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Texas Instruments SN74HCS367QDRQ1
- Part No.:
- SN74HCS367QDRQ1
- Manufacturer:
- Texas Instruments
- Package:
- 16-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
SN74HCS367QDRQ1.pdf
- Description:
- IC BUFFER NON-INVERT 6V 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:875
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Product details
Overview
SN74HCS367QDRQ1 from Texas Instruments is an AEC-Q100 Grade 1 automotive hex buffer with Schmitt-trigger inputs and 3-state outputs, configured as two independent banks (4-channel + 2-channel), operating from 2 V to 6 V supply, delivering ±7.8-mA drive at 6 V, and featuring typical ICC of 100 nA for low-power signal routing in engine control units and body electronics.
For engineers reviewing the SN74HCS367QDRQ1 datasheet, SN74HCS367QDRQ1 pinout, SN74HCS367QDRQ1 application, or SN74HCS367QDRQ1 equivalent, key selection criteria include Schmitt-trigger noise immunity, dual-bank 3-state control, wettable-flank WQFN-16 package compatibility, and automotive-grade thermal performance up to +125°C ambient.
Technical Context
The SN74HCS367QDRQ1 implements six independent CMOS buffers partitioned into two logically isolated banks: Bank 1 (pins 1OE, 1A1–1A4, 1Y1–1Y4) and Bank 2 (pins 2OE, 2A1–2A2, 2Y1–2Y2), each controlled by its own active-low output enable. Each buffer performs non-inverting logic (xYn = xAn) with Schmitt-trigger input thresholds (VT+ = 2.1 V / VT− = 1.2 V at 6 V).
Its 3-state outputs provide balanced sourcing/sinking capability (±7.8 mA at 6 V), high-impedance disable state leakage ≤ ±0.5 µA, and propagation delay of 5 ns (typ) at 6 V. The device uses standard CMOS process with integrated clamp diodes and supports operation across −40°C to +125°C ambient temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 2 V to 6 V - enables direct interface with 3.3 V and 5 V automotive subsystems without level translation |
| Output Drive | ±7.8 mA at 6 V - sufficient to drive 50-pF loads with fast edge rates while maintaining VOL ≤ 0.33 V and VOH ≥ 5.4 V |
| Input Hysteresis | 0.6 V (min) at 6 V - rejects noise spikes up to 600 mV peak-to-peak on slow-switching sensor or switch inputs |
| Quiescent Current | 100 nA (typ) - supports always-on vehicle modules with negligible battery drain during sleep mode |
| Propagation Delay | 5 ns (typ) at 6 V - ensures timing-critical signal buffering meets <10 ns budget in CAN/LIN bus interface paths |
| ESD Rating | HBM ±4 kV, CDM ±1.5 kV - satisfies AEC-Q100 stress requirements for under-hood and dashboard assembly environments |
| Ambient Temp Range | −40°C to +125°C - qualified for placement near powertrain ECUs, HVAC controllers, and lighting modules |
Pinout & Package
SN74HCS367QDRQ1 is packaged in a 16-pin wettable-flank WQFN (WBQB) with 3.60 mm × 2.60 mm body size and exposed thermal pad. The package supports automated optical inspection (AOI) via side-fillet formation and allows thermal pad connection to GND or floating per layout requirements.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE | Bank 1 Output Enable (active low) | Controls all four outputs (1Y1–1Y4); must be pulled high via 10-kΩ resistor during power-up to prevent bus contention |
| 1A1–1A4 | Bank 1 Input Channels | Schmitt-trigger buffered inputs tolerant of slow edges; unused pins must be tied to VCC or GND |
| 1Y1–1Y4 | Bank 1 Output Channels | 3-state CMOS outputs with balanced drive; floating when disabled; not to be shorted together |
| 2OE | Bank 2 Output Enable (active low) | Independent control of 2Y1 and 2Y2; enables staggered enable/disable sequencing between banks |
| 2A1–2A2 | Bank 2 Input Channels | Same Schmitt characteristics as Bank 1; supports debounced switch or reset-signal conditioning |
| 2Y1–2Y2 | Bank 2 Output Channels | Matched drive strength and timing to Bank 1; suitable for dual-rail isolation or redundant signaling |
| VCC | Positive Supply | Requires local 0.1-μF bypass capacitor; max current through VCC is ±70 mA (absolute max) |
| GND | Ground Reference | Return path for all I/O and supply currents; thermal pad may be connected here for improved θJB (66.4°C/W) |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank 3-state architecture | Enables independent control of 4-channel and 2-channel groups-ideal for multiplexed bus drivers or hierarchical enable trees |
