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Texas Instruments SN74LV244BMDWREP

Part No.:
SN74LV244BMDWREP
Manufacturer:
Texas Instruments
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
20-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixSN74LV244BMDWREP.pdf
Description:
ENHANCED PRODUCT EIGHT-CHANNEL 2
Quantity:
Payment:
Payment
Shipping:
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Inventory:1,864

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Product details

Overview

SN74LV244BMDWREP from Texas Instruments is an enhanced-product octal noninverting buffer/line driver with 3-state outputs, designed for 2-V to 5.5-V operation across –55°C to +125°C ambient. It features dual independent output-enable controls (1OE, 2OE), Ioff partial-power-down protection, and ±35-mA output drive per channel. It is used in radiation-tolerant aerospace data buses to isolate and strengthen control signals during system reset or power sequencing.

For engineers reviewing the SN74LV244BMDWREP datasheet, SN74LV244BMDWREP pinout, SN74LV244BMDWREP application, or SN74LV244BMDWREP equivalent, key selection criteria include VCC range compatibility (2–5.5 V), guaranteed operation at –55°C/+125°C, Ioff-enabled backflow prevention, 3-state timing (tdis ≤ 15.5 ns @ 5 V), and SOIC-20 package footprint constraints.

Technical Context

The SN74LV244BMDWREP implements two independent 4-channel banks (Bank 1: pins 1A1–1Y4; Bank 2: 2A1–2Y4), each with dedicated active-low output-enable inputs (1OE, 2OE). Its CMOS input structure requires fast transitions (≤20 ns/V at 5 V) and mandates termination of unused inputs to VCC or GND to prevent oscillation.

Outputs are balanced push-pull 3-state drivers with matched sourcing/sinking capability (±12 mA @ 5 V), supporting mixed-voltage interfacing across banks. The integrated Ioff circuit disables all outputs when VCC = 0 V, limiting leakage to ≤5 µA and preventing damaging current backflow during partial power-down sequences.

Key Specifications

ParameterValue and Actual Design Meaning
VCC Range2 V to 5.5 V - supports direct interface with 2.5-V, 3.3-V, and 5-V logic families without level shifters.
Operating Temperature–55°C to +125°C - qualified for extended military/aerospace environments with full parametric validation.
Ioff Leakage≤5 µA at 0 V VCC - ensures safe isolation during hot-swap or staged power-up/down without external blocking diodes.
Output Drive±12 mA @ 5 V - drives 50-pF loads while maintaining VOL ≤ 0.55 V and VOH ≥ 3.8 V for robust noise margin.
Propagation Delay3.9 ns (min) / 6.5 ns (max) @ 5 V, CL = 15 pF - enables high-speed signal routing in real-time control subsystems.
ESD Rating±2000 V HBM - meets MIL-STD-883 Class 3B requirements for handling in controlled manufacturing environments.
Thermal ResistanceRθJA = 102.3°C/W - allows continuous operation at full load up to +125°C ambient with standard SOIC-20 PCB layout.

Pinout & Package

DW package: 20-pin SOIC, 12.8 mm × 10.3 mm body, surface-mount, gull-wing leads.

Pin/TerminalCircuit RoleDesign Meaning
1OEInput (active low)Enables/disables Bank 1 outputs (1Y1–1Y4); must be pulled high or driven to disable bank.
1A1–1A4InputsNoninverting data inputs for Bank 1; require CMOS-compatible voltage thresholds (VIH ≥ 0.7×VCC).
1Y1–1Y4Outputs (3-state)Buffered noninverting outputs for Bank 1; high-impedance when 1OE = high.
2OEInput (active low)Enables/disables Bank 2 outputs (2Y1–2Y4); independent control enables staggered bus arbitration.
2A1–2A4InputsNoninverting data inputs for Bank 2; supports mixed-voltage operation with Bank 1 at different VCC levels.
2Y1–2Y4Outputs (3-state)Buffered noninverting outputs for Bank 2; isolated from Bank 1 for fault containment.
VCCPower supplySingle positive supply (2–5.5 V); requires local 0.1-µF bypass capacitor adjacent to pin 20.
GNDGround referenceCommon return path for all I/O and supply currents; must be low-impedance plane for noise immunity.

