Texas Instruments SN74LVC07ARGYR

Overview

SN74LVC07ARGYR from Texas Instruments is a hex buffer and driver IC with six independent open-drain outputs, designed for 1.65 V to 5.5 V operation. It delivers 24 mA sink current per output at 3.3 V, supports 5.5-V-tolerant inputs/outputs, achieves 2.6 ns max propagation delay at 5 V, and features Ioff for live insertion and partial-power-down protection. It is used in level translation and wired-OR logic in SSDs, AV receivers, and tablet power management.

For engineers reviewing the SN74LVC07ARGYR datasheet, SN74LVC07ARGYR pinout, SN74LVC07ARGYR application, or SN74LVC07ARGYR equivalent, key selection considerations include open-drain drive strength, voltage translation capability across 1.65–5.5 V rails, Ioff-enabled system hot-swap compatibility, and VQFN-14 thermal performance (RθJB = 56.7°C/W).

Technical Context

The SN74LVC07ARGYR implements six identical CMOS buffer stages, each with an open-drain output stage enabling wired-OR bus configurations and external pull-up flexibility. Its input structure accepts voltages up to 5.5 V regardless of VCC, allowing bidirectional level shifting between 1.8-V, 2.5-V, 3.3-V, and 5-V domains.

Ioff circuitry actively disables all outputs when VCC = 0 V, blocking back-drive current and supporting safe live insertion in backplane or modular systems. The device operates across –40°C to +125°C and maintains specified timing (tpd ≤ 3.1 ns at 5 V, –40°C to 125°C) under full temperature and voltage range.

Key Specifications

Pinout & Package

VQFN-14 (RGY) package, 3.50 mm × 3.50 mm body, 0.5-mm pitch, exposed thermal pad, RoHS-compliant, moisture sensitivity level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar hex open-drain buffer applications.

Compared with SN74LVC07APWR and 74LVC07ABQ,115, the SN74LVC07ARGYR offers superior thermal performance in the same 3.5-mm footprint and guaranteed 24-mA sink down to 1.65 V, making it optimal for compact, high-reliability industrial SSD and tablet power control designs.

Availability

SN74LVC07ARGYR is available at Aetrix Electronics and suitable for SSD power sequencing, AV receiver I²C expansion, tablet reset distribution, industrial PLC input conditioning, and enterprise storage controller applications requiring stable component supply across long production lifecycles.

Supply support for SN74LVC07ARGYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions, with leadership in logic, power management, and signal chain technologies since 1930.

The SN74LVC07ARGYR belongs to TI's LVC logic family, engineered for low-voltage, high-speed, mixed-signal interface applications in space-constrained, thermally demanding environments like solid-state storage and portable multimedia devices.

FAQ

What is the maximum sink current per output of the SN74LVC07ARGYR, and at which VCC voltage is it specified?

The SN74LVC07ARGYR delivers up to 24 mA sink current per output, specified at VCC = 3.0 V with VO = 0.55 V. This rating holds across the full operating temperature range (–40°C to +125°C) and enables direct driving of multiple CMOS inputs or small LEDs without external amplification. At lower VCC (e.g., 1.65 V), the sink current is reduced to 4 mA per output.

Does the SN74LVC07ARGYR support level translation between different voltage domains, and how is this achieved?

Yes, the SN74LVC07ARGYR supports bidirectional level translation. Its inputs and open-drain outputs tolerate voltages up to 5.5 V regardless of VCC, allowing it to translate signals from a 5-V microcontroller to a 1.8-V FPGA input (with appropriate pull-up), or vice versa. The open-drain architecture requires external pull-up resistors tied to the target domain's supply, enabling flexible voltage domain bridging without direction control pins.

What is the purpose of the Ioff feature in the SN74LVC07ARGYR, and in which applications is it critical?

The Ioff feature disables all outputs and blocks current flow when VCC = 0 V, preventing back-drive damage during live insertion or partial-power-down. It is critical in modular systems like hot-swappable SSD modules or rack-mounted PLC I/O cards, where unpowered SN74LVC07ARGYR sections may be connected to powered buses. This eliminates the need for external isolation components and ensures system-level safety during maintenance or reconfiguration.

Can unused inputs on the SN74LVC07ARGYR be left floating, and what is the recommended practice?

No, unused inputs on the SN74LVC07ARGYR must never be left floating. Floating CMOS inputs cause increased ICC, noise susceptibility, and potential oscillation. TI explicitly requires all unused inputs to be tied to either VCC or GND - typically GND for unused buffers to ensure defined LOW output state. This practice is mandatory for reliable operation in industrial and automotive applications where electromagnetic robustness is essential.

How does the VQFN-14 (RGY) package of the SN74LVC07ARGYR improve thermal performance compared to other package options?

The VQFN-14 (RGY) package provides significantly better thermal conduction than SOIC or TSSOP variants, with a junction-to-board thermal resistance (RθJB) of 56.7°C/W - nearly half that of the TSSOP-14 (102.1°C/W). This is achieved via the exposed thermal pad soldered directly to PCB copper, enabling efficient heat transfer from the die to the board. In high-density SSD or tablet power designs, this allows sustained 150-mW operation with only a 40°C temperature rise above ambient.