| Schmitt-trigger input hysteresis | 0.6 V min at 6 V supply-eliminates need for external RC filtering on mechanical switch or analog sensor inputs |
| Wettable-flank WQFN package | Ensures reliable solder joint inspection via side-fillet visibility-critical for zero-defect automotive manufacturing |
| Ultra-low ICC (100 nA typ) | Reduces standby power in always-on domains such as door module wake-up logic or telematics keep-alive circuits |
| AEC-Q100 Grade 1 qualification | Validated for continuous operation at +125°C ambient-supports placement in high-temperature zones near power converters or motors |
Applications
| Engine Control Unit Signal Conditioning | Body Control Module Switch Debouncing |
|---|---|
Use Scenario: Buffering crankshaft position sensor signals before ADC sampling in ECU mainboard. IC Role / Device Role / Timing Role: Hex buffer isolates noisy analog sensor traces from digital logic domain while preserving edge integrity via Schmitt inputs. Use Value: Eliminates false triggering caused by EMI-induced glitches on long harness runs, improving misfire detection accuracy. | Use Scenario: Debouncing door lock/unlock switch inputs in BCM with mechanical contact bounce >10 ms. IC Role / Device Role / Timing Role: Schmitt-trigger inputs convert slow, oscillating switch transitions into clean logic-level pulses for microcontroller GPIO. Use Value: Removes need for software debounce timers or external RC networks-reducing BOM count and firmware complexity. |
| Instrument Cluster Display Backlight Enable | ADAS Camera Power Sequencing |
Use Scenario: Enabling/disabling LED backlight drivers based on ignition status and ambient light sensor output. IC Role / Device Role / Timing Role: 3-state outputs gate PWM dimming signals to multiple LED strings; Bank 1 controls front panel, Bank 2 controls rear display. Use Value: Prevents backfeed and cross-talk between independent backlight zones during partial shutdown modes. | Use Scenario: Controlling power-enable sequencing for multi-camera ADAS systems during cold start. IC Role / Device Role / Timing Role: Dual-bank architecture sequences camera sensor power rails with precise timing margins using separate OE pins. Use Value: Avoids inrush current overlap and voltage droop that could destabilize image sensor bias supplies. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar hex buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74HCS367PWQ1 | TSSOP-16 package (5.00 mm × 4.40 mm); higher RθJA (141.2°C/W); no wettable flanks | Better suited for manual rework or prototyping; less suitable for AOI-dependent high-volume SMT lines | Select when board space permits larger footprint and visual inspection suffices over AOI compliance |
| SN74HCS367DQ1 | SOIC-16 package (9.90 mm × 3.90 mm); highest RθJA (122.2°C/W); leaded, not wettable | Preferred for legacy automotive designs requiring through-hole compatibility or wave-solder processes | Choose only if existing PCB layout mandates SOIC or thermal derating margin exceeds 25°C |
Compared with SN74HCS367PWQ1 and SN74HCS367DQ1, the SN74HCS367QDRQ1 offers superior thermal performance (RθJA = 97.3°C/W), AOI-ready wettable flanks, and smallest PCB area-making it optimal for next-generation compact, high-reliability automotive modules where manufacturability and thermal headroom are critical.
Availability
SN74HCS367QDRQ1 is available at Aetrix Electronics and suitable for engine control units, body control modules, instrument clusters, and ADAS camera power sequencers requiring stable component supply across extended temperature ranges and automotive production lifecycles.
Supply support for SN74HCS367QDRQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of automotive qualification expertise and broad portfolio of AEC-Q100-compliant logic and interface solutions.
The SN74HCS367QDRQ1 belongs to TI's HCS logic family-designed specifically for robust, low-power signal buffering in harsh automotive environments where noise immunity, wide voltage operation, and long-term reliability are mandatory.
FAQ
What is the maximum capacitive load SN74HCS367QDRQ1 can drive while meeting datasheet timing specs?
