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Texas Instruments SN74HC367PW
- Part No.:
- SN74HC367PW
- Manufacturer:
- Texas Instruments
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74HC367PW.pdf
- Description:
- IC BUFFER NON-INVERT 6V 16TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:215
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Product details
Overview
SN74HC367PW from Texas Instruments is a hex buffer and line driver IC with 3-state outputs, organized as two independent banks (4-line + 2-line), each controlled by its own active-low output-enable pin (1OE, 2OE). It operates from 2 V to 6 V, delivers ±6 mA output drive at 5 V, exhibits typical propagation delay of 10 ns, and draws ≤80 µA ICC - enabling reliable bus interfacing in memory address buffering and clock distribution systems.
For engineers reviewing the SN74HC367PW datasheet, SN74HC367PW pinout, SN74HC367PW application, or SN74HC367PW equivalent, this page provides verified functional architecture, TSSOP-16 package details, 3-state timing behavior, voltage-level compatibility across 2–6 V operation, and validated alternatives for bus driver replacement in industrial control and embedded logic designs.
Technical Context
The SN74HC367PW implements dual-bank 3-state buffering: Bank 1 (pins 1, 2, 3, 4, 5, 6, 7, 9, 10) comprises four noninverting buffers with shared 1OE (pin 1); Bank 2 (pins 11, 12, 13, 14, 15) contains two noninverting buffers with shared 2OE (pin 15). Each output enters high-impedance state when its OE is high, supporting bidirectional bus contention management.
It uses silicon-gate CMOS technology, ensuring TTL-compatible input thresholds (VIH = 3.15 V @ VCC = 4.5 V, VIL = 1.35 V), low input current (≤1 µA), and robust noise immunity (±6-mA drive supports up to 15 LSTTL loads). Thermal resistance RθJA is 108 °C/W in its TSSOP-16 package, defining power dissipation limits under continuous operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 2 V to 6 V - enables direct interface with 3.3 V and 5 V logic families without level translation. |
| Output Drive Strength | ±6 mA at VCC = 5 V - sufficient to drive 15 LSTTL loads or terminate short PCB traces on shared buses. |
| Propagation Delay | Typical 10 ns @ VCC = 4.5 V, CL = 50 pF - ensures sub-100 MHz bus timing margins in synchronous systems. |
| Quiescent Current | ≤80 µA max ICC - supports low-power standby modes in battery-backed or energy-sensitive applications. |
| Input Leakage Current | ≤1 µA max - prevents unintended logic transitions when inputs are tied to VCC/GND for unused channels. |
| 3-State Enable/Disable Time | ten = 24 ns, tdis = 41 ns @ VCC = 6 V - defines minimum bus turnaround latency during direction switching. |
| Power Dissipation Capacitance | 35 pF per buffer - used to calculate dynamic power (P = Cpd × V² × f) for thermal budgeting. |
Pinout & Package
TSSOP-16 package (5.00 mm × 4.40 mm body, 1.2 mm max height), lead pitch 0.65 mm, JEDEC MO-153 compliant. Pin 1 marked by index area; pin 1 quadrant Q1 in tape-and-reel orientation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (1OE) | Active-low enable for Bank 1 (4 buffers) | Drives all Y1–Y4 outputs into high-Z when high; must be pulled low for data pass-through. |
| 2 (1A1), 4 (1A2), 6 (1A3), 9 (1A4) | Inputs for Bank 1 buffers | Noninverting inputs; each maps directly to corresponding Y output (e.g., 1A1 → 1Y1). |
| 3 (1Y1), 5 (1Y2), 7 (1Y3), 10 (1Y4) | Outputs for Bank 1 buffers | 3-state outputs; high-Z when 1OE = high; otherwise replicate A-input logic level. |
| 15 (2OE) | Active-low enable for Bank 2 (2 buffers) | Independent control of Y1/Y2 in second bank; allows staggered bus access scheduling. |
| 12 (2A1), 14 (2A2) | Inputs for Bank 2 buffers | Directly drive 2Y1 (pin 11) and 2Y2 (pin 13) when 2OE is low. |
| 11 (2Y1), 13 (2Y2) | Outputs for Bank 2 buffers | True, noninverting 3-state outputs; support separate bus segments or clock fanout paths. |
Key Features
| Feature | Design Value |
|---|---|
| Wide supply range (2–6 V) | Eliminates need for external voltage translators when interfacing mixed-voltage subsystems (e.g., 3.3 V MCU to 5 V peripheral bus). |
| High-current 3-state outputs | ±6 mA drive capability ensures signal integrity across loaded backplanes or long traces without external buffers. |
| Low ICC (≤80 µA) | Reduces system-level quiescent power by >95% vs. equivalent bipolar drivers, critical for always-on control modules. |
| True (noninverting) output logic | Maintains signal polarity end-to-end - essential for address/data path integrity in memory-mapped I/O and register interfaces. |
| Banked output-enable architecture | Enables selective activation of 4-line or 2-line groups, reducing bus contention risk and simplifying arbitration logic. |
Applications
| Memory Address Buffering | Microcontroller Bus Expansion |
|---|---|
|
Use Scenario: Driving 16-bit address lines from an MCU to multiple SRAM or flash devices sharing a common data bus. IC Role / Device Role / Timing Role: Hex buffer isolating MCU address outputs while enabling/disabling segments via 1OE and 2OE to prevent bus conflicts during chip select transitions. Use Value: Prevents address glitches during memory banking; 10 ns tpd ensures setup/hold timing compliance at 25 MHz bus clocks. |
Use Scenario: Expanding GPIO count of an ARM Cortex-M0+ microcontroller to control 8 discrete peripherals via parallel interface. IC Role / Device Role / Timing Role: Level-shifting and fanout buffer for control signals (CS#, WR#, RD#), with independent OE control per peripheral group. Use Value: Eliminates need for six discrete logic gates; ±6 mA drive sustains signal integrity over 10 cm PCB traces. |
| Industrial PLC I/O Module | Digital Audio Clock Distribution |
|
