Texas Instruments SN74LV244ARGYR

Overview

SN74LV244ARGYR from Texas Instruments is an octal 3-state buffer/driver IC designed for bidirectional signal buffering in 2-V to 5.5-V systems. It features two independent 4-bit groups, each with dedicated output-enable (OE) control, 6.5 ns maximum propagation delay at 5 V, ±16 mA output drive capability, and I_off support for partial power-down operation. It is used in server backplanes and telecom interface boards to isolate and strengthen digital control signals between FPGAs and peripheral ASICs.

For engineers reviewing the SN74LV244ARGYR datasheet, SN74LV244ARGYR pinout, SN74LV244ARGYR application, or SN74LV244ARGYR equivalent, key selection considerations include its VQFN-20 (RGY) package thermal performance (R_θJA = 34.9°C/W), mixed-mode voltage compatibility across ports, ground-bounce immunity (<0.8 V at 3.3 V), and precise 3-state timing parameters (t_en, t_dis, t_pd) under varying load capacitance.

Technical Context

The SN74LV244ARGYR implements dual 4-bit non-inverting buffer architecture with separate OE pins per group, enabling independent enable/disable control of two signal lanes. Its balanced CMOS 3-state outputs provide symmetrical sourcing and sinking capability up to ±16 mA at 3.3 V and ±8 mA at 2.3 V, supporting robust driving of PCB traces and connector-linked loads.

It incorporates I_off circuitry that disables all outputs when V_CC = 0 V, limiting leakage to ≤5 µA per terminal, and features standard CMOS inputs with ≤2.3 pF input capacitance and defined VIH/VIL thresholds scalable with supply voltage - critical for reliable interfacing with mixed-voltage logic domains.

Key Specifications

Pinout & Package

VQFN-20 package (RGY) with 4.5 mm × 3.5 mm footprint and exposed thermal pad - optimized for low-inductance grounding and enhanced thermal dissipation (R_θJA = 34.9°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal 3-state buffer applications.

Compared with SN74LVC244APWR and 74LVX244M, the SN74LV244ARGYR delivers superior thermal performance (R_θJA = 34.9°C/W) and compact 4.5 mm × 3.5 mm footprint - making it optimal for high-density, thermally demanding applications like telecom line cards and embedded server modules where layout area and junction temperature are critical constraints.

Availability

SN74LV244ARGYR is available at Aetrix Electronics and suitable for server backplanes, LED display controllers, telecom infrastructure interfaces, and motor-drive control boards requiring stable component supply across extended temperature ranges (–40°C to 125°C) and long production lifecycles.

Supply support for SN74LV244ARGYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 50 years of innovation in high-reliability interface and signal-chain components.

The SN74LV244A belongs to TI's LV logic family, engineered for low-voltage, high-speed digital interfacing in industrial, communications, and computing systems - emphasizing robust 3-state control, mixed-voltage compatibility, and thermal efficiency in space-constrained packages.

FAQ

What is the maximum recommended load capacitance for SN74LV244ARGYR to meet all datasheet timing specifications?

The SN74LV244ARGYR is characterized and guaranteed to meet all switching specifications - including t_pd, t_en, and t_dis - with load capacitance ≤50 pF. While operation with higher capacitance is possible, timing margins degrade beyond this value; for designs targeting worst-case 6.5 ns t_pd at 5 V, maintain C_L ≤50 pF using short, controlled-impedance traces and minimal stub lengths. The SN74LV244ARGYR datasheet explicitly defines test conditions at 15 pF and 50 pF loads.

Does SN74LV244ARGYR support true bidirectional data flow?

No, the SN74LV244ARGYR is a unidirectional octal buffer: signals flow only from A inputs to Y outputs. It does not contain internal direction-control logic or bus transceivers. Each of its two 4-bit groups has dedicated input (A1–A4, A1'–A4') and output (Y1–Y4, Y1'–Y4') pins with no shared I/O terminals. For bidirectional applications, a separate transceiver such as the SN74LV245A is required. The SN74LV244ARGYR function table confirms fixed A→Y mapping under active OE control.

How should unused inputs be terminated on SN74LV244ARGYR to ensure stable operation?

All unused inputs on the SN74LV244ARGYR must be tied to a valid logic level - either V_CC or GND - to prevent floating states that cause excessive current draw, oscillation, or undefined outputs. Direct connection is acceptable for permanently unused pins; for pins that may be repurposed, a 10-kΩ pull-up or pull-down resistor is recommended. This requirement is specified in Section 6.3 of the SN74LV244ARGYR datasheet and applies regardless of OE state.

Can SN74LV244ARGYR drive LEDs directly, and what current limits apply?

Yes, the SN74LV244ARGYR can drive LEDs directly with up to 16 mA per output at V_CC = 4.5–5.5 V, as confirmed by its I_OL = 16 mA specification. To ensure reliability, limit continuous current to ≤16 mA per channel and total device current to ≤70 mA (summed across all outputs and V_CC/GND pins). Use series resistors calculated as R = (V_CC – V_f) / I_LED, and verify VOL remains ≤0.55 V at the selected current. The SN74LV244ARGYR application note SCLA015 confirms this use case.

Is the thermal pad on the SN74LV244ARGYR package required to be soldered to GND?

Yes, the exposed thermal pad on the SN74LV244ARGYR (RGY) package must be electrically and thermally connected to the PCB's GND plane to achieve the rated R_θJB = 12.7°C/W and prevent thermal runaway under sustained 16-mA output loading. TI's packaging guidelines specify solder paste coverage ≥80% and at least four thermal vias (0.3-mm diameter) connecting the pad to inner GND layers. Leaving the pad unconnected degrades thermal performance by >200%, risking junction temperatures exceeding 150°C.