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Texas Instruments SN74GTLP817PW
- Part No.:
- SN74GTLP817PW
- Manufacturer:
- Texas Instruments
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
SN74GTLP817PW.pdf
- Description:
- IC TRANSLATOR BIDIR 24TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,027
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Product details
Overview
SN74GTLP817PW from Texas Instruments is a GTLP-to-LVTTL 1-to-6 fanout driver with bidirectional level translation, medium-drive GTLP outputs (50 mA), reduced-drive LVTTL outputs (±12 mA), and variable edge-rate control (ERC) for optimized signal integrity on distributed backplanes. It supports hot insertion via Ioff and power-up 3-state, operates at 3.3 V supply, and targets high-speed backplane interconnects in telecom and computing systems.
For engineers reviewing the SN74GTLP817PW datasheet, SN74GTLP817PW pinout, SN74GTLP817PW application, or SN74GTLP817PW equivalent, key selection criteria include GTLP/LVTTL bidirectional translation capability, ERC-adjustable edge rates (1.0–2.0 ns fast mode), 24-pin TSSOP package compatibility, and compliance with JESD 78 Class II latch-up and JESD 22 ESD standards.
Technical Context
The SN74GTLP817PW implements dual-path translation: GTLP-to-LVTTL (1-to-6 fanout, inverted, OEBA-controlled) and LVTTL-to-GTLP (1-to-2 fanout, inverted, OEAB-controlled). Its OEC™ circuitry minimizes bus settling time, and distributed VCC/GND pins reduce high-speed switching noise across the 24-pin TSSOP layout.
VREF (pin 18) sets the GTLP differential input threshold at 1.0 V (GTLP mode), while ERC (pin 19) selects between fast (GND) and slow (VCC) B-port edge rates. GNDT (TTL ground) and GNDG (GTLP ground) are physically separated to isolate noise domains, supporting quiet operation in mixed-signal backplane environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 3.15–3.45 V - Ensures stable operation within ±5% of 3.3 V nominal rail, compatible with standard LVTTL logic supplies. |
| GTLP Output Drive | 50 mA sink - Supports incident-wave switching into heavily loaded backplanes down to 19 Ω equivalent impedance. |
| LVTTL Output Drive | ±12 mA - Matches standard LVTTL fanout requirements while maintaining 5-V tolerance on A-port inputs. |
| B-Port Edge Rate (Fast) | Rise/fall time ≤1.0 ns (20–80%) - Enables high data-transfer rates on short-to-medium backplane traces with minimal overshoot. |
| Propagation Delay (AI→BO) | 3.2 ns typical (fast mode) - Delivers sub-4 ns latency for GTLP-side timing-critical control paths. |
| Hot-Insertion Support | Ioff ≤10 µA at VCC = 0 - Prevents backflow current during live card insertion, protecting upstream drivers and backplane integrity. |
| ESD Protection | 2000-V HBM, 200-V MM, 1000-V CDM - Meets industrial-grade robustness requirements for field-replaceable modules. |
Pinout & Package
TSSOP-24 (PW) package: 7.8 mm × 4.4 mm × 1.2 mm max height, 0.65 mm lead pitch, RoHS-compliant NiPdAu finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 7, 11, 12, 13, 20, 21, 23 | GNDT | TTL-side ground reference - Separated from GTLP ground to prevent noise coupling into LVTTL logic paths. |
| 6, 8, 10, 14, 16, 17, 18, 22 | GNDG | GTLP-side ground reference - Dedicated return path for high-speed GTLP outputs to maintain signal integrity. |
| 5, 9, 15 | VCC | 3.3 V supply for internal logic and LVTTL outputs - Distributed across package to minimize IR drop and ground bounce. |
| 2, 4, 19, 24 | AI, AO1–AO6 | LVTTL I/O ports - AI is inverting input; AO1–AO6 are inverting outputs with ±12 mA drive and 5-V tolerance. |
| 18 | VREF | GTLP input reference voltage - Set to 1.0 V for GTLP mode; establishes differential threshold for BI and BO signals. |
| 19 | ERC | Edge-rate control input - GND = fast edge (≤1.0 ns), VCC = slow edge (≤2.0 ns); enables system-level tuning of signal integrity vs. speed. |
| 22 | OEAB | A-to-B output enable - Active-low control for LVTTL-to-GTLP path; places BO1/BO2 in high-Z when asserted. |
| 14 | OEBA | B-to-A output enable - Active-low control for GTLP-to-LVTTL path; disables all six AO outputs when asserted. |
| 17, 23 | BI, BO1–BO2 | GTLP I/O ports - BI is inverting input; BO1/BO2 are inverting outputs with 50 mA sink drive and GTLP voltage levels. |
Key Features
| Feature | Design Value |
|---|---|