Use Scenario: Isolating field-side digital inputs in a programmable logic controller rack before feeding to FPGA-based logic processing. IC Role / Device Role / Timing Role: Noise-immune buffer stage with 3-state outputs allowing FPGA to tri-state inputs during diagnostics or firmware updates. Use Value: 2 V–6 V operation accommodates 24 V optocoupler output levels via resistive divider; ≤1 µA II prevents loading. |
Use Scenario: Distributing master clock (e.g., 24.576 MHz) from a DAC to multiple audio codec ICs in a multi-channel mixer design. IC Role / Device Role / Timing Role: Low-skew, noninverting clock driver with banked enables to power-gate unused codec paths during mute/sleep states. Use Value: 10 ns tpd and 13 ns tt minimize inter-channel clock skew; 35 pF Cpd keeps dynamic power below 1.5 mW per buffer. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar hex 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74HCT367PW | CMOS inputs with TTL-compatible thresholds (VIH = 2 V min); identical pinout and function. | Better suited for legacy 5 V TTL systems where input noise margin must exceed HC family specs. | Select when interfacing with older 74LS/74ALS logic families requiring guaranteed VIH ≥ 2 V. |
| 74LVC125APW | Quad 3-state buffer (not hex); 1.65–5.5 V operation; lower ICC (10 µA); 3.5 ns tpd @ 3.3 V. | Requires two devices to match channel count; superior speed/power for 3.3 V-only designs. | Choose for new 3.3 V designs prioritizing speed and ultra-low static power over channel density. |
Compared with SN74HC367PW, SN74HCT367PW offers stronger input noise immunity in mixed-logic environments, while 74LVC125APW delivers faster switching and lower ICC but requires doubling the footprint and BOM count to achieve six buffered channels.
Availability
SN74HC367PW is available at Aetrix Electronics and suitable for industrial control systems, embedded microcontroller bus expansion, and digital audio clock distribution requiring stable component supply and long-term lifecycle support.
Supply support for SN74HC367PW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 90 years of innovation in industrial, automotive, and communications markets.
The SN74HC367PW belongs to TI's 74HC logic family - designed for high-speed, low-power, TTL-compatible digital interfacing in space-constrained industrial and consumer electronics where reliability and voltage flexibility are critical.
FAQ
What is the maximum operating temperature for the SN74HC367PW?
The SN74HC367PW is rated for operation from –40 °C to +85 °C ambient temperature. This industrial-grade range is confirmed in Section 5.2 Recommended Operating Conditions of the official datasheet (SCLS309E), and applies specifically to the PW (TSSOP-16) package variant. Exceeding +85 °C may cause parametric shift or accelerated wear-out.
Does the SN74HC367PW support 3.3 V logic levels?
Yes, the SN74HC367PW fully supports 3.3 V operation: its recommended VCC range is 2 V to 6 V, and input thresholds scale proportionally (e.g., VIH = 2.31 V min @ VCC = 3.3 V). Output VOH/VOL meet 3.3 V LVTTL requirements, making it interoperable with 3.3 V MCUs and FPGAs without level shifters.
Can unused inputs on the SN74HC367PW be left floating?
No - all unused inputs on the SN74HC367PW must be tied to VCC or GND. Floating CMOS inputs cause increased ICC, potential oscillation, and ESD susceptibility. Section 9.1 Layout Guidelines explicitly mandates this, and Table 7-1 confirms undefined output states occur when OE or A pins are uncontrolled.
Is the SN74HC367PW pin-compatible with the SN74HC244?
No - the SN74HC367PW is not pin-compatible with SN74HC244. While both are octal buffers, SN74HC367PW has dual OE pins (1OE, 2OE) and asymmetric bank structure (4+2), whereas SN74HC244 uses two 4-bit OEs (1OE, 2OE) with identical 4+4 partitioning and different pin mapping (e.g., 1Y1 is pin 3 on SN74HC367PW but pin 2 on SN74HC244).
What is the thermal resistance (RθJA) of the SN74HC367PW package?
The SN74HC367PW in TSSOP-16 package has a junction-to-ambient thermal resistance (RθJA) of 108 °C/W, as specified in Section 5.3 Thermal Information. This value assumes standard JEDEC 2-layer board conditions; actual performance improves with copper pour and thermal vias beneath the exposed pad region.
SN74HC367PW Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74HC
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 2, 4 (Hex)
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 7.8mA, 7.8mA
- Voltage - Supply:
- 2V ~ 6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-TSSOP
SN74HC367PW FAQ
1.How can I place an order for SN74HC367PW through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74HC367PW on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74HC367PW reliable?
The price and inventory of SN74HC367PW are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74HC367PW is usually 5 days.
3.What payment methods are accepted for SN74HC367PW?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74HC367PW transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74HC367PW?
SN74HC367PW orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74HC367PW order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74HC367PW?
For technical support, including SN74HC367PW datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74HC367PW requirements.
6.How does Aetrix verify that SN74HC367PW is sourced from the original manufacturer or authorized distributors?
All SN74HC367PW products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74HC367PW meets industry standards.
7.What is the process for return or replacement of SN74HC367PW?
All SN74HC367PW units undergo pre-shipment inspection (PSI). If there is an issue with SN74HC367PW, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74HC367PW part is unused and in its original packaging.
Return procedure for SN74HC367PW:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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