Texas Instruments SN74LV139ADGVR
- Part No.:
- SN74LV139ADGVR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 16-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74LV139ADGVR.pdf
- Description:
- IC DECODER/DEMUX 1X2:4 16TVSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74LV139ADGVR from Texas Instruments is a dual 2-line to 4-line decoder/demultiplexer operating from 2V to 5.5V, with 7.5ns max propagation delay at 5V, mixed-mode voltage interface support, and Ioff partial-power-down capability. It serves as a high-speed address decoder in memory subsystems and data-routing logic for industrial controllers and FPGA I/O expansion.
For engineers reviewing the SN74LV139ADGVR datasheet, SN74LV139ADGVR pinout, SN74LV139ADGVR application, or SN74LV139ADGVR equivalent, key selection criteria include VCC range compatibility (2–5.5V), tpd ≤ 7.5ns at 5V, active-low enable architecture, Ioff leakage < 5μA, and TVSOP-16 package footprint constraints.
Technical Context
The SN74LV139ADGVR integrates two independent 2-to-4 decoders sharing no internal signal paths, each with separate active-low enable (1G/2G) and address inputs (1A0/1A1, 2A0/2A1). Its positive-logic decoding function drives one of four outputs low per channel while holding others high, enabling direct connection to NAND-based memory enable lines.
Designed for high-speed memory decoding, it features fully buffered inputs (1 normalized load), supports cascading via enable chaining, and meets JESD17 latch-up >250mA. The Ioff circuitry disables outputs during power-down to prevent backflow current, critical for hot-swap and multi-rail systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2V to 5.5V - enables interoperability across 2.5V, 3.3V, and 5V logic domains without level shifters. |
| tpd (max) | 7.5ns at VCC = 5V, CL = 15pF - ensures sub-10ns decode latency for high-speed SRAM and FPGA configuration buses. |
| Ioff | < 5μA at 0–5.5V - guarantees safe isolation during partial power-down, preventing bus contention in modular systems. |
| Input Voltage Thresholds | VIL ≤ 0.3×VCC, VIH ≥ 0.7×VCC - provides robust noise margin across full VCC range, supporting mixed-voltage board designs. |
| Output Drive | IOL = 12mA at VCC = 4.5–5.5V - directly drives TTL loads or multiple CMOS inputs without external buffers. |
| ESD Rating | HBM ±2000V, CDM ±1000V - exceeds JEDEC JS-001 requirements for manufacturing handling and field reliability. |
| Operating Temperature | –40°C to +85°C - qualified for industrial control, automotive body electronics, and networking infrastructure applications. |
Pinout & Package
SN74LV139ADGVR uses the TVSOP-16 (DGV) package: 3.6mm × 6.4mm body size, 0.5mm pitch, 16-pin surface-mount with exposed pad (no thermal pad connection required). Pin 1 marked by beveled corner; pins arranged in two rows, 8 per side.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1G, 15 | Channel 1 & 2 output enable (active low) | Drives entire channel into high-impedance when high; used for cascading or synchronous demux gating. |
| 1A0, 1A1 / 2A0, 2A1 (pins 2,3,14,13) | Address select inputs | Binary-select two bits per channel to activate one of four outputs (Y0–Y3); fully buffered, 1-load drive strength. |
| 1Y0–1Y3 / 2Y0–2Y3 (pins 4–7, 9–12) | Active-low decoded outputs | Each Yx asserts low for matching address; open-collector compatible with pull-up resistors for wired-OR logic. |
| 8, 16 | GND and VCC | Dedicated power pins placed diagonally opposite for optimal decoupling; requires 0.1μF ceramic capacitor near VCC. |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent decoders | Enables parallel address decoding for two memory banks or peripheral groups without inter-channel timing skew. |
| Mixed-mode voltage operation | Accepts input voltages up to 5.5V regardless of VCC, allowing 5V-tolerant I/O on 3.3V-powered systems. |
| Active-low enable with cascade support | 1G and 2G can chain to enable downstream decoders, reducing gate count in hierarchical memory maps. |
| Ioff partial-power-down protection | Prevents damaging current flow between powered/unpowered rails, essential for hot-pluggable modules and battery-backed subsystems. |
| High-speed propagation (7.5ns @ 5V) | Meets timing budgets for 100+ MHz memory interfaces and real-time control loops where decode latency impacts system throughput. |
Applications
| Memory Address Decoding | FPGA I/O Expansion |
|---|---|
|
Use Scenario: Selecting one of four SRAM chips in a 16-bit embedded controller using A15–A14 address lines. IC Role / Device Role / Timing Role: Dual decoder maps 2-bit address to chip-enable signals, with tpd ≤ 7.5ns ensuring no wait-state insertion. Use Value: Eliminates need for discrete logic or larger CPLDs, reducing BOM cost and PCB area while maintaining deterministic access timing. |
Use Scenario: Expanding limited FPGA GPIO to drive eight discrete LEDs or relays via 3-bit address + enable. IC Role / Device Role / Timing Role: Acts as 1-of-4 demultiplexer per channel, converting serial address/data streams into parallel control outputs. Use Value: Provides glitch-free output transitions with Ioff isolation, preventing LED flicker or relay chatter during FPGA reconfiguration. |
| Industrial PLC I/O Modules | Automotive Body Control Units |
|
