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Texas Instruments SN74LVC125ARGYR
- Part No.:
- SN74LVC125ARGYR
- Manufacturer:
- Texas Instruments
- Package:
- 14-VFQFN Exposed Pad
- Datasheet:
-
SN74LVC125ARGYR.pdf
- Description:
- IC BUF NON-INVERT 3.6V 14VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:14,206
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Product details
Overview
SN74LVC125ARGYR from Texas Instruments is a quadruple 3-state bus buffer gate designed for level translation and bus isolation in mixed-voltage systems. It operates from 1.65V to 3.6V, accepts 5.5V-tolerant inputs, delivers ≤4.8ns propagation delay at 3.3V, and supports industrial temperature range (–40°C to 125°C). It is used in telecom baseband units and optical networking modules where voltage-level interfacing and low-power 3-state control are required.
For engineers reviewing the SN74LVC125ARGYR datasheet, SN74LVC125ARGYR pinout, SN74LVC125ARGYR application, or SN74LVC125ARGYR equivalent, key selection criteria include its 5.5V input tolerance, 14-pin VQFN (RGY) package with exposed thermal pad, guaranteed 3-state output behavior per channel, and compatibility with both 3.3V and 5V logic domains in backplane or serial interface buffering.
Technical Context
The SN74LVC125ARGYR implements four independent CMOS buffer gates, each with dedicated output-enable (OE) control and noninverting A→Y signal path. Its 3-state outputs support bidirectional bus architectures by enabling high-impedance isolation when OE is high, preventing contention during power-up/down sequences.
Designed for mixed-signal environments, it features overvoltage-tolerant inputs (up to 5.5V regardless of VCC), rail-to-rail output swing, and robust ESD protection (±2000V HBM). Its low dynamic power consumption (Cpd = 15pF at 3.3V) and fast switching (tpd ≤4.8ns at 3.3V) make it suitable for high-speed digital interconnects in telecom infrastructure.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.65V to 3.6V - Enables operation across 1.8V, 2.5V, and 3.3V system rails without level shifters. |
| Input Voltage Tolerance | Up to 5.5V - Allows direct interfacing with legacy 5V logic or mixed-voltage I/O without external clamping. |
| Max Propagation Delay | 4.8ns at VCC = 3.3V - Supports >100MHz data rates in buffered address/data paths. |
| Operating Temperature | –40°C to 125°C - Qualified for extended industrial and telecom shelter applications including RRUs and PDUs. |
| Output Drive Strength | ±24mA at VCC = 3.0V - Sufficient to drive 50Ω transmission lines or multiple CMOS loads without fanout limitation. |
| Power Dissipation Capacitance | 15pF at 3.3V - Predictable dynamic power consumption for accurate system-level power budgeting. |
| ESD Rating (HBM) | ±2000V - Meets JEDEC JS-001 requirements for robust handling in automated assembly and field deployment. |
Pinout & Package
VQFN-14 (RGY) package: 3.5mm × 3.5mm body, 0.5mm pitch, exposed thermal pad on underside for enhanced thermal dissipation. Pin 1 marked via top-side dot; pin numbering follows standard counter-clockwise layout from top-left corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE, 2OE, 3OE, 4OE | Input (active-low enable) | Independent 3-state control per buffer; high = output high-Z; requires pull-up to VCC for safe power sequencing. |
| 1A–4A | Input | Noninverting data inputs; tolerant to 5.5V regardless of VCC value. |
| 1Y–4Y | Output | Buffered, noninverting outputs; rail-to-rail swing with ±24mA drive capability at 3V. |
| VCC (Pin 14) | Power supply | Single positive supply for all four buffers; bypass capacitor (0.1μF) required adjacent to pin. |
| GND (Pin 7) | Ground reference | Common return path; connects to PCB ground plane; ties to exposed thermal pad for thermal conduction. |
Key Features
| Feature | Design Value |
|---|---|
| Independent 3-state control per channel | Enables selective bus isolation without affecting other channels - critical for multi-drop data buses in telecom baseband units. |
| 5.5V-tolerant inputs | Eliminates need for external level translators when interfacing with 5V microcontrollers or legacy peripherals in hybrid systems. |
| Low propagation delay (≤4.8ns @ 3.3V) | Preserves timing margins in high-speed parallel interfaces such as memory-mapped I/O or FPGA-to-ASIC bridging. |
| Wide temperature range (–40°C to 125°C) | Validated for deployment in outdoor telecom shelters, remote radio units, and power distribution units with no derating. |
| Exposed thermal pad (VQFN) | Reduces junction-to-board thermal resistance (RθJB = 29.5°C/W), improving reliability under sustained load in compact enclosures. |
Applications
| Telecom Baseband Units | Optical Networking Modules |
|---|---|
|
Use Scenario: Signal routing between FPGA-based baseband processors and analog front-end ICs in LTE/5G radio equipment. IC Role / Device Role / Timing Role: Level-translating buffer isolating 3.3V FPGA I/O from 1.8V/2.5V RF transceivers while maintaining timing integrity. Use Value: Prevents bus contention during partial reconfiguration and enables hot-swap-safe signal gating without external logic. |
Use Scenario: Interfacing EPON line cards with management microcontrollers operating at different supply voltages. IC Role / Device Role / Timing Role: Bidirectional bus buffer managing shared control/status lines between 3.3V PHY and 5V MCU subsystems. Use Value: 5.5V input tolerance eliminates discrete clamping diodes; 4.8ns tpd ensures sub-cycle latency in real-time link monitoring. |
| Remote Radio Units (RRU) | Power Distribution Units (PDU) |
|
Use Scenario: Isolating digital control signals between BBUs and distributed RRUs in microwave backhaul systems. IC Role / Device Role / Timing Role: 3-state buffer enabling time-division multiplexing of shared configuration buses across multiple RRUs. Use Value: Independent OE pins allow per-channel enable/disable for dynamic resource allocation; –40°C to 125°C rating matches outdoor RRU thermal envelope. |
