Texas Instruments SN74HC367DR

Overview

SN74HC367DR from Texas Instruments is a hex buffer and line driver IC with 3-state outputs, configured as two independent banks (4-channel + 2-channel), each controlled by its own active-low output-enable pin (1OE, 2OE). It operates from 2 V to 6 V, delivers ±6 mA output drive at 5 V, and achieves typical propagation delay of 10 ns - enabling reliable bus interfacing and memory address buffering in industrial control and embedded systems.

For engineers reviewing the SN74HC367DR datasheet, SN74HC367DR pinout, SN74HC367DR application, or SN74HC367DR equivalent, key selection considerations include its dual-bank 3-state architecture, SOIC-16 package compatibility, guaranteed 80 µA max ICC, high-current drive capability, and operating temperature range of –40°C to +85°C.

Technical Context

The SN74HC367DR implements CMOS-based hex buffering with true (non-inverting) logic outputs and independent 3-state control per bank. Its functional modes are strictly defined by OE inputs: when low, data passes from A inputs to Y outputs; when high, outputs enter high-impedance state - critical for bidirectional bus management.

This device supports load driving up to 15 LSTTL loads and features low input current (≤1 µA), tight voltage thresholds (VIH = 3.15 V min at VCC = 4.5 V), and robust switching characteristics validated at CL = 50 pF and CL = 150 pF across supply voltages of 2 V, 4.5 V, and 6 V.

Key Specifications

Pinout & Package

SN74HC367DR is housed in a 16-pin SOIC (D) package measuring 9.90 mm × 3.90 mm with 1.27 mm lead pitch. The package is RoHS-compliant, moisture sensitivity level 1, and rated for reflow up to 260°C.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar hex buffer with 3-state output applications.

Compared with SN74HCT367DR and 74LCX367MTCX, SN74HC367DR provides the broadest supply voltage flexibility (2–6 V), highest noise immunity in CMOS systems, and proven reliability in industrial temperature cycling - making it the default choice for general-purpose 3-state bus buffering where voltage agility and load drive are primary concerns.

Availability

SN74HC367DR is available at Aetrix Electronics and suitable for industrial PLC I/O expansion, embedded microcontroller bus interface, and automotive body control module applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.

Supply support for SN74HC367DR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of heritage in high-reliability logic families including the 74HC series.

The SN74HC367DR belongs to TI's industry-standard 74HC logic product line, designed specifically to deliver robust 3-state buffering for memory address drivers, clock distribution networks, and bus-oriented receivers/transmitters in industrial and automotive systems.

FAQ

What is the maximum capacitive load SN74HC367DR can drive while maintaining specified tpd?

SN74HC367DR maintains guaranteed switching characteristics up to 150 pF, with tpd ≤ 25 ns max at VCC = 6 V. At 50 pF, typical tpd is 10 ns. Exceeding 150 pF increases propagation delay nonlinearly and may violate setup/hold timing in synchronous systems - TI recommends verifying timing margins using the load circuit in Figure 6-1 of the SN74HC367DR datasheet.

Does SN74HC367DR support partial power-down or I²C bus compatibility?

No, SN74HC367DR does not support partial power-down or I²C bus compatibility. It is a standard CMOS hex buffer with 3-state outputs and requires both VCC and GND to be powered for operation. Its outputs are push-pull, not open-drain, and lack built-in slew-rate control or bus arbitration logic required for I²C. For I²C applications, dedicated bus buffers like TCA9517A should be used instead of SN74HC367DR.

How should unused inputs be handled on SN74HC367DR to ensure stable operation?

All unused inputs on SN74HC367DR must be terminated to a valid logic level - either VCC or GND - to prevent floating states that cause excessive ICC, oscillation, or undefined output behavior. TI's application report SCBA004 explicitly mandates this. Leaving inputs unconnected violates recommended operating conditions and risks latch-up or increased electromagnetic emissions in the final SN74HC367DR application.

Is SN74HC367DR pin-compatible with SN74LS367N?

No, SN74HC367DR is not pin-compatible with SN74LS367N. While both are hex buffers with 3-state outputs, SN74LS367N uses a different pinout: its OE pins are located at pins 1 and 16, whereas SN74HC367DR places 1OE at pin 1 and 2OE at pin 15. Additionally, SN74LS367N is TTL-based, requires 5 V only, and draws significantly higher ICC - direct substitution would require PCB redesign and logic-level validation.

What is the thermal resistance (RθJA) of SN74HC367DR in its SOIC package?

The junction-to-ambient thermal resistance (RθJA) of SN74HC367DR in the SOIC (D) package is 73°C/W, as specified in Section 5.3 of the official datasheet. This value assumes standard JEDEC 2-layer board conditions (1-inch² copper pad, 2 oz Cu). Actual thermal performance in end equipment depends on PCB layout, airflow, and adjacent heat sources - TI recommends verifying junction temperature using TJ = TA + (RθJA × PD) during worst-case power dissipation analysis for the SN74HC367DR.