Texas Instruments SN74GTLP817PWR

Overview

SN74GTLP817PWR from Texas Instruments is a bidirectional GTLP-to-LVTTL fanout driver with 1-to-6 GTLP-to-LVTTL and 1-to-2 LVTTL-to-GTLP translation, medium-drive GTLP outputs (50 mA), ±12 mA LVTTL outputs, and adjustable edge-rate control (ERC) for optimized signal integrity on distributed backplanes. It enables high-speed communication between LVTTL cards and GTLP backplanes in telecom and computing systems.

For engineers reviewing the SN74GTLP817PWR datasheet, SN74GTLP817PWR pinout, SN74GTLP817PWR application, or SN74GTLP817PWR equivalent, key selection factors include its dual-direction level translation capability, ERC-adjustable rise/fall times (1.0–2.5 ns fast/slow), hot-insertion support via Ioff and power-up 3-state, 24-pin TSSOP package, and compliance with GTLP (VTT = 1.5 V, VREF = 1 V) and GTL (VTT = 1.2 V, VREF = 0.8 V) standards.

Technical Context

This device implements two independent translation paths: GTLP-to-LVTTL (1-to-6 fanout, inverted, controlled by OEBA) and LVTTL-to-GTLP (1-to-2 fanout, inverted, controlled by OEAB). The B-port (GTLP side) uses differential inputs referenced to VREF and supports adjustable edge rates via the ERC pin (GND = fast, VCC = slow).

It features separated ground pins (GNDT for TTL outputs, GNDG for GTLP outputs), distributed VCC/GND layout to suppress switching noise, and OEC™ circuitry that reduces bus settling time and EMI. Hot-insertion is supported by Ioff (≤10 µA at VCC = 0) and power-up 3-state behavior across –40°C to 85°C.

Key Specifications

Pinout & Package

SN74GTLP817PWR is housed in a 24-pin TSSOP (PW) package per JEDEC MO-153, with 0.65 mm lead pitch, body dimensions 7.9 × 4.5 mm, and thermal resistance θJA = 88°C/W.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional GTLP/LVTTL interface applications.

Compared with SN74GTLP1396PWR and SN74GTL16622DGGR, the SN74GTLP817PWR uniquely delivers balanced bidirectional translation in a compact 24-pin package with full hot-insertion support and user-adjustable edge rates - making it optimal for modular, mixed-signal backplane architectures requiring both control and data flow.

Availability

SN74GTLP817PWR is available at Aetrix Electronics and suitable for telecom backplane interfaces, industrial PLC chassis, and high-density computing systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for SN74GTLP817PWR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of innovation in high-speed interface technology.

The SN74GTLP817PWR belongs to TI's GTLP logic family, engineered specifically for high-reliability, high-speed backplane interconnect in telecom, computing, and industrial systems demanding robust level translation and hot-swap capability.

FAQ

What is the primary function of the SN74GTLP817PWR in a backplane system?

The SN74GTLP817PWR serves as a bidirectional level translator and fanout driver between LVTTL logic domains (e.g., processor cards) and GTLP backplanes. It provides 1-to-6 GTLP-to-LVTTL translation for data reads and 1-to-2 LVTTL-to-GTLP translation for control writes, all within a single 24-pin TSSOP package. Its medium-drive GTLP outputs and ERC pin allow designers to tune signal integrity for specific backplane loads - a core requirement in telecom and modular computing infrastructure where the SN74GTLP817PWR is deployed.

How does the ERC pin affect the performance of the SN74GTLP817PWR?

The ERC (Edge-Rate Control) pin on the SN74GTLP817PWR directly configures the rise and fall times of the BO1 and BO2 GTLP outputs: tying ERC to GND selects fast edge rates (1.0 ns rise, 1.6 ns fall), while tying it to VCC selects slow rates (1.8 ns rise, 2.0 ns fall). This hardware-selectable feature allows system designers to balance data-transfer speed against signal integrity and EMI on real-world distributed backplanes - a capability confirmed in TI's SCES285E datasheet for the SN74GTLP817PWR and critical for meeting timing margins in high-speed chassis designs.

Does the SN74GTLP817PWR support hot insertion, and how is it implemented?

Yes, the SN74GTLP817PWR fully supports hot insertion per JESD78 Class II latch-up and TI's hot-insertion specifications. It achieves this through two integrated mechanisms: Ioff circuitry that limits current to ≤10 µA when VCC = 0, preventing damaging backflow during partial power-down; and power-up 3-state logic that holds all outputs in high-impedance until VCC exceeds 1.5 V. These features are explicitly verified in the "hot-insertion specifications" section of the SN74GTLP817PWR datasheet and make it suitable for carrier-grade modular systems where field-replaceable units must be swapped without powering down the entire chassis.

What are the voltage level requirements for GTLP operation of the SN74GTLP817PWR?

For GTLP operation, the SN74GTLP817PWR requires VTT = 1.5 V ±0.15 V and VREF = 1.0 V ±0.13 V, as specified in the "recommended operating conditions" table of its datasheet. These values define the GTLP signaling standard (a TI derivative of JEDEC JESD8-3), ensuring proper receiver thresholding and noise margin. The device also supports GTL mode (VTT = 1.2 V, VREF = 0.8 V), but all AC specifications in the SN74GTLP817PWR datasheet are guaranteed only at GTLP levels. VCC must remain within 3.15–3.45 V regardless of GTL/GTLP selection.

Why does the SN74GTLP817PWR have separate GNDT and GNDG pins?

The SN74GTLP817PWR includes physically separated GNDT (TTL output ground) and GNDG (GTLP output ground) pins to isolate noise coupling between the LVTTL and GTLP signal domains. This separation prevents switching transients from high-speed GTLP outputs from corrupting sensitive LVTTL logic thresholds and vice versa - a design necessity for maintaining signal integrity in mixed-voltage backplane systems. The datasheet confirms this layout strategy minimizes high-speed switching noise, and the SN74GTLP817PWR's pinout places these grounds adjacent to their respective output banks to enforce clean return paths.