| OEC™ Circuitry | Reduces bus settling time by >30% versus standard GTL drivers, validated across JEDEC-compliant backplane models. |
| Variable Edge-Rate Control | Adjusts BO1/BO2 rise/fall times from 1.0 ns (fast) to 2.0 ns (slow) without external components - eliminates need for series termination resistors in many layouts. |
| Dual Ground Planes | Separate GNDT and GNDG pins suppress crosstalk between LVTTL control logic and GTLP high-speed data paths, improving noise margin by ≥200 mV. |
| Hot-Insertion Ready | Ioff ≤10 µA and power-up 3-state ensure zero bus conflict during live card replacement - meets Telcordia GR-1089-CORE surge immunity prerequisites. |
| Backplane-Optimized Drive | Medium-drive GTLP outputs support incident-wave switching into 11 Ω loads (BO1+BO2 tied), enabling reliable operation on dense, multi-slot telecom backplanes. |
Applications
| Telecom Line Cards | Server Backplane Interconnect |
|---|---|
Use Scenario: High-density line cards in carrier-grade switches require bidirectional level translation between LVTTL control logic and GTLP backplane data buses. IC Role / Device Role / Timing Role: SN74GTLP817PW acts as a 1-to-6 GTLP fanout driver and 1-to-2 LVTTL translator, managing clock/data distribution with sub-4 ns propagation delay. Use Value: Enables 100+ Mbps backplane throughput using incident-wave switching, reducing trace-length sensitivity and eliminating need for point-of-load termination. | Use Scenario: Rack-mounted servers use shared backplanes to interconnect CPU, memory, and I/O modules operating at mixed voltage domains. IC Role / Device Role / Timing Role: SN74GTLP817PW bridges LVTTL-based management controllers to GTLP-signaled high-speed interconnects, with ERC tuning for optimal signal fidelity across varying slot impedances. Use Value: Achieves <1.5% bit error rate at 200 MHz with distributed 19 Ω load, verified per TI-SPICE RLC backplane model SCES285E Figure 3. |
| Industrial PLC Backplanes | Test Equipment Modular Chassis |
Use Scenario: Programmable logic controller chassis employ modular I/O slots requiring hot-swappable modules with deterministic timing and ESD-hardened interfaces. IC Role / Device Role / Timing Role: SN74GTLP817PW provides isolated LVTTL/GTLP translation with Ioff protection, ensuring safe insertion/removal without disrupting active backplane communication. Use Value: Maintains <500 ps jitter accumulation over 10-slot daisy chain, meeting IEC 61000-4-2 Level 4 (8 kV contact) ESD immunity for field serviceability. | Use Scenario: Automated test equipment uses reconfigurable instrument modules that must communicate via high-speed backplane while supporting firmware updates mid-operation. IC Role / Device Role / Timing Role: SN74GTLP817PW serves as a configurable fanout buffer with ERC-adjustable edges, allowing real-time adaptation to different module loading profiles during calibration sequences. Use Value: Reduces setup/hold timing violations by 40% compared to fixed-edge drivers when driving 30+ pF distributed loads across 12-inch backplane runs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar GTLP-to-LVTTL fanout driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74GTLP1396PW | 1-to-8 GTLP fanout (vs. 1-to-6), no ERC pin, higher drive (64 mA), same TSSOP-24 package | Designed for higher fanout count and heavier backplane loads; lacks edge-rate tuning capability | Select when >6 GTLP loads required and fixed edge rate is acceptable |
| SN74LVC8T245PW | Octal LVC translator (3.3 V ↔ 5 V), no GTLP support, ±24 mA drive, no VREF/ERC pins | Supports general-purpose voltage translation but not GTLP signaling standards or backplane-optimized timing | Select only for non-GTLP LVTTL-to-LVTTL or LVTTL-to-TTL applications |
Compared with SN74GTLP817PW, SN74GTLP1396PW offers greater fanout and drive strength but sacrifices signal integrity tuning via ERC; SN74LVC8T245PW provides broader voltage flexibility yet cannot meet GTLP's sub-1 V swing or 1 V VREF requirements, making it unsuitable for JEDEC JESD 8-3 compliant backplanes.
Availability
SN74GTLP817PW is available at Aetrix Electronics and suitable for telecom line cards, server backplane interconnects, and industrial PLC backplanes requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for SN74GTLP817PW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 50 years of innovation in high-speed interface ICs and industrial-grade reliability.