Use Scenario: Buffering sensor data and relay control signals in telecom shelter PDUs with mixed-voltage monitoring circuitry. IC Role / Device Role / Timing Role: Voltage-tolerant interface between 5V temperature sensors and 3.3V microcontroller ADC inputs. Use Value: Eliminates level-shifter ICs, reducing BOM count and board area; latch-up immunity (>250mA) ensures resilience against transient faults. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC125ADBR | SSOP-14 package (6.2mm × 7.8mm); higher RθJA (140.4°C/W); no exposed thermal pad. | Better suited for through-hole prototyping or legacy PCBs with SSOP footprints; less effective thermal performance in high-density telecom modules. | Select when board layout constraints favor SSOP or when existing tooling supports tape-and-reel SSOP handling. |
| SN74LVC125APWR | TSSOP-14 package (5.0mm × 6.4mm); RθJA = 150.8°C/W; same electrical specs but lower thermal efficiency than RGY. | Preferred for cost-sensitive industrial controls where ambient temperature stays below 85°C and space is tighter than SSOP but looser than VQFN. | Choose for mid-volume production where TSSOP placement infrastructure exists and thermal margin is sufficient. |
Compared with SN74LVC125ADBR and SN74LVC125APWR, the SN74LVC125ARGYR offers superior thermal performance (RθJA = 92.1°C/W) and smallest footprint (3.5mm × 3.5mm), making it optimal for space-constrained, thermally demanding telecom infrastructure like RRUs and optical line terminals.
Availability
SN74LVC125ARGYR is available at Aetrix Electronics and suitable for telecom baseband units, optical networking modules, and remote radio units requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for SN74LVC125ARGYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing solutions, with leadership in interface, logic, and power management ICs.
The SN74LVC125ARGYR belongs to TI's LVC logic family, engineered for low-voltage, high-speed, mixed-voltage interoperability in communications infrastructure, industrial automation, and enterprise networking equipment.
FAQ
What is the maximum input voltage the SN74LVC125ARGYR can tolerate?
The SN74LVC125ARGYR accepts input voltages up to 5.5V regardless of VCC level - a key feature enabling direct interfacing with 5V logic in mixed-voltage systems without external level shifters or clamping circuits. This specification is guaranteed across the full operating temperature range (–40°C to 125°C) and is validated per TI's absolute maximum ratings table.
Does the SN74LVC125ARGYR require external pull-up resistors on its OE pins?
Yes - to ensure reliable high-impedance state during power-up or power-down, each OE pin of the SN74LVC125ARGYR should be tied to VCC via an external pull-up resistor. The minimum resistance value depends on the current-sourcing capability of the driving source; TI recommends evaluating based on the driver's IOH spec and desired rise time, typically in the 10kΩ–100kΩ range for most applications.
What is the thermal resistance (RθJA) of the SN74LVC125ARGYR in its VQFN package?
The SN74LVC125ARGYR in the RGY (VQFN-14) package has a junction-to-ambient thermal resistance (RθJA) of 92.1°C/W, measured under standard JEDEC JESD51-7 conditions. This value reflects the benefit of its exposed thermal pad, which significantly improves heat transfer compared to SOIC or TSSOP variants - critical for sustained operation in enclosed telecom shelters.
Can the SN74LVC125ARGYR be used as a level translator between 3.3V and 5V logic domains?
Yes - the SN74LVC125ARGYR functions as a unidirectional level translator: its 5.5V-tolerant inputs accept 5V signals while operating from a 3.3V (or lower) VCC, and its outputs swing rail-to-rail within the VCC domain. It does not translate in the reverse direction (i.e., 3.3V input → 5V output), as it lacks a separate VREF or dual-supply architecture.
What is the recommended bypass capacitor for the VCC pin of the SN74LVC125ARGYR?
Texas Instruments recommends a 0.1μF ceramic bypass capacitor placed as close as possible to the VCC pin (Pin 14) of the SN74LVC125ARGYR, with short, low-inductance traces to the GND pin (Pin 7) and the exposed thermal pad. For systems with high-frequency noise or multiple supply domains, paralleling with a 1μF capacitor further improves broadband decoupling effectiveness.
SN74LVC125ARGYR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 14-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 24mA, 24mA
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 14-VQFN (3.5x3.5)
SN74LVC125ARGYR FAQ
1.How can I place an order for SN74LVC125ARGYR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74LVC125ARGYR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74LVC125ARGYR reliable?
The price and inventory of SN74LVC125ARGYR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVC125ARGYR is usually 5 days.
3.What payment methods are accepted for SN74LVC125ARGYR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74LVC125ARGYR transactions.
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4.How is shipping managed for SN74LVC125ARGYR?
SN74LVC125ARGYR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74LVC125ARGYR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74LVC125ARGYR?
For technical support, including SN74LVC125ARGYR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC125ARGYR requirements.
6.How does Aetrix verify that SN74LVC125ARGYR is sourced from the original manufacturer or authorized distributors?
All SN74LVC125ARGYR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC125ARGYR meets industry standards.
7.What is the process for return or replacement of SN74LVC125ARGYR?
All SN74LVC125ARGYR units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC125ARGYR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC125ARGYR part is unused and in its original packaging.
Return procedure for SN74LVC125ARGYR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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