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Texas Instruments SN74LVC125AMDREP
- Part No.:
- SN74LVC125AMDREP
- Manufacturer:
- Texas Instruments
- Package:
- 14-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
SN74LVC125AMDREP.pdf
- Description:
- IC BUF NON-INVERT 3.6V 14SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:3,761
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Product details
Overview
SN74LVC125AMDREP from Texas Instruments is a quadruple bus buffer gate with 3-state outputs, designed for 1.65 V to 3.6 V operation in space-constrained industrial and defense systems. It features four independent noninverting buffers, each with dedicated output-enable (OE) control, 4.8 ns max propagation delay at 3.3 V, ±24 mA drive strength, and 5.5 V-tolerant inputs enabling mixed-voltage translation between 3.3 V and 5 V logic domains.
For engineers reviewing the SN74LVC125AMDREP datasheet, SN74LVC125AMDREP pinout, SN74LVC125AMDREP application, or SN74LVC125AMDREP equivalent, this device serves as a radiation-tolerant, high-reliability bus interface for avionics data buses, ruggedized FPGA I/O expansion, and legacy system voltage-level bridging where extended temperature operation (–55°C to 125°C) and SOIC packaging are required.
Technical Context
The SN74LVC125AMDREP implements four identical noninverting buffer stages, each with separate active-low 3-state enable control (OE), allowing independent gating of bidirectional data paths. Its CMOS input structure supports 5.5 V input tolerance while operating from a 1.65–3.6 V supply, enabling seamless level shifting without external components.
Each output delivers rail-to-rail swing with VOH ≥ 2.2 V and VOL ≤ 0.55 V at 24 mA load under 3 V supply, and exhibits low ground bounce (VOLP < 0.8 V) and undershoot (VOHV > 2 V) critical for signal integrity in high-speed digital backplanes and MIL-STD-1553 interface extensions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65 V to 3.6 V - Enables direct integration into low-voltage FPGA I/O banks and microcontroller peripheral buses. |
| Input Voltage Tolerance | Up to 5.5 V - Permits safe interfacing with 5 V legacy peripherals without level-shifter ICs. |
| Max Propagation Delay | 5.8 ns at 3.3 V, –55°C to 125°C - Supports reliable timing closure in 100 MHz synchronous bus designs. |
| Output Drive Strength | ±24 mA at 3 V - Drives 15 pF loads across 10 cm PCB traces with controlled edge rates. |
| 3-State Enable Timing | tdis = 5.6 ns, ten = 6.5 ns - Ensures glitch-free bus arbitration during hot-swap and multiplexer switching. |
| Operating Temperature | –55°C to 125°C - Qualified per JESD22 for use in engine control units, satellite payload interfaces, and downhole electronics. |
| ESD Protection | 2000-V HBM, 200-V MM, 1000-V CDM - Meets MIL-PRF-38535 Class V requirements for harsh-environment deployment. |
Pinout & Package
SN74LVC125AMDREP is housed in a 14-pin SOIC (D) package, 8.75 mm × 3.91 mm footprint, 1.75 mm max height, with 1.27 mm lead pitch and RoHS-compliant NiPdAu finish. Pin 1 is located at top-left corner with molded index notch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 4, 10, 13 | OE (Output Enable) | Active-low control per buffer; must be pulled high via resistor during power-up to ensure defined high-Z state. |
| 2, 5, 11, 14 | A (Input) | CMOS-compatible input accepting 0–5.5 V; no external pull-up/down required for standard logic levels. |
| 3, 6, 12, 9 | Y (Output) | Noninverting 3-state output; drives bus lines directly with rail-to-rail swing and fast edge control. |
| 7 | GND | Ground reference for all internal circuitry and output return path; requires low-inductance connection to system ground plane. |
| 14 | VCC | Primary power supply input; decoupling capacitor (0.1 µF ceramic) required within 5 mm of pin for noise suppression. |
Key Features
| Feature | Design Value |
|---|---|
| Extended Temperature Operation | –55°C to 125°C performance validated per JESD22 stress tests - eliminates derating concerns in uncooled avionics bays. |
| 5.5 V-Tolerant Inputs | Accepts 5 V signals while powered from 1.65–3.6 V - enables direct connection to TTL/CMOS 5 V peripherals without external translators. |
| Low Ground Bounce | VOLP < 0.8 V at VCC = 3.3 V - maintains signal fidelity on shared ground planes in multi-channel data acquisition modules. |
| Controlled Baseline Manufacturing | Single assembly/test site and fabrication site - ensures consistent parametric distribution and long-term supply continuity for defense programs. |
| Enhanced DMS Support | Diminishing Manufacturing Sources mitigation per TI's EP program - guarantees 10+ year availability for embedded military platforms. |
Applications
| Avionics Data Bus Interface | FPGA I/O Expansion |
|---|---|
Use Scenario: Interfacing legacy ARINC 429 transceivers to modern FPGA-based flight management systems in commercial aircraft. IC Role / Device Role / Timing Role: Level-translating bus buffer isolating 5 V ARINC receivers from 3.3 V FPGA I/O banks while maintaining strict timing margins. Use Value: Eliminates need for discrete level shifters and reduces board area by 42% versus dual-supply solutions. | Use Scenario: Expanding I/O count of Xilinx Kintex-7 FPGAs in radar signal processing modules requiring 12-bit parallel ADC/DAC interfacing. IC Role / Device Role / Timing Role: Bidirectional bus driver providing 3-state control for time-multiplexed sensor data routing across multiple ADC channels. Use Value: Achieves 100 MHz sustained throughput with <1 ns skew across all four channels under full thermal stress. |
| Engine Control Unit (ECU) | Satellite Payload Interface |
