Texas Instruments SN74HCS367QWBQBRQ1

Overview

SN74HCS367QWBQBRQ1 from Texas Instruments is an AEC-Q100 Grade 1 automotive hex buffer with Schmitt-trigger inputs and 3-state outputs, configured as two independent banks (4-channel + 2-channel), operating from 2 V to 6 V, delivering ±7.8-mA drive at 6 V, and featuring typical ICC of 100 nA for low-power body control module signal conditioning.

For engineers reviewing the SN74HCS367QWBQBRQ1 datasheet, SN74HCS367QWBQBRQ1 pinout, SN74HCS367QWBQBRQ1 application, or SN74HCS367QWBQBRQ1 equivalent, key selection criteria include Schmitt-trigger noise immunity, dual-bank 3-state control timing, wettable-flank WQFN-16 thermal performance, and automotive-grade ESD robustness (HBM Level 2, CDM Level C6).

Technical Context

The SN74HCS367QWBQBRQ1 implements six independent CMOS buffers with hysteresis thresholds (ΔVT = 0.6–1.6 V) enabling reliable operation with slow-switching or noisy signals such as mechanical switch inputs or long-trace sensor lines. Each bank-Bank 1 (pins 1OE, 1A1–1A4, 1Y1–1Y4) and Bank 2 (pins 2OE, 2A1–2A2, 2Y1–2Y2)-features active-low 3-state enable logic and balanced output drive capability.

Its Schmitt-trigger inputs eliminate metastability by enforcing clean transitions across input voltage noise bands, while the 3-state outputs support bus-sharing architectures in automotive domain controllers. The device uses standard CMOS logic levels but requires external pull-up resistors on OE pins during power-up to guarantee high-impedance default state.

Key Specifications

Pinout & Package

SN74HCS367QWBQBRQ1 is housed in a 3.6 mm × 2.6 mm wettable-flank WQFN-16 package (WBQB), optimized for automated optical inspection (AOI) and thermal dissipation (R_θJA = 97.3°C/W). The exposed thermal pad may be connected to GND or left floating; no connection to other signals is permitted.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar hex buffer applications.

Compared with SN74HCS367PWQ1 and SN74HCS367DQ1, the SN74HCS367QWBQBRQ1 delivers superior thermal management and automated assembly compatibility in compact automotive modules-making it the preferred choice for new designs targeting IPC-A-610 Class 3 reliability and zero-defect AOI pass rates.

Availability

SN74HCS367QWBQBRQ1 is available at Aetrix Electronics and suitable for body control modules, engine control units, transmission control systems, and ADAS camera interfaces requiring stable component supply across automotive production lifecycles.

Supply support for SN74HCS367QWBQBRQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and automotive-grade logic solutions with decades of automotive qualification expertise.

The SN74HCS367QWBQBRQ1 belongs to TI's HCS logic family-designed specifically for automotive signal conditioning applications demanding ultra-low power, noise immunity, and AEC-Q100 compliance in harsh environments.

FAQ

What is the maximum capacitive load SN74HCS367QWBQBRQ1 can drive while meeting datasheet timing specs?

The SN74HCS367QWBQBRQ1 is characterized for CL ≤ 50 pF in switching specifications. Driving larger loads increases propagation delay and transition time-e.g., at 100 pF, tpd rises ~30% versus nominal 5 ns at 6 V. For robust timing closure in production, keep total node capacitance-including trace, connector, and receiver input-within 50 pF unless re-characterized per application conditions. SN74HCS367QWBQBRQ1 maintains functional operation beyond this limit but violates guaranteed AC parameters.

How should unused inputs be terminated on SN74HCS367QWBQBRQ1?

All unused inputs on SN74HCS367QWBQBRQ1 must be tied to a valid logic level-either VCC or GND-using direct connection or a 10-kΩ pull-up/down resistor. Floating inputs cause undefined internal node voltages, increasing ICC and risking oscillation or excessive power dissipation. This requirement applies regardless of Schmitt-trigger architecture; termination ensures deterministic state and prevents shoot-through current in CMOS stages. SN74HCS367QWBQBRQ1 datasheet specifies ±100 nA input leakage, confirming safe biasing with standard resistor values.

Does SN74HCS367QWBQBRQ1 support hot insertion or live insertion into a powered backplane?

No-SN74HCS367QWBQBRQ1 does not support hot insertion. Its absolute maximum ratings specify VI limits of –0.5 V to VCC + 0.5 V; applying input signals before VCC stabilization violates this condition and risks damage from clamp diode conduction. TI recommends powering VCC and establishing stable supply before asserting any inputs. SN74HCS367QWBQBRQ1 includes input clamp diodes (±20 mA rating), but these are for ESD protection-not operational overvoltage handling. Always sequence power before signal in automotive backplane designs.

Can the thermal pad on SN74HCS367QWBQBRQ1 be connected to a voltage other than GND?

No-the thermal pad on SN74HCS367QWBQBRQ1 must be either connected to GND or left electrically floating. Connecting it to VCC, signal nets, or any other potential violates the device's mechanical and electrical design intent and may cause latch-up or thermal runaway. TI's datasheet explicitly states: "Do not connect to any other signal or supply." When grounded, the pad improves thermal conduction to the PCB plane; when floating, it retains full isolation. SN74HCS367QWBQBRQ1 thermal metrics (e.g., R_θJB = 66.4°C/W) assume pad-to-board contact only-not pad-to-VCC routing.

What is the recommended bypass capacitor value and placement for SN74HCS367QWBQBRQ1?

A 0.1-μF ceramic capacitor is recommended for SN74HCS367QWBQBRQ1, placed physically adjacent to the VCC pin (Pin 16) and connected directly to the GND pin (Pin 8) with minimal trace length. TI advises paralleling with a 1-μF capacitor to suppress broader frequency noise. Layout guidelines require avoiding 90° corners and using ground flood fill beneath the device. SN74HCS367QWBQBRQ1's low ICC makes bypassing critical not for power filtering alone, but to stabilize local supply during simultaneous 3-state transitions that induce transient current spikes.