Texas Instruments SN74LV125AQRGYRQ1

Overview

SN74LV125AQRGYRQ1 from Texas Instruments is an automotive-qualified quadruple 3-state bus buffer gate in a 14-pin VQFN (RGY) package, operating from 2 V to 5.5 V supply, delivering propagation delay as low as 4.3 ns at 5 V, with Ioff support for partial-power-down mode and mixed-mode voltage operation across all ports.

For engineers reviewing the SN74LV125AQRGYRQ1 datasheet, SN74LV125AQRGYRQ1 pinout, SN74LV125AQRGYRQ1 application, or SN74LV125AQRGYRQ1 equivalent, this device serves as a robust level-shifting and bus-isolation solution in automotive infotainment, ADAS sensor interfaces, and body control modules where rail-to-rail compatibility and power sequencing safety are critical.

Technical Context

This device implements four independent noninverting buffers, each with dedicated 3-state output-enable (OE) control - enabling selective bus isolation without affecting other channels. Each buffer supports bidirectional voltage translation between 2-V and 5.5-V logic domains on inputs and outputs.

The Ioff circuitry actively disables outputs during power-down, blocking reverse current flow up to ±5 mA, while the low ground-bounce (VOLP < 0.8 V) and undershoot (VOHV > 2.3 V) characteristics ensure signal integrity in high-speed digital buses under switching noise conditions.

Key Specifications

Pinout & Package

VQFN-14 (RGY) package: 3.5 mm × 3.5 mm body, 0.5 mm lead pitch, 1 mm max height, thermally enhanced with exposed die-pad soldered to PCB ground plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus buffer applications.

Compared with SN74LVC125AQDRQ1 and MC74VHC125DTG, the SN74LV125AQRGYRQ1 uniquely combines AEC-Q100 Grade 1 qualification, validated VOLP/VOHV noise suppression, and VQFN thermal performance - making it the only option qualified for safety-critical automotive bus isolation where both reliability and signal fidelity are mandated.

Availability

SN74LV125AQRGYRQ1 is available at Aetrix Electronics and suitable for automotive infotainment systems, ADAS sensor interfaces, and body control modules requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for SN74LV125AQRGYRQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and automotive ICs, with decades of leadership in high-reliability automotive electronics.

The SN74LV125AQRGYRQ1 belongs to TI's LV-A family of automotive logic devices, designed specifically for robust bus buffering, level translation, and power-domain isolation in next-generation ECU architectures.

FAQ

What is the maximum operating frequency supported by SN74LV125AQRGYRQ1?

The SN74LV125AQRGYRQ1 does not specify a maximum clock frequency directly, but its propagation delay (tpd) is 4.3 ns (min) to 10 ns (max) at 5 V, supporting reliable operation in digital buses up to approximately 100 MHz with adequate setup/hold margins. System-level timing must account for board trace delays and load capacitance, especially in automotive harness environments where CL may exceed 50 pF.

Does SN74LV125AQRGYRQ1 require external pull-up resistors on OE pins?

Yes - to ensure outputs enter high-impedance state during power-up or brown-out, each OE pin of the SN74LV125AQRGYRQ1 should be tied to VCC through a pull-up resistor. TI recommends values between 1 kΩ and 10 kΩ depending on driver sink capability; lower values improve noise immunity but increase static current draw.

Can SN74LV125AQRGYRQ1 interface 1.8-V logic signals?

No - the SN74LV125AQRGYRQ1 has a minimum VCC of 2 V and specifies VIH/VIL thresholds relative to VCC (e.g., VIH = 0.7×VCC). At 2 V supply, VIH is 1.4 V minimum, making 1.8-V logic marginal and unsupported. For 1.8-V interfaces, consider the SN74LVC1T45 or SN74AXC4T245 families instead.

Is the thermal pad on the RGY package of SN74LV125AQRGYRQ1 required to be soldered?

Yes - the exposed thermal pad on the SN74LV125AQRGYRQ1's VQFN-14 (RGY) package must be soldered to a PCB copper pour connected to GND. TI documentation states this is mandatory for both thermal performance (θJA = 47°C/W) and mechanical reliability; omitting it degrades power handling and risks solder joint fatigue under thermal cycling.

How does SN74LV125AQRGYRQ1 differ from the commercial-grade SN74LV125A?

The SN74LV125AQRGYRQ1 adds AEC-Q100 Grade 1 qualification, extended temperature range (–40°C to +125°C), enhanced ESD protection (±4 kV HBM), and automotive-specific process controls - while retaining identical electrical specs, pinout, and package as the catalog SN74LV125A. It is not a drop-in replacement for non-automotive use due to different screening and traceability requirements.