should be tied together at a single point near the device or at the system star ground. This dual-ground architecture is critical to achieving SN74GTLP817DWR's specified noise immunity and jitter performance.

Does the SN74GTLP817DWR support hot insertion, and how is it implemented?

Yes, SN74GTLP817DWR fully supports hot insertion via two mechanisms: I_off circuitry disables outputs when V_CC = 0 V (limiting leakage to ≤10 µA), and power-up 3-state holds all outputs in high-impedance until V_CC exceeds 1.5 V. This prevents bus conflicts and damaging current flow during live card insertion-verified per JESD78 Class II latch-up and JESD22 ESD standards. SN74GTLP817DWR is qualified for this use case across its full –40°C to 85°C operating range.