Key Features

FeatureDesign Value
Dual independent output-enableEnables selective activation of Bank 1 or Bank 2-critical for time-multiplexed bus sharing in avionics controllers.
Ioff partial-power-downPrevents backflow current when VCC is off-eliminates need for external isolation components in multi-rail systems.
Mixed-mode voltage supportAllows Bank 1 and Bank 2 to interface with different logic families simultaneously (e.g., 3.3-V MCU ↔ 5-V peripheral).
Latch-up immunityExceeds 250 mA per JESD17-ensures reliability in high-noise launch vehicle power environments.
Controlled baseline & traceabilitySingle fab/assembly/test site with full lot traceability-meets DoD-STD-2167A and ISO 9001 aerospace quality requirements.

Applications

Avionics Data Bus IsolationSpacecraft Power Sequencing

Use Scenario: Isolating command signals between flight computer and actuator modules during in-flight reconfiguration.

IC Role / Device Role / Timing Role: Octal buffer providing noise-immune signal amplification and 3-state bus contention control on MIL-STD-1553B auxiliary lines.

Use Value: Dual OE pins allow independent gating of sensor vs. actuator channels, reducing electromagnetic coupling during simultaneous updates.

Use Scenario: Enabling sequential power-up of payload subsystems after satellite separation.

IC Role / Device Role / Timing Role: Level-shifting and buffering reset signals across 2.5-V, 3.3-V, and 5-V domains during staged power delivery.

Use Value: Ioff protection prevents backfeed from powered subsystems into unpowered rails, eliminating risk of latch-up during ramp-up.

Defense Radar Signal ConditioningMedical Imaging Timing Control

Use Scenario: Driving long PCB traces from FPGA timing generators to RF front-end modulators in ground-based radar.

IC Role / Device Role / Timing Role: Low-noise line driver strengthening clock and sync pulses over >12 cm traces with minimal jitter addition.

Use Value: 3.9 ns propagation delay and 1 ns skew (tsk(o)) preserve sub-nanosecond timing alignment required for coherent beamforming.

Use Scenario: Controlling X-ray detector array enable strobes in CT scanner gantry electronics exposed to thermal cycling.

IC Role / Device Role / Timing Role: High-reliability buffer holding detector gate signals stable during FPGA reconfiguration events.

Use Value: –55°C to +125°C qualification ensures uninterrupted operation during rapid thermal transients inside rotating gantry enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal 3-state buffer applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SN74LVC244APWREPLower VCC range (1.65–3.6 V); no Ioff; rated only to +105°C.Suitable for commercial industrial controllers but not for extended-temp aerospace use.Select only if operating exclusively at 3.3 V and ambient ≤ +105°C; verify absence of partial-power-down requirement.
SN74LVTH244MDWREPHigher drive (±64 mA); TTL-compatible inputs; same temperature range and Ioff.Required when interfacing legacy 5-V TTL logic with modern LVCMOS systems.Choose when driving heavier capacitive loads (>50 pF) or when input VIH/VIL thresholds must match TTL standards.

Compared with SN74LV244BMDWREP, SN74LVC244APWREP lacks Ioff and extended temperature rating-making it unsuitable for defense/aerospace partial-power-down scenarios-while SN74LVTH244MDWREP adds TTL input compatibility and higher drive strength at the cost of increased ICC, requiring careful thermal evaluation in dense layouts.

Availability

SN74LV244BMDWREP is available at Aetrix Electronics and suitable for aerospace flight computers, radiation-hardened telemetry systems, and medical imaging timing modules requiring stable component supply under extended temperature and long-lifecycle commitments.

Supply support for SN74LV244BMDWREP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability ICs for industrial, automotive, and aerospace markets.

The SN74LV244BMDWREP belongs to TI's Enhanced Product (EP) logic family, engineered specifically for mission-critical applications demanding extended temperature operation, controlled manufacturing baselines, and full lot traceability.

FAQ

What is the maximum capacitive load the SN74LV244BMDWREP can drive while meeting all datasheet specifications?

