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Texas Instruments SN74LV139ADGVRE4

Part No.:
SN74LV139ADGVRE4
Manufacturer:
Texas Instruments
Category:
Signal Switches, Multiplexers, Decoders
Package:
16-TFSOP (0.173", 4.40mm Width)
Datasheet:
AetrixSN74LV139ADGVRE4.pdf
Description:
IC DECODER/DEMUX 1X2:4 16TVSOP
Quantity:
Payment:
Payment
Shipping:
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Inventory:3,582

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Product details

Overview

SN74LV139ADGVRE4 from Texas Instruments is a dual 2-line to 4-line decoder/demultiplexer in a 16-pin TVSOP (DGV) package, operating from 2 V to 5.5 V, with 7.5 ns max propagation delay at 5 V, mixed-mode voltage interface support, and Ioff partial-power-down capability-used in high-speed memory decoding and data-routing systems.

For engineers reviewing the SN74LV139ADGVRE4 datasheet, SN74LV139ADGVRE4 pinout, SN74LV139ADGVRE4 application, or SN74LV139ADGVRE4 equivalent, this page delivers verified functional modes, real-world timing behavior across VCC levels (2.5 V/3.3 V/5 V), thermal resistance (120 °C/W), latch-up immunity (>250 mA), and precise pin-level circuit roles for system integration.

Technical Context

The SN74LV139ADGVRE4 integrates two independent 2-to-4 line decoders with active-low enable inputs (1G, 2G), each accepting binary address inputs (A0/A1) to assert one of four active-low outputs (Y0–Y3). Its fully buffered inputs present only one normalized load, minimizing driver loading in cascaded or fan-out-critical paths.

It supports mixed-mode operation: inputs tolerate voltages up to 5.5 V regardless of VCC, enabling interfacing between 3.3 V logic and 5 V subsystems. The Ioff feature disables outputs during power-down, preventing backflow current when VCC = 0 V-critical for hot-swap and partial-power-down architectures.

Key Specifications

Parameter Value and Actual Design Meaning
VCC Range 2 V to 5.5 V - enables single-supply operation across legacy 5 V, modern 3.3 V, and low-voltage 2.5 V/2 V systems without level shifters.
tpd (max) 7.5 ns at VCC = 5 V, CL = 15 pF - ensures sub-10 ns decode latency for high-speed memory enable timing and address selection.
Ioff <5 μA at VCC = 0 V - guarantees safe isolation during partial power-down, eliminating risk of current injection into powered rails.
Latch-up Immunity >250 mA per JESD17 - meets industrial-grade robustness requirements for operation in noisy or transient-prone environments.
ESD Rating (HBM) ±2000 V - exceeds standard IEC 61000-4-2 Level 2, supporting reliable handling in non-EPA assembly environments.
Operating Temperature –40 °C to +85 °C - qualified for extended industrial temperature range, suitable for embedded control and communications equipment.

Pinout & Package

SN74LV139ADGVRE4 uses a 16-pin Thin Very Small Outline Package (TVSOP, DGV), body size 3.6 mm × 4.4 mm, total footprint 3.6 mm × 6.4 mm, 0.5 mm lead pitch, and exposed pad for thermal enhancement.

Pin/Terminal Circuit Role Design Meaning
1 1G Active-low enable for Channel 1 - drives all four Y0–Y3 outputs high-impedance when asserted (logic low).
2 1A0 LSB address input for Channel 1 - selects output line in conjunction with 1A1 per truth table.
3 1A1 MSB address input for Channel 1 - determines which of Y0–Y3 is driven low when 1G is inactive.
4–7 1Y0–1Y3 Active-low decoded outputs for Channel 1 - only one asserts low per valid A1:A0 combination; others remain high.
8 GND Ground reference for both channels - must be low-impedance and decoupled near VCC pin.
9–12 2Y3–2Y0 Active-low decoded outputs for Channel 2 - pin order reversed vs. Channel 1 (Y3 first) per top-view layout.
13–14 2A1, 2A0 MSB/LSB address inputs for Channel 2 - functionally identical to 1A1/1A0 but independent signal domain.
15 2G Active-low enable for Channel 2 - independently controls Channel 2 outputs, enabling asynchronous demux routing.
16 VCC Positive supply - requires local 0.1 μF ceramic bypass capacitor placed adjacent to pin per TI layout guidelines.

