Texas Instruments SN74HCS367QPWRQ1
- Part No.:
- SN74HCS367QPWRQ1
- Manufacturer:
- Texas Instruments
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74HCS367QPWRQ1.pdf
- Description:
- IC BUFFER NON-INVERT 6V 16TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74HCS367QPWRQ1 from Texas Instruments is an AEC-Q100 Grade 1 automotive hex buffer with Schmitt-trigger inputs and 3-state outputs, configured as two independent banks (4-channel + 2-channel), operating from 2 V to 6 V supply, delivering ±7.8 mA output drive at 6 V, and featuring typical ICC of 100 nA for low-power body control modules.
For engineers reviewing the SN74HCS367QPWRQ1 datasheet, SN74HCS367QPWRQ1 pinout, SN74HCS367QPWRQ1 application, or SN74HCS367QPWRQ1 equivalent, key selection criteria include Schmitt-trigger noise immunity, dual-bank 3-state control, wettable-flank TSSOP-16 package compatibility, and automotive-grade thermal performance across –40°C to +125°C ambient.
Technical Context
The SN74HCS367QPWRQ1 implements six independent CMOS buffers partitioned into two logically isolated banks-Bank 1 (pins 1OE, 1A1–1A4, 1Y1–1Y4) and Bank 2 (pins 2OE, 2A1–2A2, 2Y1–2Y2)-each enabled independently via active-low OE signals. Each buffer performs non-inverting logic (Y = A) with hysteresis ΔVT ≥ 0.2 V at 2 V supply.
Schmitt-trigger inputs provide noise rejection up to ±0.5 V peak-to-peak at 2 V supply and support slow-edge signals without oscillation; 3-state outputs exhibit balanced sourcing/sinking capability (±7.8 mA at 6 V) and high-impedance leakage ≤ ±0.5 µA in disabled state.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 2 V to 6 V - supports direct interface with 3.3 V and 5 V automotive microcontrollers and sensors without level shifting. |
| Operating Temperature | –40°C to +125°C - qualified per AEC-Q100 Grade 1 for under-hood and body electronics applications. |
| Output Drive Strength | ±7.8 mA at 6 V - sufficient to drive multiple CMOS loads or moderate capacitive traces (≤50 pF) without signal degradation. |
| Input Hysteresis (ΔVT) | Min 0.2 V at 2 V, 0.6 V at 6 V - enables reliable switching in presence of EMI or mechanical switch bounce. |
| Quiescent Supply Current | Typ 100 nA at 6 V - enables always-on monitoring circuits with negligible battery drain in sleep mode. |
| Propagation Delay | 5 ns max at 6 V - ensures timing-critical signal routing (e.g., wake-up lines, sensor enable) meets sub-10 ns system budgets. |
| ESD Rating | HBM ±4 kV, CDM ±1.5 kV - exceeds automotive ESD robustness requirements for assembly and field operation. |
Pinout & Package
TSSOP-16 (PW) package with wettable flanks, 5.00 mm × 4.40 mm body size, exposed thermal pad connected to GND or left floating per TI recommendation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 15 | 1OE, 2OE | Active-low bank enable controls high-impedance state for all outputs in respective bank; pull-up to VCC required for power-up safety. |
| 2, 4, 6, 10 | 1A1–1A4 | Bank 1 input channels - accept Schmitt-triggered signals from switches, sensors, or noisy MCU GPIOs. |
| 3, 5, 7, 9 | 1Y1–1Y4 | Bank 1 buffered outputs - drive downstream logic, LEDs, or bus lines with controlled rise/fall times. |
| 12, 14 | 2A1, 2A2 | Bank 2 input channels - isolated from Bank 1 for independent subsystem control (e.g., lighting + HVAC). |
| 11, 13 | 2Y1, 2Y2 | Bank 2 buffered outputs - enable/disable separate signal paths without cross-talk or contention. |
| 8 | GND | Ground reference - must be low-impedance connection; used for thermal pad tie in TSSOP variant. |
| 16 | VCC | Positive supply - requires local 0.1 µF bypass capacitor placed adjacent to pin per layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent 3-state banks | Enables selective isolation of two functional domains (e.g., infotainment data bus + powertrain diagnostics line) using separate OE pins. |
| Schmitt-trigger inputs with hysteresis | Rejects >100 mV noise on slow-switching inputs (e.g., door latch sensors, ignition status lines) without external RC filtering. |