The SN74LV244BMDWREP is fully specified for loads ≤50 pF across all VCC and temperature conditions. At 50 pF, propagation delay remains ≤8.5 ns and output voltage margins (VOH/VOL) stay within spec. Driving larger loads increases delay and degrades noise margin; TI recommends adding series damping resistors or using higher-drive variants like SN74LVTH244MDWREP for >50-pF applications. The SN74LV244BMDWREP datasheet explicitly states 50 pF as the validated limit for guaranteed timing and DC performance.

Does the SN74LV244BMDWREP support mixed-voltage operation between its two banks?

Yes, the SN74LV244BMDWREP supports mixed-mode voltage operation: Bank 1 (1A1–1Y4) and Bank 2 (2A1–2Y4) may operate at different VCC levels within the 2-V to 5.5-V range, provided each bank's inputs remain within its own VCC domain. This enables direct interfacing between 2.5-V FPGAs and 5-V peripherals without external level translators. The SN74LV244BMDWREP datasheet confirms this capability in Section 1 Features and Section 8.3.1.

How does the Ioff feature of the SN74LV244BMDWREP protect the device during partial power-down?

The Ioff circuitry in the SN74LV244BMDWREP disables all outputs when VCC = 0 V, limiting leakage current to ≤5 µA per pin regardless of input or output voltages (0–5.5 V). This prevents damaging backflow current from powered downstream circuits into the unpowered SN74LV244BMDWREP, eliminating risk of latch-up or thermal overstress. The SN74LV244BMDWREP datasheet specifies Ioff in Section 6.5 Electrical Characteristics and details its implementation in Section 8.3.3.

What is the recommended bypass capacitor configuration for the SN74LV244BMDWREP?

Texas Instruments recommends a 0.1-µF ceramic capacitor placed physically adjacent to the VCC pin (pin 20) and GND (pin 10) of the SN74LV244BMDWREP. The capacitor must have low ESL/ESR and be mounted with minimal trace length to ensure effective high-frequency noise suppression. Layout guidelines in the SN74LV244BMDWREP datasheet (Section 9.4.2) show the capacitor directly bridging VCC–GND with vias to inner ground planes. No additional bulk capacitance is required for typical logic-speed operation.

Can unused inputs on the SN74LV244BMDWREP be left floating?

No, unused inputs on the SN74LV244BMDWREP must never be left floating. As a CMOS device, floating inputs cause excessive power consumption, oscillation, and potential device damage. All unused inputs must be terminated to a valid logic level-either tied directly to VCC or GND, or via a 10-kΩ pull-up/pull-down resistor. This requirement is explicitly stated in Section 6.3 Recommended Operating Conditions and Section 8.3.1 of the SN74LV244BMDWREP datasheet.

SN74LV244BMDWREP Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74LV
Package/Case:
20-SOIC (0.295", 7.50mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Logic Type:
Buffer, Non-Inverting
Number of Elements:
2
Number of Bits per Element:
4
Input Type:
-
Output Type:
3-State
Current - Output High, Low:
12mA, 12mA
Voltage - Supply:
2V ~ 5.5V
Operating Temperature:
-55°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
20-SOIC

SN74LV244BMDWREP FAQ

1.How can I place an order for SN74LV244BMDWREP through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74LV244BMDWREP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74LV244BMDWREP reliable?

The price and inventory of SN74LV244BMDWREP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LV244BMDWREP is usually 5 days.

3.What payment methods are accepted for SN74LV244BMDWREP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74LV244BMDWREP transactions.

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4.How is shipping managed for SN74LV244BMDWREP?

SN74LV244BMDWREP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74LV244BMDWREP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74LV244BMDWREP?

For technical support, including SN74LV244BMDWREP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LV244BMDWREP requirements.

6.How does Aetrix verify that SN74LV244BMDWREP is sourced from the original manufacturer or authorized distributors?

All SN74LV244BMDWREP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LV244BMDWREP meets industry standards.

7.What is the process for return or replacement of SN74LV244BMDWREP?

All SN74LV244BMDWREP units undergo pre-shipment inspection (PSI). If there is an issue with SN74LV244BMDWREP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74LV244BMDWREP part is unused and in its original packaging.

Return procedure for SN74LV244BMDWREP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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