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Texas Instruments SN74LV244ARKSR

Part No.:
SN74LV244ARKSR
Manufacturer:
Texas Instruments
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
20-VFQFN Exposed Pad
Datasheet:
AetrixSN74LV244ARKSR.pdf
Description:
IC BUFFER NON-INVERT 5.5V 20VQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,231

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Product details

Overview

SN74LV244ARKSR from Texas Instruments is an octal 3-state buffer/driver IC organized as two independent 4-bit groups, each with dedicated output-enable (OE) control. It operates from 2 V to 5.5 V, delivers ≤6.5 ns propagation delay at 5 V, supports mixed-mode voltage interfacing, and features Ioff for partial-power-down operation - used in server memory address buffering, LED display column drivers, and telecom backplane signal isolation.

For engineers reviewing the SN74LV244ARKSR datasheet, SN74LV244ARKSR pinout, SN74LV244ARKSR application, or SN74LV244ARKSR equivalent, key selection criteria include its dual-OE architecture, 16-mA output drive capability, 3.3-V/5-V compatible logic thresholds, and RKS-package thermal pad handling for industrial-grade thermal management.

Technical Context

The SN74LV244ARKSR implements balanced CMOS 3-state outputs with matched high- and low-side drive strength (±16 mA at VCC = 4.5–5.5 V), enabling clean signal integrity on long PCB traces. Its dual 4-bit structure isolates bus segments via independent OE1 and OE2 controls, supporting asymmetric enable timing in multi-drop systems.

It integrates Ioff circuitry that limits input/output leakage to ≤5 µA when VCC = 0 V, allowing safe back-driving during power sequencing. Input thresholds scale with VCC (VIH = 0.7×VCC, VIL = 0.3×VCC), ensuring interoperability across 2.5-V, 3.3-V, and 5-V domains without level shifters.

Key Specifications

ParameterValue and Actual Design Meaning
VCC Range2 V to 5.5 V - enables single-supply operation across legacy 5-V and modern 3.3-V/2.5-V systems
tpd (max)6.5 ns at VCC = 5 V, CL = 50 pF - ensures sub-150-MHz data throughput in buffered address/data paths
IOH/IOL±16 mA at VCC = 4.5–5.5 V - drives LEDs directly or fans out to ≥10 LVTTL loads
Ioff Leakage≤5 µA at VCC = 0 V - prevents current backflow during hot-swap or partial power-down sequences
VIH/VILVCC × 0.7 / VCC × 0.3 - guarantees robust noise margin (>0.7 V) across full VCC range
ESD Rating±2000 V HBM - meets industrial IEC 61000-4-2 Level 3 immunity requirements
Operating Temp–40°C to +125°C - qualified for extended-temperature embedded control and telecom infrastructure

Pinout & Package

RKS package: 20-pin VQFN (4.50 mm × 2.50 mm) with exposed thermal pad - designed for low-inductance ground connection and enhanced thermal dissipation in space-constrained layouts.

Pin/TerminalCircuit RoleDesign Meaning
1A1–1A4, 2A1–2A4InputEight buffered data inputs grouped into two 4-bit banks; accept CMOS-level signals across full VCC range
1Y1–1Y4, 2Y1–2Y43-State OutputEight push-pull outputs; enter high-impedance state when respective OE is high
1OE, 2OEDigital Enable InputActive-low enables for each 4-bit group - allows independent bus segment control without external logic
VCCPower SupplySingle supply pin for all internal logic and output drivers; requires local 0.1-µF bypass capacitor
GNDGround ReferenceCommon return path for logic and output currents; thermal pad must be connected to GND plane for RKS package

Key Features

FeatureDesign Value
Mixed-mode voltage interfaceAccepts 1.8-V inputs while operating at 3.3-V VCC - eliminates level shifters in heterogeneous digital systems
Output ground bounce (VOLP)<0.8 V at VCC = 3.3 V - reduces simultaneous switching noise in dense PCB layouts
Output VOH undershoot (VOHV)>2.3 V at VCC = 3.3 V - maintains valid HIGH logic level during fast edge transitions
Latch-up immunity>250 mA per JESD17 - ensures robustness against transient overcurrent events in motor-drive environments
Thermal pad integrationExposed pad in RKS package connects directly to PCB GND - lowers θJB to 47.8°C/W for sustained 125°C operation

Applications

Server Memory Address BufferingLED Display Column Driver

Use Scenario: Driving address lines from a CPU/memory controller to multiple DDR SDRAM modules on a high-density server motherboard.

IC Role / Device Role / Timing Role: Octal buffer isolating and strengthening address signals; dual OE pins allow staggered activation of memory banks to reduce peak current draw.

Use Value: 6.5-ns tpd ensures setup/hold timing margins are preserved across 20-cm trace lengths; ±16-mA drive sustains signal integrity under 50-pF net capacitance.

Use Scenario: Controlling column anodes in a 16×32 multiplexed LED matrix display for industrial HMIs.

IC Role / Device Role / Timing Role: High-current sink driver for LED columns; 3-state outputs enable time-multiplexed scanning without ghosting.

Use Value: VOL ≤ 0.55 V at 16-mA load ensures >2.2-V forward bias across red/green LEDs; Ioff prevents leakage-induced dimming during blanking intervals.

Telecom Backplane Signal IsolationMotor-Drive Control Logic Interface

Use Scenario: Isolating FPGA configuration data and status signals across a 10-layer telecom line card backplane with >30-cm interconnects.

IC Role / Device Role / Timing Role: Signal repeater and noise filter between FPGA I/O banks and peripheral ASICs; dual OE supports hot-plug detection sequencing.

