Texas Instruments SN74LVC125ARGYRG4
- Part No.:
- SN74LVC125ARGYRG4
- Manufacturer:
- Texas Instruments
- Package:
- 14-VFQFN Exposed Pad
- Datasheet:
-
SN74LVC125ARGYRG4.pdf
- Description:
- IC BUF NON-INVERT 3.6V 14VQFN
- Quantity:
- Payment:

- Shipping:

Inventory:4,246
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Product details
Overview
SN74LVC125ARGYRG4 from Texas Instruments is a quadruple 3-state bus buffer gate designed for level translation and bus isolation in mixed-voltage systems. It operates from 1.65V to 3.6V, supports 5.5V-tolerant inputs, delivers ≤4.8ns propagation delay at 3.3V, and is rated for –40°C to 125°C operation - enabling use in telecom baseband units and optical networking line cards.
For engineers reviewing the SN74LVC125ARGYRG4 datasheet, SN74LVC125ARGYRG4 pinout, SN74LVC125ARGYRG4 application, or SN74LVC125ARGYRG4 equivalent, key selection criteria include its independent OE control per channel, VQFN-14 (RGY) package thermal performance (RθJA = 92.1°C/W), 3.3V/5V interface compatibility, and latch-up immunity exceeding 250mA per JESD17.
Technical Context
The SN74LVC125ARGYRG4 implements four independent noninverting buffers, each with dedicated output-enable (OE) input controlling high-impedance state. Its CMOS design enables bidirectional voltage translation: 5V inputs safely drive 3.3V logic outputs without external level shifters.
Each channel functions as a transparent data path when OE is low (active-low enable), and presents high-Z output when OE is high. Input overvoltage tolerance up to 5.5V and guaranteed operation down to 1.65V VCC allow robust interoperability across legacy and modern supply domains in telecom infrastructure.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65V–3.6V - supports dual-supply system integration and low-power operation in battery-backed telecom modules |
| Input Voltage Tolerance | Up to 5.5V - enables direct connection to 5V legacy peripherals without external clamping or translation circuitry |
| Max Propagation Delay | 4.8ns at 3.3V - ensures timing compliance in high-speed serial bus interfaces like PCIe Gen1 sideband control paths |
| Output Drive Strength | ±24mA at 3V - sufficient to drive 50Ω transmission lines or multiple LVC loads without signal degradation |
| Operating Temperature | –40°C to +125°C - qualified for deployment in outdoor telecom shelters and remote radio units (RRUs) |
| Latch-up Immunity | >250mA per JESD17 - provides robustness against transient current surges in noisy power distribution environments |
| ESD Rating (HBM) | ±2000V - meets industrial handling requirements and reduces risk of field failure during board assembly |
Pinout & Package
VQFN-14 (RGY) package: 3.5mm × 3.5mm body, 0.5mm pitch, exposed thermal pad - optimized for thermal dissipation in space-constrained telecom modules and high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE, 2OE, 3OE, 4OE | Active-low output enable input | Independent per-channel control; tie high via pullup to ensure safe high-Z state during power-up/power-down |
| 1A–4A | Buffer input | Noninverting data input; accepts 0–5.5V regardless of VCC, enabling mixed-voltage domain bridging |
| 1Y–4Y | Buffer output | 3-state output with rail-to-rail swing; drives downstream logic or termination networks only when corresponding OE is low |
| VCC | Positive supply | Single 1.65–3.6V supply powers all four channels; bypass capacitor required adjacent to pin |
| GND | Ground reference | Common return for logic and power; must be connected to low-impedance ground plane for noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| Independent 3-state control per channel | Enables selective bus segmentation - e.g., isolate one transceiver lane while keeping others active in multi-port optical modules |
| 5.5V-tolerant inputs | Eliminates need for external level translators when interfacing 5V microcontrollers or legacy FPGAs to 3.3V signal chains |
| Low propagation delay (≤4.8ns @ 3.3V) | Supports >100MHz clock/data rates in timing-critical applications such as baseband I/Q sampling control buses |
| High noise immunity (VIH/VIL thresholds defined across VCC range) | Ensures reliable switching in electrically noisy telecom environments where supply ripple or crosstalk may exceed ±100mV |
| Thermal-enhanced VQFN package (RθJA = 92.1°C/W) | Permits sustained operation at full drive strength in enclosed enclosures without forced air cooling |