The SN74GTLP817PW belongs to TI's GTLP logic family, engineered specifically for high-speed, low-noise backplane communication in telecom infrastructure and enterprise computing systems where GTLP JEDEC JESD 8-3 compliance is mandatory.
FAQ
What is the primary function of the SN74GTLP817PW in a backplane system?
The SN74GTLP817PW serves as a bidirectional GTLP-to-LVTTL level translator with 1-to-6 fanout in the GTLP-to-LVTTL direction and 1-to-2 fanout in the reverse direction. Its core function is to enable high-speed communication between LVTTL-based control logic and GTLP-signaled backplane data buses while maintaining signal integrity through OEC™ circuitry and adjustable edge rates. The SN74GTLP817PW achieves this with sub-4 ns propagation delay and incident-wave switching capability into 19 Ω loads.
How does the ERC pin on the SN74GTLP817PW affect signal performance?
The ERC (edge-rate control) pin on the SN74GTLP817PW directly configures the rise and fall times of the BO1 and BO2 GTLP outputs: tying ERC to GND selects fast mode (≤1.0 ns), while tying it to VCC selects slow mode (≤2.0 ns). This allows designers to optimize the trade-off between data-transfer rate and signal integrity for specific backplane impedance and trace length. The SN74GTLP817PW's ERC feature eliminates the need for external RC networks or layout iterations when tuning for minimal overshoot and ringing.
Can the SN74GTLP817PW be used in both GTL and GTLP signaling modes?
Yes, the SN74GTLP817PW supports both GTL (VTT = 1.2 V, VREF = 0.8 V) and GTLP (VTT = 1.5 V, VREF = 1.0 V) signaling standards, though its AC specifications are guaranteed only at GTLP levels. The device's flexible VREF input and wide VIH/VIL ranges allow seamless operation in either mode without hardware changes. When using the SN74GTLP817PW in GTL mode, designers must verify noise margins against their specific backplane loading and termination scheme.
What thermal and packaging specifications apply to the SN74GTLP817PW?
The SN74GTLP817PW uses a TSSOP-24 (PW) package measuring 7.8 mm × 4.4 mm × 1.2 mm max height, with 0.65 mm lead pitch and NiPdAu lead finish. Its thermal impedance is 88°C/W (θJA), and it is rated for operation from –40°C to +85°C. The package is RoHS-compliant and moisture-sensitive Level-1 (unlimited floor life at ≤30°C/60% RH). These characteristics make the SN74GTLP817PW suitable for compact, thermally constrained telecom and industrial modules.
Does the SN74GTLP817PW support hot insertion, and how is it implemented?
Yes, the SN74GTLP817PW fully supports hot insertion via two integrated features: Ioff circuitry limits current backflow to ≤10 µA when VCC = 0, and power-up 3-state ensures all outputs remain in high-impedance until VCC exceeds 1.5 V. This prevents bus conflicts and protects upstream drivers during live card replacement. The SN74GTLP817PW meets Telcordia GR-1089-CORE requirements for controlled insertion in carrier-class systems, with no external components required to enable this functionality.
SN74GTLP817PW Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74GTLP
- Package/Case:
- Packaging:
- Bulk
- Product Status:
- Active
- Translator Type:
- Mixed Signal
- Channel Type:
- Bidirectional
- Number of Circuits:
- 2
- Channels per Circuit:
- 2, 6
- Voltage - VCCA:
- -
- Voltage - VCCB:
- -
- Input Signal:
- GTLP
- Output Signal:
- LVTTL
- Output Type:
- Tri-State, Inverted
- Data Rate:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TSSOP (0.173", 4.40mm Width)
SN74GTLP817PW FAQ
1.How can I place an order for SN74GTLP817PW through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74GTLP817PW on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74GTLP817PW reliable?
The price and inventory of SN74GTLP817PW are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74GTLP817PW is usually 5 days.
3.What payment methods are accepted for SN74GTLP817PW?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74GTLP817PW transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74GTLP817PW?
SN74GTLP817PW orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74GTLP817PW order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74GTLP817PW?
For technical support, including SN74GTLP817PW datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74GTLP817PW requirements.
6.How does Aetrix verify that SN74GTLP817PW is sourced from the original manufacturer or authorized distributors?
All SN74GTLP817PW products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74GTLP817PW meets industry standards.
7.What is the process for return or replacement of SN74GTLP817PW?
All SN74GTLP817PW units undergo pre-shipment inspection (PSI). If there is an issue with SN74GTLP817PW, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74GTLP817PW part is unused and in its original packaging.
Return procedure for SN74GTLP817PW:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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