Texas Instruments SN74LV6T17QPWRQ1

Overview

SN74LV6T17QPWRQ1 from Texas Instruments is an AEC-Q100 Grade 1 automotive hex Schmitt-trigger buffer with integrated voltage translation, supporting 1.8 V to 5.5 V single-supply operation, 5.5-V tolerant inputs, and up/down level translation across 1.2 V–5.0 V domains. It delivers six independent channels, 150 Mbps data rate at 5 V/3.3 V VCC, and operates from −40°C to +125°C for body control modules and infotainment interfaces.

For engineers reviewing the SN74LV6T17QPWRQ1 datasheet, SN74LV6T17QPWRQ1 pinout, SN74LV6T17QPWRQ1 application, or SN74LV6T17QPWRQ1 equivalent, key selection criteria include its Schmitt-trigger noise immunity, wettable-flank QFN package for AOI-compatible solder joint inspection, 1.8–5.5 V supply flexibility, and verified down-translation (e.g., 5.0 V → 1.8 V) and up-translation (e.g., 1.8 V → 3.3 V) capability per TI SCLS933.

Technical Context

The SN74LV6T17QPWRQ1 implements six independent positive-logic buffers (Y = A) with Schmitt-trigger inputs providing hysteresis (ΔVT = 0.28–1.4 V depending on VCC), enabling robust operation with slow or noisy signals. Its LVxT architecture features reduced input thresholds for up-translation and 5.5-V tolerant inputs for down-translation.

Each channel uses balanced CMOS push-pull outputs capable of ±25 mA continuous current, with output voltage referenced strictly to VCC (1.8 V/2.5 V/3.3 V/5 V CMOS levels). Propagation delay ranges from 3.29 ns (5 V, CL = 15 pF) to 22.8 ns (1.8 V, CL = 50 pF), and thermal performance is characterized by RθJA = 88.3°C/W in the BQA package.

Key Specifications

Pinout & Package

SN74LV6T17QPWRQ1 is packaged in a 14-pin wettable-flank QFN (BQA/WQFN), 3 mm × 2.5 mm body size, with exposed thermal pad (connected to GND or left floating). The package supports automated optical inspection (AOI) via side-fillet formation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar hex Schmitt-trigger buffer with translation applications.

Compared with SN74LV6T17QPWRQ1, SN74LVC1G17QDRYRQ1 lacks down-translation support and channel density, while SN74LV1T17DBVRQ1 matches translation and robustness but incurs higher layout and assembly cost due to discrete channel implementation.

Availability

SN74LV6T17QPWRQ1 is available at Aetrix Electronics and suitable for automotive body control modules, infotainment displays, powertrain sensor interfaces, and gateway ECU communication bridges requiring stable component supply across extended temperature and AEC-Q100-compliant production cycles.

Supply support for SN74LV6T17QPWRQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and automotive-grade logic solutions with over 50 years of automotive qualification experience.

The SN74LV6T17QPWRQ1 belongs to TI's LVxT family-designed specifically for voltage-domain bridging in automotive ECUs where mixed-supply subsystems (1.2 V–5.0 V) coexist on a single PCB without external translation circuitry.

FAQ

What is the maximum data rate supported by SN74LV6T17QPWRQ1?

SN74LV6T17QPWRQ1 supports up to 150 Mbps with 5-V or 3.3-V VCC, validated under load conditions of CL ≤ 50 pF. Measured propagation delay is 3.29 ns (min) at 5 V/15 pF, scaling to 22.8 ns (max) at 1.8 V/50 pF. This enables reliable use in high-speed digital control paths such as display enable signaling and sensor pulse conditioning within automotive timing budgets.

Does SN74LV6T17QPWRQ1 support down-translation from 5.0 V to 1.8 V?

Yes, SN74LV6T17QPWRQ1 supports down-translation from 5.0 V, 3.3 V, or 2.5 V inputs to 1.8 V outputs when operated with 1.8 V VCC. Its 5.5-V tolerant inputs allow direct connection to 5.0 V sources, and output logic levels conform to 1.8 V CMOS thresholds (VOH ≥ 1.21 V, VOL ≤ 0.25 V at 2 mA load), as specified in TI SCLS933 Section 6.5.

What is the purpose of the thermal pad on the SN74LV6T17QPWRQ1 BQA package?

The thermal pad on the SN74LV6T17QPWRQ1 BQA package serves dual purposes: it lowers junction-to-board thermal resistance (RθJB = 56.8°C/W) to improve power dissipation, and provides a solderable surface for enhanced mechanical reliability and AOI-compatible side-fillet formation. TI recommends connecting it to GND for EMI suppression, though it may be left floating if system grounding constraints apply.

Can unused inputs on SN74LV6T17QPWRQ1 be left floating?

No, unused inputs on SN74LV6T17QPWRQ1 must never be left floating. Each Schmitt-trigger input must be terminated to either VCC or GND using a direct connection or a 10-kΩ pull-up/pull-down resistor to prevent oscillation, excessive current draw, and undefined logic states. Floating inputs increase dynamic power consumption and risk system-level malfunction in automotive environments.

How does the Schmitt-trigger hysteresis of SN74LV6T17QPWRQ1 improve noise immunity?

SN74LV6T17QPWRQ1 provides VCC-dependent hysteresis (ΔVT = 0.28–1.4 V), creating distinct high-to-low (VT−) and low-to-high (VT+) switching thresholds. This prevents multiple toggles during slow or noisy signal transitions-critical for reliable operation with mechanical switches, analog sensor outputs, or long harness runs in vehicles. At 5 V VCC, ΔVT = 1.4 V ensures immunity to >700 mV of superimposed noise without external filtering.