Use Scenario: Routing sensor interrupt signals from four temperature sensors to a microcontroller's shared INT line. IC Role / Device Role / Timing Role: Enables priority-encoded interrupt arbitration using active-low outputs tied to wired-OR bus. Use Value: Supports fail-safe operation under brownout conditions via Ioff shutdown, avoiding spurious interrupts during power transitions. |
Use Scenario: Controlling four door-lock actuators from a central BCM using LIN bus commands decoded by MCU. IC Role / Device Role / Timing Role: Translates MCU GPIO outputs into dedicated actuator enable lines with ESD-hardened I/O. Use Value: HBM ±2000V rating ensures robustness against automotive ESD events; –40°C to +85°C rating matches under-hood thermal requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 2-to-4 decoder applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74HC139DR | Slower tpd (24ns @ 4.5V), narrower VCC range (2–6V), no Ioff support | Suitable only for non-hot-swap, lower-speed systems; lacks partial-power-down safety | Choose if cost is primary constraint and system operates exclusively at 5V with no power sequencing requirements. |
| 74LVC139APW | Same VCC range (1.65–5.5V), faster tpd (5.2ns @ 3.3V), but no Ioff and lower ESD rating (HBM ±2kV vs ±2kV, CDM ±500V) | Better for high-density 3.3V-only boards; unsuitable for mixed-rail or safety-critical hot-swap use | Prefer for compact 3.3V FPGA carrier boards where layout space is constrained and power sequencing is controlled. |
Compared with SN74HC139DR and 74LVC139APW, SN74LV139ADGVR uniquely balances 7.5ns speed, 2–5.5V flexibility, Ioff safety, and industrial-grade ESD-making it optimal for mixed-voltage, hot-swap-capable embedded systems requiring guaranteed decode latency and rail isolation.
Availability
SN74LV139ADGVR is available at Aetrix Electronics and suitable for industrial PLCs, automotive body control units, FPGA I/O expansion modules, and high-speed memory subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for SN74LV139ADGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 90 years of innovation in industrial, automotive, and communications markets.
The SN74LV139A family targets high-speed, low-voltage logic applications demanding robust mixed-signal interfacing, precise timing control, and reliable operation in harsh environments-especially memory decoding and data routing in resource-constrained embedded systems.
FAQ
What is the maximum propagation delay of the SN74LV139ADGVR at 3.3V operation?
The SN74LV139ADGVR has a maximum propagation delay of 7ns at VCC = 3.3V with 15pF load, per TI's SCLS396J datasheet Section 4.7. This value reflects worst-case tpd from address or enable input to any Y output transition, ensuring timing predictability in 3.3V FPGA and microcontroller interfaces. The SN74LV139ADGVR maintains consistent performance across its full operating temperature range.
Does the SN74LV139ADGVR support partial-power-down mode, and how is it implemented?
Yes, the SN74LV139ADGVR supports partial-power-down mode via its Ioff circuitry, which disables all outputs when VCC = 0V while limiting input/output leakage to <5μA across 0–5.5V. This prevents backflow current between powered and unpowered rails-a critical feature for hot-swap modules and battery-backed systems. The SN74LV139ADGVR achieves this without external components or configuration pins.
Can the SN74LV139ADGVR interface directly with 5V logic while operating at 3.3V VCC?
Yes, the SN74LV139ADGVR supports mixed-mode voltage operation: its inputs tolerate up to 5.5V regardless of VCC level, enabling direct connection to 5V address buses while powered from a 3.3V rail. This eliminates level shifters in hybrid-voltage systems. The SN74LV139ADGVR maintains valid output swing (0V to VCC) and specified timing under these conditions.
What is the recommended bypass capacitor for the SN74LV139ADGVR, and where should it be placed?
Texas Instruments recommends a 0.1μF ceramic bypass capacitor placed as close as possible to the VCC pin (pin 16) with a low-inductance path to GND (pin 8). For enhanced noise suppression, a parallel 1μF capacitor may be added. The SN74LV139ADGVR's TVSOP-16 package requires tight placement-within 2mm of the power pin-to minimize loop inductance and maintain signal integrity at high switching speeds.
How does the enable logic work on the SN74LV139ADGVR, and can it be used for demultiplexing?
The SN74LV139ADGVR features two independent active-low enables (1G, 2G): when asserted low, each enables its respective 2-to-4 decoder; when high, all four outputs go high-impedance. In demultiplexing mode, an enable pin serves as the data input-e.g., driving 1G with serial data while addressing Y0–Y3 with A0/A1. The SN74LV139ADGVR's architecture supports this natively without external gates or timing adjustments.
SN74LV139ADGVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LV
- Package/Case:
- 16-TFSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Decoder/Demultiplexer
- Circuit:
- 1 x 2:4
- Independent Circuits:
- 2
- Current - Output High, Low:
- 12mA, 12mA
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-TVSOP
SN74LV139ADGVR FAQ
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7.What is the process for return or replacement of SN74LV139ADGVR?
All SN74LV139ADGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74LV139ADGVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LV139ADGVR part is unused and in its original packaging.
Return procedure for SN74LV139ADGVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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