| Wettable flank TSSOP package | Supports automated optical inspection (AOI) of solder fillets on all four side leads, improving manufacturing yield in automotive PCB assembly. |
| Ultra-low ICC (100 nA typ) | Permits use in always-on vehicle modules (e.g., intrusion detection, keyless entry receivers) without compromising battery standby life. |
| AEC-Q100 Grade 1 qualification | Validated for continuous operation at 125°C ambient, enabling placement near ECUs, junction boxes, or lighting controllers. |
Applications
| Body Control Module Signal Routing | Automotive Switch Debouncing |
|---|---|
Use Scenario: Isolating and buffering door lock/unlock commands between body controller and distributed actuators while preventing bus contention during firmware updates. IC Role / Device Role / Timing Role: Hex buffer with dual 3-state banks acts as a programmable signal gate, enabling/disabling communication paths without hardware reconfiguration. Use Value: Eliminates need for discrete MOSFET switches or complex CPLD logic; reduces BOM count and PCB area by consolidating six independent gating functions in one TSSOP-16 package. | Use Scenario: Conditioning mechanical switch inputs from seat position sensors or trunk release buttons before feeding to MCU GPIOs. IC Role / Device Role / Timing Role: Schmitt-trigger input stage cleans slow, bouncing transitions; 3-state output allows MCU to override or hold signal during calibration sequences. Use Value: Removes requirement for external RC filters and software debouncing routines, lowering MCU interrupt load and improving real-time response consistency. |
| Infotainment System Bus Enable | Powertrain Diagnostic Interface |
Use Scenario: Enabling/disabling LVDS or parallel data lanes between head unit and display module based on ignition state and user interaction. IC Role / Device Role / Timing Role: Acts as a low-latency, low-power bus driver with fast enable/disable timing (6 ns typ at 6 V) to minimize display black-out duration. Use Value: Achieves <10 ns propagation delay and <15 ns disable time, meeting stringent infotainment boot-time synchronization requirements. | Use Scenario: Buffering diagnostic enable signals between engine control unit and OBD-II connector to prevent back-driving during ECU reset cycles. IC Role / Device Role / Timing Role: Provides galvanically isolated signal conditioning via 3-state outputs, ensuring diagnostic port remains high-Z when ECU is unpowered. Use Value: Prevents unintended current flow into diagnostic tools during power sequencing, satisfying ISO 16750-2 electrical stress test compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar hex buffer with Schmitt-trigger and 3-state applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74HCS367QPWR | Industrial-grade (non-AEC-Q100); identical electrical specs and pinout; lacks automotive qualification testing. | Not suitable for production automotive systems requiring AEC-Q100 documentation and traceability. | Select only for prototyping or non-safety-critical industrial control where temperature range ≤ 85°C suffices. |
| SN74LVTH16244ADGGR | 16-bit, non-Schmitt, TTL-compatible; higher drive (±24 mA), wider voltage (2.7–3.6 V), no hysteresis. | Requires external hysteresis circuitry for noisy environments; incompatible with slow-switching inputs like mechanical switches. | Choose only when driving high-capacitance buses (e.g., memory expansion) where Schmitt-trigger is unnecessary and higher speed is critical. |
Compared with SN74HCS367QPWRQ1, SN74HCS367QPWR omits automotive qualification but matches all electrical behavior, while SN74LVTH16244ADGGR trades Schmitt-trigger noise immunity for higher drive and speed in narrow-voltage applications-neither offers drop-in replacement capability without design validation.
Availability
SN74HCS367QPWRQ1 is available at Aetrix Electronics and suitable for automotive body control modules, switch interface subsystems, infotainment bus management, and powertrain diagnostic interfaces requiring stable component supply across extended temperature and long product lifecycles.
