Texas Instruments SN74LV541APWG4
- Part No.:
- SN74LV541APWG4
- Manufacturer:
- Texas Instruments
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74LV541APWG4.pdf
- Description:
- IC BUF NON-INVERT 5.5V 20TSSOP
- Quantity:
- Payment:

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Product details
Overview
SN74LV541APWG4 from Texas Instruments is an octal non-inverting 3-state buffer/driver IC designed for bus interface and memory address buffering in mixed-voltage systems. It operates across 2-V to 5.5-V VCC, delivers 5-ns typical propagation delay at 5 V, supports partial-power-down via Ioff, and features dual active-low output-enable inputs (OE1/OE2) for independent group control - used in server backplanes and surveillance camera data buses.
For engineers reviewing the SN74LV541APWG4 datasheet, SN74LV541APWG4 pinout, SN74LV541APWG4 application, or SN74LV541APWG4 equivalent, key selection criteria include its 20-pin TSSOP package, 3.3-V/5-V mixed-mode voltage tolerance, 35-mA output drive capability, Ioff protection for hot-swap scenarios, and guaranteed 6-ns max tpd at 5 V with 15-pF load.
Technical Context
The SN74LV541APWG4 implements eight independent non-inverting buffers, each with CMOS-compatible input thresholds and balanced push-pull 3-state outputs. Its dual OE inputs feed an internal AND gate, forcing all eight Y outputs into high-impedance when either OE1 or OE2 is high - enabling flexible bus arbitration in multi-master systems.
It integrates Ioff circuitry that disables outputs and limits leakage to 5 µA when VCC = 0 V, supporting safe partial-power-down operation. Ground bounce (VOLP < 0.8 V) and VOH undershoot (VOHV > 2.3 V) are characterized at 3.3 V, confirming robust signal integrity for high-speed digital interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2 V to 5.5 V - enables interoperability between 2.5-V, 3.3-V, and 5-V logic domains without level shifters. |
| Max tpd | 6 ns at VCC = 5 V, CL = 15 pF - ensures sub-10-ns timing margin for 100-MHz bus clocking. |
| Ioff | 5 µA max at VCC = 0 V - prevents backflow current during hot insertion or power sequencing. |
| Output Drive | ±35 mA per output - sufficient to drive 50-pF loads or terminate short stubs on PCB traces. |
| VOL/VOH | 0.44 V max / 2.48 V min at VCC = 3 V, IOL/IOH = 8 mA - meets TTL and LVTTL input thresholds reliably. |
| ESD Rating | ±3000 V HBM - exceeds JEDEC JESD22-A114 for robust handling in automated assembly. |
| Operating Temp | –40°C to +125°C - qualified for industrial and automotive under-hood environments. |
Pinout & Package
Packaged in a 20-pin TSSOP (PW), the SN74LV541APWG4 measures 6.5 mm × 7.8 mm with gull-wing leads and exposed thermal pad (not present in PW variant). Pin 1 is marked by a dot; pins 1–10 occupy one side, pins 11–20 the opposite - facilitating straight-through PCB routing for address/data buses.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 19 | OE1, OE2 | Active-low enable inputs - both must be low for output group activation; OR'd internally for fail-safe disable. |
| 2–9 | A1–A8 | Buffer inputs - CMOS-compatible, support 0–5.5 V input range, require termination if unused. |
| 11–18 | Y1–Y8 | Non-inverting 3-state outputs - sink/source up to 35 mA, high-impedance when OE asserted. |
| 10 | GND | Digital ground reference - must be low-inductance connection to minimize switching noise. |
| 20 | VCC | Positive supply - requires local 0.1-µF ceramic bypass capacitor placed adjacent to pin. |
Key Features
| Feature | Design Value |
|---|---|
| Mixed-mode voltage operation | Inputs accept 0–5.5 V regardless of VCC - allows interfacing 5-V microcontrollers to 3.3-V FPGAs without translators. |
| Low ground bounce (VOLP) | < 0.8 V at 3.3 V - reduces false triggering on shared ground planes in dense digital systems. |
| Controlled VOH undershoot (VOHV) | > 2.3 V at 3.3 V - maintains noise margin above LVTTL VIH(min) during fast edge transitions. |
| Ioff partial-power-down | Leakage ≤5 µA at VCC = 0 V - enables safe insertion/removal in live backplanes and modular servers. |
| Latch-up immunity | >250 mA per JESD17 - eliminates risk of destructive latch-up during transient overvoltage events. |
Applications
| Server Backplane Interface | Surveillance Camera Data Bus |
|---|---|
Use Scenario: Buffering address and control signals between CPU and PCIe switch on a 1U rack server motherboard. IC Role / Device Role / Timing Role: Octal non-inverting buffer isolating high-speed control lines while enabling dynamic bus sharing via 3-state control. Use Value: 6-ns max tpd preserves setup/hold timing margins; Ioff prevents backfeed during hot-swap module replacement. |
Use Scenario: Driving parallel video data lines (e.g., BT.656) from SoC to image sensor or encoder in IP camera modules. IC Role / Device Role / Timing Role: Level-shifting and fan-out buffer for 8-bit pixel data paths operating at 27 MHz. Use Value: Mixed-voltage tolerance accommodates 3.3-V SoC I/O and 5-V legacy sensor interfaces; 35-mA drive sustains signal integrity over 10-cm flex cables. |
| Smart Grid Communication Node | Infotainment Head Unit Memory Expansion |
Use Scenario: Isolating RS-485 transceiver control lines and status indicators in DIN-rail mounted PLC I/O modules. IC Role / Device Role / Timing Role: Signal conditioning and isolation buffer for GPIO-controlled enable/disable sequencing of communication peripherals. Use Value: –40°C to +125°C rating ensures reliability in outdoor substations; dual OE inputs allow coordinated shutdown of multiple transceivers. |
Use Scenario: Expanding external SRAM or NOR flash address space in automotive infotainment head units using ARM Cortex-A cores. IC Role / Device Role / Timing Role: Address bus driver between processor and memory, with 3-state control synchronized to memory access cycles. Use Value: Low VOLP minimizes ground noise coupling into sensitive audio DAC circuits; TSSOP package fits tight layout constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC541APW | Lower VCC range (1.65–3.6 V); 5.3 ns max tpd at 3.3 V; no Ioff support. | Restricted to 3.3-V-only systems; unsuitable for mixed 5-V/3.3-V or hot-swap use cases. | Select only if operating exclusively at 3.3 V and board-level power sequencing is fully controlled. |
| 74LVX541M | Same VCC range (2–3.6 V); 7.5 ns max tpd; SOIC-20 only; no Ioff. | Limited to 3.6-V max; lacks partial-power-down; larger SOIC footprint increases board area. | Consider for cost-sensitive industrial controls where 5-V compatibility and hot-swap are not required. |
Compared with SN74LVC541APW and 74LVX541M, the SN74LV541APWG4 uniquely supports 5-V operation and Ioff-enabled hot-swap - making it the only choice for mixed-voltage server, telecom, and smart grid designs requiring robust power sequencing.