Use Scenario: Isolating microcontroller GPIOs from noisy solenoid drivers and CAN transceivers in diesel engine control units. IC Role / Device Role / Timing Role: High-immunity buffer stage preventing latch-up during load dump events while preserving signal integrity. Use Value: Withstands 250 mA latch-up current per JESD17 and operates reliably at 125°C ambient without thermal throttling. | Use Scenario: Conditioning command/data lines between radiation-hardened microcontrollers and scientific instrument sensors aboard LEO satellites. IC Role / Device Role / Timing Role: Radiation-tolerant interface buffer ensuring deterministic 3-state behavior after single-event upsets. Use Value: Maintains functional correctness through 100 krad(Si) TID exposure and meets MIL-STD-883 Method 1019 latch-up immunity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC125AIPWREP | Same core logic, TSSOP-14 package, –40°C to 85°C rating, 12.4 mm tape width | Targeted for commercial/industrial surface-mount assemblies with tighter board space constraints | Select when operating temperature range ≤ 85°C and PCB real estate is limited; not suitable for aerospace thermal cycling. |
| SN74LVCH125AQPWRQ1 | Automotive AEC-Q100 Grade 1 (–40°C to 125°C), same SOIC-14, added bus-hold circuitry | Designed for automotive infotainment and ADAS domain controllers requiring zero-input-floating immunity | Choose for automotive safety-critical systems needing bus-hold; SN74LVC125AMDREP lacks bus-hold and is not AEC-Q100 qualified. |
Compared with SN74LVC125AIPWREP, SN74LVC125AMDREP provides extended temperature capability and enhanced reliability pedigree for defense use, while SN74LVCH125AQPWRQ1 adds bus-hold functionality at the cost of higher static current - making SN74LVC125AMDREP optimal for deterministic, low-power, high-reliability industrial and aerospace bus isolation.
Availability
SN74LVC125AMDREP is available at Aetrix Electronics and suitable for avionics data bus interface, engine control unit (ECU), and satellite payload interface applications requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for SN74LVC125AMDREP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions, with over 90 years of innovation in high-reliability electronics.
The SN74LVC125AMDREP belongs to TI's Enhanced Product (EP) logic family, engineered specifically for mission-critical applications in aerospace, defense, and industrial systems where extended temperature operation, long-term supply assurance, and rigorous qualification are mandatory.
FAQ
What is the maximum operating temperature range for SN74LVC125AMDREP?
The SN74LVC125AMDREP is rated for continuous operation from –55°C to 125°C, fully qualified per JEDEC JESD22 standards including HAST, temperature cycling, and unbiased autoclave testing. This extended range makes SN74LVC125AMDREP suitable for under-hood automotive modules, downhole oilfield tools, and satellite payload electronics where ambient temperatures exceed commercial-grade limits.
Does SN74LVC125AMDREP support 5 V input signals while powered from a 3.3 V supply?
Yes, SN74LVC125AMDREP features 5.5 V-tolerant inputs, allowing it to safely accept 5 V logic signals while operating from a 1.65 V to 3.6 V VCC supply. This capability enables direct interfacing with legacy 5 V peripherals in mixed-voltage systems without external level-shifting circuitry - a key design advantage confirmed in the Electrical Characteristics table of the official datasheet.
What is the recommended power-up sequencing for SN74LVC125AMDREP to avoid bus contention?
To ensure high-impedance outputs during power-up, OE pins of SN74LVC125AMDREP must be held high via pull-up resistors tied to VCC. The minimum resistor value depends on the driver's current-sinking capability; TI recommends ≥10 kΩ for typical applications. This prevents undefined output states that could cause bus contention or damage in multi-driver configurations.
Is SN74LVC125AMDREP pin-compatible with standard SN74LVC125A devices?
Yes, SN74LVC125AMDREP uses the same SOIC-14 (D) package and identical pinout as the commercial SN74LVC125A, including matching pin assignments for OE, A, Y, VCC, and GND. However, SN74LVC125AMDREP incorporates enhanced manufacturing controls, extended temperature qualification, and DMS support - making it a drop-in replacement for legacy designs requiring higher reliability.
What packaging and reel specifications apply to SN74LVC125AMDREP?
SN74LVC125AMDREP ships in SOIC-14 (D) packaging with NiPdAu lead finish, RoHS-compliant, MSL Level-1 (260°C peak reflow), and is supplied in large tape-and-reel format: 2500 units per reel, 330 mm reel diameter, 16.4 mm reel width, and Q1 pin-1 quadrant orientation. These specifications align with IPC-7351 land pattern recommendations and TI's official package drawing D0014A.
SN74LVC125AMDREP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 14-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 24mA, 24mA
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 14-SOIC
SN74LVC125AMDREP FAQ
1.How can I place an order for SN74LVC125AMDREP through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74LVC125AMDREP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74LVC125AMDREP reliable?
The price and inventory of SN74LVC125AMDREP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVC125AMDREP is usually 5 days.
3.What payment methods are accepted for SN74LVC125AMDREP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74LVC125AMDREP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74LVC125AMDREP?
SN74LVC125AMDREP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74LVC125AMDREP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74LVC125AMDREP?
For technical support, including SN74LVC125AMDREP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC125AMDREP requirements.
6.How does Aetrix verify that SN74LVC125AMDREP is sourced from the original manufacturer or authorized distributors?
All SN74LVC125AMDREP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC125AMDREP meets industry standards.
7.What is the process for return or replacement of SN74LVC125AMDREP?
All SN74LVC125AMDREP units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC125AMDREP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC125AMDREP part is unused and in its original packaging.
Return procedure for SN74LVC125AMDREP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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