Use Value: Mixed-voltage support allows 2.5-V FPGA I/O to interface with 3.3-V PHY devices; <0.8-V VOLP suppresses crosstalk in adjacent high-speed SerDes lanes.

Use Scenario: Interfacing microcontroller GPIOs to isolated gate drivers in a 3-phase BLDC motor inverter control board.

IC Role / Device Role / Timing Role: Level-shifting and current-boosting interface between MCU logic and optocoupler inputs; 3-state mode disables outputs during fault shutdown.

Use Value: VIH = 0.7×VCC ensures reliable recognition of 3.3-V MCU outputs at 5-V VCC; 125°C rating matches motor-control ambient requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal 3-state buffer applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SN74LVC244APWRLower VCC min (1.65 V), higher max tpd (7.1 ns @ 3.3 V), no IoffNot suitable for partial-power-down systems; better for ultra-low-voltage portable designsChoose when operating below 2 V or prioritizing cost over hot-swap robustness
74LVX244MWider VCC range (2.0–3.6 V), lower drive (±12 mA), no thermal padLimited to 3.3-V-only systems; lacks RKS thermal performance for continuous 125°C useChoose for legacy 3.3-V-only boards where footprint compatibility with SOIC-20 is required

Compared with SN74LVC244APWR and 74LVX244M, the SN74LV244ARKSR uniquely combines 2–5.5-V operation, Ioff-enabled power sequencing, and RKS-package thermal efficiency - making it optimal for industrial servers, telecom infrastructure, and motor-control systems requiring extended temperature reliability and mixed-voltage interoperability.

Availability

SN74LV244ARKSR is available at Aetrix Electronics and suitable for server memory buffering, LED display driving, and telecom backplane isolation requiring stable component supply across automotive-qualified, industrial, and extended-temperature production programs.

Supply support for SN74LV244ARKSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions for industrial, automotive, and communications markets.

The SN74LV244A belongs to TI's LV logic family - engineered for high-speed, low-voltage operation with robust noise immunity and mixed-signal compatibility in mission-critical infrastructure equipment.

FAQ

What is the maximum capacitive load the SN74LV244ARKSR can drive while maintaining specified timing?

The SN74LV244ARKSR is characterized up to 50 pF load capacitance across all VCC conditions (2 V–5.5 V). At CL = 50 pF and VCC = 5 V, tpd remains ≤6.5 ns and tdis ≤15.5 ns. Driving larger loads increases propagation delay nonlinearly and may degrade VOL/VOH margins - TI recommends limiting total net capacitance to ≤50 pF for guaranteed specification compliance in the SN74LV244ARKSR.

How should the thermal pad on the SN74LV244ARKSR RKS package be connected?

The exposed thermal pad on the SN74LV244ARKSR RKS package must be soldered to a solid GND plane on the PCB. TI specifies this connection in the Pin Functions table and thermal metrics (θJB = 47.8°C/W). Leaving the pad floating or connecting it to any signal other than GND violates the device's thermal design and risks exceeding junction temperature limits during sustained 125°C operation.

Does the SN74LV244ARKSR support hot-swapping or live insertion?

Yes - the SN74LV244ARKSR supports partial-power-down operation via its Ioff feature. When VCC = 0 V, input and output leakage is limited to ≤5 µA, preventing current backflow from live system buses into the unpowered device. This enables safe hot-swap in modular telecom and server backplanes, provided OE pins are held inactive (high) during insertion.

Can unused inputs on the SN74LV244ARKSR be left floating?

No - all unused inputs on the SN74LV244ARKSR must be terminated to either VCC or GND. Floating CMOS inputs cause excessive supply current, oscillation, and potential latch-up. TI's datasheet mandates termination using direct connection or a 10-kΩ pull-up/pull-down resistor. This requirement applies to both A-inputs and OE pins not in use.

What is the purpose of the dual OE (1OE and 2OE) pins on the SN74LV244ARKSR?

The dual OE pins (1OE and 2OE) provide independent 3-state control for the two 4-bit buffer groups (1A1–1A4 → 1Y1–1Y4 and 2A1–2A4 → 2Y1–2Y4). This enables selective bus isolation - for example, disabling one memory bank while keeping another active - reducing system-level contention and dynamic power consumption without requiring external gating logic in the SN74LV244ARKSR.

SN74LV244ARKSR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74LV
Package/Case:
20-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Logic Type:
Buffer, Non-Inverting
Number of Elements:
2
Number of Bits per Element:
4
Input Type:
-
Output Type:
3-State
Current - Output High, Low:
16mA, 16mA
Voltage - Supply:
2V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
20-VQFN (2.5x4.5)

SN74LV244ARKSR FAQ

1.How can I place an order for SN74LV244ARKSR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74LV244ARKSR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74LV244ARKSR reliable?

The price and inventory of SN74LV244ARKSR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LV244ARKSR is usually 5 days.

3.What payment methods are accepted for SN74LV244ARKSR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74LV244ARKSR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SN74LV244ARKSR?

SN74LV244ARKSR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74LV244ARKSR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74LV244ARKSR?

For technical support, including SN74LV244ARKSR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LV244ARKSR requirements.

6.How does Aetrix verify that SN74LV244ARKSR is sourced from the original manufacturer or authorized distributors?

All SN74LV244ARKSR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LV244ARKSR meets industry standards.

7.What is the process for return or replacement of SN74LV244ARKSR?

All SN74LV244ARKSR units undergo pre-shipment inspection (PSI). If there is an issue with SN74LV244ARKSR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74LV244ARKSR part is unused and in its original packaging.

Return procedure for SN74LV244ARKSR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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