Supply support for SN74HCS367QPWRQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing solutions, with leadership in automotive ICs, power management, and precision analog.
The SN74HCS367QPWRQ1 belongs to TI's HCS logic family designed specifically for automotive signal integrity-emphasizing noise-immune interfacing, low quiescent power, and AEC-Q100 reliability in harsh environments.
FAQ
What is the maximum capacitive load SN74HCS367QPWRQ1 can drive while maintaining specified timing?
The SN74HCS367QPWRQ1 is characterized for CL = 50 pF in its switching characteristics table. Driving loads exceeding 50 pF increases propagation delay and transition time beyond datasheet limits (e.g., tpd rises from 5 ns to >12 ns at 6 V). For reliable operation, keep total output capacitance-including trace, connector, and receiver input-≤50 pF. Larger loads require series damping resistors or buffer staging.
How should unused inputs on SN74HCS367QPWRQ1 be terminated in an automotive design?
Unused inputs on SN74HCS367QPWRQ1 must be tied to VCC or GND using a 10 kΩ pull-up or pull-down resistor. Direct connection is acceptable only if the input is permanently unused. This prevents floating nodes that cause undefined logic states, increased ICC, and potential EMI susceptibility-critical for AEC-Q100 compliance and functional safety in automotive systems.
Does SN74HCS367QPWRQ1 support hot insertion or live board swapping?
SN74HCS367QPWRQ1 does not include explicit hot-swap protection features such as power-up 3-state or Ioff. Its absolute maximum ratings specify VI limits of –0.5 V to VCC + 0.5 V; applying input signals before VCC stabilization may exceed these limits. For hot-insertion scenarios, external series resistors and careful power sequencing are required-TI recommends tying both OE pins to VCC via pull-ups to ensure outputs remain high-Z until supply is valid.
What is the purpose of the thermal pad in the SN74HCS367QPWRQ1 TSSOP package?
The SN74HCS367QPWRQ1 TSSOP (PW) package does not include a thermal pad; that feature applies only to the WBQB (WQFN) variant. The PW package uses standard leadframe construction. Thermal management relies on PCB copper area connected to pins 8 (GND) and 16 (VCC), with recommended 0.1 µF bypass capacitor placement adjacent to VCC to minimize impedance and stabilize supply during switching transients.
Can SN74HCS367QPWRQ1 outputs be paralleled for higher current drive?
Yes-identical channels within SN74HCS367QPWRQ1 (e.g., 1Y1 and 1Y2) can be paralleled to increase sink/source capability, provided they share the same input (1A1 = 1A2) and OE state (1OE asserted). This configuration doubles effective drive strength (e.g., ±15.6 mA at 6 V) while maintaining matched timing. Avoid paralleling outputs across banks or with mismatched inputs to prevent shoot-through current.
SN74HCS367QPWRQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74HCS
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 4, 2
- Input Type:
- Schmitt Trigger
- Output Type:
- 3-State
- Current - Output High, Low:
- 7.8mA, 7.8mA
- Voltage - Supply:
- 2V ~ 6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-TSSOP
SN74HCS367QPWRQ1 FAQ
1.How can I place an order for SN74HCS367QPWRQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74HCS367QPWRQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of SN74HCS367QPWRQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74HCS367QPWRQ1 is usually 5 days.
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5.How can I obtain technical support or documentation for SN74HCS367QPWRQ1?
For technical support, including SN74HCS367QPWRQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74HCS367QPWRQ1 requirements.
6.How does Aetrix verify that SN74HCS367QPWRQ1 is sourced from the original manufacturer or authorized distributors?
All SN74HCS367QPWRQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74HCS367QPWRQ1 meets industry standards.
7.What is the process for return or replacement of SN74HCS367QPWRQ1?
All SN74HCS367QPWRQ1 units undergo pre-shipment inspection (PSI). If there is an issue with SN74HCS367QPWRQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74HCS367QPWRQ1 part is unused and in its original packaging.
Return procedure for SN74HCS367QPWRQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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