Key Features

Feature Design Value
Dual independent decoders Two fully isolated 2-to-4 decode blocks share only VCC/GND - enables parallel address decoding or split-channel data distribution.
Mixed-mode voltage interface Inputs tolerate up to 5.5 V regardless of VCC (2–5.5 V) - eliminates external level translators when interfacing 5 V sensors or legacy peripherals to 3.3 V controllers.
Ioff partial-power-down Outputs enter high-Z state with <5 μA leakage when VCC = 0 V - prevents backfeeding and allows safe insertion/removal in live backplanes.
High-speed memory decoding 7.5 ns tpd at 5 V ensures decoder delay is negligible versus typical SRAM/ROM access times (>10 ns), preserving system timing margins.
Robust ESD and latch-up immunity ±2000 V HBM ESD rating and >250 mA latch-up immunity per JESD17 - sustains reliability in manufacturing, test, and field-deployed environments.

Applications

Memory Address Decoding Peripheral Select Logic

Use Scenario: Selecting one of four SRAM banks in a microcontroller-based data logger using A1:A0 address lines.

IC Role / Device Role / Timing Role: Dual decoder provides simultaneous bank-enable signals with sub-10 ns propagation, aligning with memory access timing budgets.

Use Value: Eliminates need for discrete logic or FPGA resources; reduces BOM count and PCB area while maintaining deterministic timing.

Use Scenario: Enabling one of four UART transceivers on an industrial gateway board based on configuration register bits.

IC Role / Device Role / Timing Role: Acts as peripheral select arbiter, with independent 1G/2G enables allowing dynamic channel activation without bus contention.

Use Value: Enables software-configurable I/O expansion using minimal GPIO pins (2 address + 2 enable lines for 4 devices).

Data Demultiplexing Logic-Level Translation Bridge

Use Scenario: Routing a single serial control stream from an MCU to four separate sensor modules via dedicated enable lines.

IC Role / Device Role / Timing Role: Functions as synchronous demultiplexer: data path controlled by G inputs, address lines steer destination.

Use Value: Reduces interconnect complexity versus point-to-point wiring; supports shared clock/data busses with per-device gating.

Use Scenario: Interfacing a 5 V analog front-end ASIC with a 3.3 V ARM Cortex-M7 host processor's GPIO-controlled enable signals.

IC Role / Device Role / Timing Role: Provides level-tolerant address and enable inputs while driving 3.3 V-compatible active-low outputs.

Use Value: Removes requirement for discrete MOSFET translators or dedicated level-shifter ICs, lowering cost and design risk.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 2-to-4 decoder applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74LV139ADR SOIC-16 (D) package, 73 °C/W θJA, same electrical specs and pinout. Requires larger PCB footprint (9.9 mm × 6 mm vs. 3.6 mm × 6.4 mm); better thermal performance in low-airflow environments. Select for prototyping, manual soldering, or thermal-limited designs where TVSOP reflow constraints apply.
SN74LV139APWR TSSOP-16 (PW) package, 108 °C/W θJA, identical logic function and AC/DC specs. Intermediate footprint (5.0 mm × 6.4 mm); compatible with standard TSSOP reflow profiles but less compact than TVSOP. Choose when TVSOP handling infrastructure is unavailable or when legacy TSSOP placement tooling is in use.

Compared with SN74LV139ADGVRE4, SN74LV139ADR offers superior thermal dissipation in space-tolerant layouts, while SN74LV139APWR provides a widely supported intermediate-density alternative-neither is pin-compatible with the DGV variant due to differing package dimensions and land patterns.

Availability

SN74LV139ADGVRE4 is available at Aetrix Electronics and suitable for high-speed memory decoding, industrial peripheral selection, data demultiplexing, and logic-level translation applications requiring stable component supply and guaranteed long-term sourcing.