The SN74HCS367QDRQ1 is characterized for CL = 50 pF in switching specifications. Driving loads >50 pF increases propagation delay and transition time beyond guaranteed limits-e.g., tt rises from 4 ns (typ) at 50 pF to >8 ns at 100 pF. For reliable timing closure in CAN or LIN interface paths, keep total node capacitance ≤50 pF using short traces and minimal stubs. SN74HCS367QDRQ1 remains functional beyond this limit but loses parametric guarantee.
How should unused inputs on SN74HCS367QDRQ1 be terminated?
Unused inputs on SN74HCS367QDRQ1 must be tied to a valid logic level-either VCC or GND-using direct connection or a pull-up/down resistor. A 10-kΩ resistor is recommended to balance leakage current (±100 nA) and transition speed. Leaving inputs floating causes undefined output states and increased dynamic current due to internal shoot-through. This requirement applies to all six inputs (1A1–1A4, 2A1–2A2), regardless of bank enable status. SN74HCS367QDRQ1 does not auto-tri-state unused channels.
Does SN74HCS367QDRQ1 support hot insertion or live insertion into a powered system?
SN74HCS367QDRQ1 is not designed for hot insertion. Its absolute maximum ratings specify VI limits of −0.5 V to VCC + 0.5 V; applying input voltage before VCC stabilization risks exceeding clamp diode current limits (±20 mA). During power-up, both 1OE and 2OE should be held high via pull-ups to ensure outputs remain in high-impedance state until supply rails settle. SN74HCS367QDRQ1 lacks built-in hot-swap protection circuitry-external sequencing or buffer isolation is required for live-insertion use cases.
Can the two output banks of SN74HCS367QDRQ1 be used to drive the same bus line simultaneously?
No-connecting outputs from different banks (e.g., 1Y1 and 2Y1) to the same net violates SN74HCS367QDRQ1 design rules. Even with synchronized OE control, mismatched propagation delays (≤3 ns variation) and output impedance tolerances can cause momentary bus contention, exceeding ±35 mA continuous output current rating and risking latch-up or accelerated wear. SN74HCS367QDRQ1 supports parallel connection only within the same bank (e.g., 1Y1 + 1Y2) using identical inputs. Inter-bank sharing requires external OR-ing diodes or dedicated bus switches.
What is the purpose of the thermal pad on the SN74HCS367QDRQ1 WBQB package?
The exposed thermal pad on SN74HCS367QDRQ1's WBQB package reduces junction-to-board thermal resistance to 66.4°C/W-improving power dissipation efficiency by ~25% versus TSSOP/SOIC variants. It may be connected to GND plane for electrical and thermal benefit, or left floating if ground routing conflicts with signal integrity. TI recommends soldering the pad fully to a dedicated copper pour; voiding >25% degrades θJB performance. SN74HCS367QDRQ1 thermal pad has no electrical function beyond thermal conduction and grounding-it is not a functional pin.
SN74HCS367QDRQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74HCS
- Package/Case:
- 16-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 4, 2
- Input Type:
- Schmitt Trigger
- Output Type:
- 3-State
- Current - Output High, Low:
- 7.8mA, 7.8mA
- Voltage - Supply:
- 2V ~ 6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
SN74HCS367QDRQ1 FAQ
1.How can I place an order for SN74HCS367QDRQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74HCS367QDRQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74HCS367QDRQ1 reliable?
The price and inventory of SN74HCS367QDRQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74HCS367QDRQ1 is usually 5 days.
3.What payment methods are accepted for SN74HCS367QDRQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74HCS367QDRQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74HCS367QDRQ1?
SN74HCS367QDRQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74HCS367QDRQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74HCS367QDRQ1?
For technical support, including SN74HCS367QDRQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74HCS367QDRQ1 requirements.
6.How does Aetrix verify that SN74HCS367QDRQ1 is sourced from the original manufacturer or authorized distributors?
All SN74HCS367QDRQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74HCS367QDRQ1 meets industry standards.
7.What is the process for return or replacement of SN74HCS367QDRQ1?
All SN74HCS367QDRQ1 units undergo pre-shipment inspection (PSI). If there is an issue with SN74HCS367QDRQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74HCS367QDRQ1 part is unused and in its original packaging.
Return procedure for SN74HCS367QDRQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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