Texas Instruments SN74LV245ATDGVR

Overview

SN74LV245ATDGVR from Texas Instruments is an octal bus transceiver with 3-state outputs, designed for asynchronous bidirectional data transfer between two 8-bit buses. It operates from 4.5 V to 5.5 V, delivers typical propagation delay of 3.5 ns at 5 V, supports mixed-mode voltage operation on all ports, and features Ioff partial-power-down protection. It is used in industrial control backplanes and embedded system inter-board communication.

For engineers reviewing the SN74LV245ATDGVR datasheet, SN74LV245ATDGVR pinout, SN74LV245ATDGVR application, or SN74LV245ATDGVR equivalent, key selection factors include direction-control logic behavior, 3-state output isolation timing (tPZH/tPLZ < 10 ns), Ioff current (<5 µA at 0–5.5 V), TTL-compatible inputs, and TVSOP-20 thermal performance (θJA = 92°C/W).

Technical Context

This device implements dual-bus bidirectional data routing via a single DIR input controlling signal flow direction (A→B or B→A), while OE independently enables or disables all outputs into high-impedance state. Its logic diagram confirms noninverting data paths and separate control of enable and direction functions.

Designed for robustness in mixed-voltage systems, it supports 5-V operation with TTL-level input thresholds (VIH = 2 V, VIL = 0.8 V) and maintains valid output levels across full VCC range. The Ioff circuit actively blocks current backflow during partial power-down, meeting JESD 78 latch-up immunity (>250 mA) and JESD 22 ESD ratings (2000-V HBM, 1000-V CDM).

Key Specifications

Pinout & Package

SN74LV245ATDGVR is housed in a 20-pin TVSOP (Thin Very Small Outline Package) with 0.5-mm pitch, 3.5 mm × 4.4 mm body, and 1.2 mm max height. The package includes an exposed thermal pad (pin 21) requiring PCB soldering for optimal thermal dissipation (θJA = 92°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal bus transceiver applications.

Compared with SN74LV245ATDGVR, SN74LVC245A lacks 5-V tolerance and Ioff, making it unsuitable for mixed-voltage or partial-power-down systems; 74ACT245 offers speed but sacrifices thermal ruggedness and power-down safety-neither is pin-compatible nor drop-in replaceable.

Availability

SN74LV245ATDGVR is available at Aetrix Electronics and suitable for industrial backplanes, automotive body controllers, and medical data acquisition systems requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for SN74LV245ATDGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity solutions, with decades of experience in high-reliability logic and interface ICs.

The SN74LV245ATDGVR belongs to TI's LV-A family of low-voltage, high-speed logic devices engineered for robust 5-V operation in industrial, automotive, and medical systems demanding wide temperature range and power-down safety.

FAQ

What is the maximum operating temperature for SN74LV245ATDGVR?

The SN74LV245ATDGVR is rated for continuous operation from –40°C to +125°C ambient temperature. This extended range is validated per JEDEC JESD22-A108 and supports deployment in under-hood automotive ECUs, industrial motor drives, and outdoor telecom base stations where thermal management is constrained.

Does SN74LV245ATDGVR support 3.3-V input signals when powered at 5 V?

Yes, SN74LV245ATDGVR supports mixed-mode voltage operation: its inputs accept 0–5.5 V signals regardless of VCC, so 3.3-V logic levels from an FPGA or microcontroller are fully recognized as valid VIH/VIL at 5-V supply. No external level shifters are needed.

How should OE be handled during power-up to avoid bus contention?

To ensure high-impedance outputs at power-up, OE must be held high (disabled) until VCC stabilizes. TI recommends tying OE to VCC via a pullup resistor; minimum value depends on driver sink capability but 10 kΩ is commonly used. Leaving OE floating risks undefined output states.

Is SN74LV245ATDGVR pin-compatible with other packages in the SN74LV245AT family?

No-SN74LV245ATDGVR uses a 20-pin TVSOP (DGV) package with 0.5-mm pitch and exposed thermal pad. While pin functions match across DB, DGV, DW, NS, PW, and RGY variants, mechanical dimensions, thermal pad layout, and solder stencil requirements differ significantly; PCB redesign is required for package substitution.

What is the purpose of the exposed thermal pad on SN74LV245ATDGVR?

The exposed thermal pad (pin 21) on SN74LV245ATDGVR must be soldered to a dedicated PCB copper pour for effective heat dissipation. It reduces θJA from 92°C/W to ~45°C/W when properly implemented, preventing thermal throttling in sustained 16-mA output drive scenarios and improving long-term reliability.