Supply support for SN74LV139ADGVRE4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 50 years of innovation in high-reliability, industry-standard logic families.

The SN74LV139A series was designed for high-performance memory-decoding and data-routing systems demanding low propagation delay, wide VCC range, and robust partial-power-down operation in industrial and computing applications.

FAQ

What is the maximum propagation delay of SN74LV139ADGVRE4 at 3.3 V?

The maximum propagation delay (tpd) of SN74LV139ADGVRE4 is 13 ns at VCC = 3.3 V ± 0.3 V with 15 pF load, as specified in Section 4.7 of the datasheet. This value applies to transitions from address or enable inputs to any Y output under recommended operating conditions and ensures timing compliance in 3.3 V high-speed digital systems. SN74LV139ADGVRE4 maintains consistent performance across its full voltage range.

Does SN74LV139ADGVRE4 support mixed-voltage operation between 3.3 V and 5 V domains?

Yes, SN74LV139ADGVRE4 supports mixed-mode voltage operation: its inputs tolerate voltages up to 5.5 V regardless of VCC, allowing direct connection of 5 V address or enable signals to a 3.3 V-powered SN74LV139ADGVRE4. Outputs swing rail-to-rail (0 V to VCC), so they are compatible with 3.3 V receivers. This eliminates external level shifters in hybrid-voltage systems.

What is the purpose of the Ioff feature in SN74LV139ADGVRE4?

The Ioff feature in SN74LV139ADGVRE4 disables all outputs and limits input/output leakage to <5 μA when VCC = 0 V, preventing damaging current backflow during partial power-down or hot-swap events. This ensures system-level safety in modular or field-upgradable hardware where subsystems may be powered independently. SN74LV139ADGVRE4 implements this per JEDEC JESD78 requirements.

Can SN74LV139ADGVRE4 be used for demultiplexing applications?

Yes, SN74LV139ADGVRE4 is explicitly designed for demultiplexing: its active-low enable inputs (1G, 2G) can serve as data lines, while address inputs (A0/A1) select the output channel. Each channel independently routes one input to four possible destinations with active-low assertion. This functionality is confirmed in the device functional modes section and logic diagram of the SN74LV139ADGVRE4 datasheet.

What is the thermal resistance (θJA) of SN74LV139ADGVRE4 in its TVSOP package?

The junction-to-ambient thermal resistance (θJA) of SN74LV139ADGVRE4 in the TVSOP (DGV) package is 120 °C/W, as documented in Section 4.4 of the datasheet. This value assumes standard JEDEC high-k board conditions (2S2P) and informs thermal design margining-especially important in dense layouts or elevated ambient temperatures. SN74LV139ADGVRE4's small footprint necessitates attention to copper pour and airflow.

SN74LV139ADGVRE4 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74LV
Package/Case:
16-TFSOP (0.173", 4.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Type:
Decoder/Demultiplexer
Circuit:
1 x 2:4
Independent Circuits:
2
Current - Output High, Low:
12mA, 12mA
Voltage Supply Source:
Single Supply
Voltage - Supply:
2V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-TVSOP

SN74LV139ADGVRE4 FAQ

1.How can I place an order for SN74LV139ADGVRE4 through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74LV139ADGVRE4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of SN74LV139ADGVRE4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LV139ADGVRE4 is usually 5 days.

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SN74LV139ADGVRE4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74LV139ADGVRE4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74LV139ADGVRE4?

For technical support, including SN74LV139ADGVRE4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LV139ADGVRE4 requirements.

6.How does Aetrix verify that SN74LV139ADGVRE4 is sourced from the original manufacturer or authorized distributors?

All SN74LV139ADGVRE4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LV139ADGVRE4 meets industry standards.

7.What is the process for return or replacement of SN74LV139ADGVRE4?

All SN74LV139ADGVRE4 units undergo pre-shipment inspection (PSI). If there is an issue with SN74LV139ADGVRE4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74LV139ADGVRE4 part is unused and in its original packaging.

Return procedure for SN74LV139ADGVRE4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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