Availability
SN74LV541APWG4 is available at Aetrix Electronics and suitable for server backplanes, surveillance camera data buses, smart grid communication nodes, and automotive infotainment memory expansion requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for SN74LV541APWG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of experience in high-reliability industrial and automotive-grade components.
The SN74LV541APWG4 belongs to TI's LV family of low-voltage logic devices, engineered specifically for robust mixed-signal interfacing in infrastructure equipment where voltage flexibility, timing precision, and power sequencing resilience are critical.
FAQ
What is the maximum capacitive load the SN74LV541APWG4 can drive while maintaining specified timing?
The SN74LV541APWG4 is fully characterized for loads up to 50 pF, with switching specifications (e.g., 6-ns max tpd) guaranteed at CL = 15 pF and CL = 50 pF. Driving >50 pF increases propagation delay and may degrade edge fidelity; TI recommends limiting total load to 50 pF for compliance with datasheet timing specs. The SN74LV541APWG4 datasheet specifies performance only within this range, and exceeding it requires system-level validation.
Does the SN74LV541APWG4 support true 5-V operation, and how does it handle 5-V inputs when powered at 3.3 V?
Yes, the SN74LV541APWG4 supports full 5-V operation - VCC may be set from 2 V to 5.5 V, and inputs tolerate 0–5.5 V regardless of VCC. When powered at 3.3 V, its inputs remain compatible with 5-V logic levels due to overvoltage-tolerant CMOS structure. This mixed-mode capability eliminates external level shifters in hybrid 3.3-V/5-V systems, a key feature confirmed in Section 6.3 and 8.3.1 of the SN74LV541APWG4 datasheet.
How does the dual OE architecture of the SN74LV541APWG4 differ from single-OE octal buffers?
The SN74LV541APWG4 uses two active-low output-enable inputs (OE1 and OE2) feeding an internal AND gate - meaning outputs go high-impedance if *either* OE is high. This provides redundant disable control and simplifies fault-tolerant bus arbitration. In contrast, single-OE buffers require external logic to replicate this behavior. The SN74LV541APWG4 functional table (Section 8.4) confirms this OR-like disable behavior, enhancing system safety in mission-critical applications.
Is the SN74LV541APWG4 pin-compatible with earlier SN74LV541A variants in TSSOP packages?
Yes, the SN74LV541APWG4 shares identical pinout, electrical characteristics, and thermal profile with other SN74LV541A variants in the PW (TSSOP-20) package, including SN74LV541APWR and SN74LV541APW. The "G4" suffix denotes RoHS-compliant green packaging and tape-and-reel delivery - no functional or mechanical changes affect PCB layout or schematic design. All PW-package SN74LV541A devices use the same 20-pin TSSOP footprint.
What thermal considerations apply to the SN74LV541APWG4 in continuous 35-mA output operation?
At 35-mA per output and worst-case 125°C ambient, the SN74LV541APWG4 in TSSOP (PW) package exhibits RθJA = 128.2°C/W. With 8 outputs sourcing/sinking simultaneously at full load, power dissipation reaches ~180 mW - resulting in ~23°C junction rise above ambient. This remains well below the 150°C absolute max, but proper PCB copper pour and airflow should be verified per TI's SLLA182 thermal guidelines. The SN74LV541APWG4 thermal metrics are explicitly listed in Section 6.4 of its datasheet.
SN74LV541APWG4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LV
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 16mA, 16mA
- Voltage - Supply:
- 2V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-TSSOP
SN74LV541APWG4 FAQ
1.How can I place an order for SN74LV541APWG4 through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74LV541APWG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74LV541APWG4 reliable?
The price and inventory of SN74LV541APWG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LV541APWG4 is usually 5 days.
3.What payment methods are accepted for SN74LV541APWG4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74LV541APWG4 transactions.
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4.How is shipping managed for SN74LV541APWG4?
SN74LV541APWG4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74LV541APWG4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74LV541APWG4?
For technical support, including SN74LV541APWG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LV541APWG4 requirements.
6.How does Aetrix verify that SN74LV541APWG4 is sourced from the original manufacturer or authorized distributors?
All SN74LV541APWG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LV541APWG4 meets industry standards.
7.What is the process for return or replacement of SN74LV541APWG4?
All SN74LV541APWG4 units undergo pre-shipment inspection (PSI). If there is an issue with SN74LV541APWG4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LV541APWG4 part is unused and in its original packaging.
Return procedure for SN74LV541APWG4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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