Applications
| Optical Networking Line Card | Telecom Baseband Unit |
|---|---|
Use Scenario: Isolating and buffering control signals between FPGA configuration logic and SFP+ module management interfaces. IC Role / Device Role / Timing Role: Bus buffer providing 3-state isolation and voltage translation between 2.5V FPGA I/O and 3.3V SFP+ EEPROM/PHY registers. Use Value: Prevents bus contention during hot-plug events and maintains signal integrity across mixed-voltage domains without added components. |
Use Scenario: Driving parallel control lines for multiple ADC/DAC channels in wireless baseband processing boards. IC Role / Device Role / Timing Role: Quadruple buffer distributing synchronized enable and reset signals to four analog front-end ICs. Use Value: Guarantees matched propagation delay across all four channels, minimizing skew-induced sampling jitter in multi-channel RF receivers. |
| Remote Radio Unit (RRU) | Power Distribution Unit (PDU) |
Use Scenario: Level-shifting and buffering GPIO commands from 3.3V SoC to 5V power sequencing controllers in RRU power subsystems. IC Role / Device Role / Timing Role: Voltage translator and bus driver enabling reliable communication between low-voltage control logic and higher-voltage PMICs. Use Value: Eliminates discrete resistor-divider networks, reducing BOM count and improving long-term reliability under thermal cycling. |
Use Scenario: Controlling LED status indicators and relay drivers in telecom shelter PDUs operating across wide ambient temperature ranges. IC Role / Device Role / Timing Role: Robust buffer isolating microcontroller GPIOs from inductive relay coils and high-current LED strings. Use Value: Withstands repeated ESD events and latch-up conditions common in field-deployed power cabinets, extending service life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC125ADG4 | SOIC-14 package (8.6mm × 6mm); RθJA = 127.8°C/W; no exposed thermal pad | Better suited for prototyping and manual soldering; lower thermal performance limits continuous 24mA drive at elevated ambient temperatures | Select when board-level reworkability or legacy footprint compatibility is prioritized over thermal density. |
| SN74LVC125APWRG4 | TSSOP-14 package (5.0mm × 6.4mm); RθJA = 150.8°C/W; thinner profile than RGY | Higher thermal resistance requires derating at >85°C ambient; preferred for height-constrained but thermally managed assemblies | Choose for compact consumer-grade telecom equipment where board space is tighter than thermal budget. |
Compared with SN74LVC125ADG4 and SN74LVC125APWRG4, the SN74LVC125ARGYRG4 offers superior thermal performance (92.1°C/W) and smallest footprint (3.5mm²), making it optimal for high-density, high-reliability telecom modules requiring sustained 3.3V operation at 125°C ambient.
Availability
SN74LVC125ARGYRG4 is available at Aetrix Electronics and suitable for telecom baseband units, optical networking line cards, and remote radio units requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for SN74LVC125ARGYRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies for industrial, automotive, and communications markets.
The SN74LVC125ARGYRG4 belongs to TI's LVC logic family, engineered for low-voltage, high-speed, mixed-signal interface applications in telecom infrastructure, where voltage translation, bus isolation, and thermal resilience are critical.
FAQ
What is the maximum input voltage rating for SN74LVC125ARGYRG4?
The SN74LVC125ARGYRG4 supports input voltages up to 5.5V across its entire operating VCC range (1.65V–3.6V). This overvoltage tolerance allows direct interfacing with 5V logic sources without external protection or level-shifting circuitry - a key enabler for legacy system upgrades in telecom base stations where SN74LVC125ARGYRG4 serves as a drop-in interface bridge.
Does SN74LVC125ARGYRG4 require external pull-up resistors on OE pins?
Yes - to guarantee high-impedance output during power-up and power-down sequences, each OE pin of SN74LVC125ARGYRG4 must be tied to VCC via an external pull-up resistor. The minimum value depends on the current-sourcing capability of the driving source; typical values range from 4.7kΩ to 10kΩ. This requirement ensures safe bus isolation in telecom shelter PDUs where SN74LVC125ARGYRG4 controls relay drivers.
What is the thermal resistance (RθJA) of SN74LVC125ARGYRG4?
The SN74LVC125ARGYRG4 in the RGY (VQFN-14) package has a junction-to-ambient thermal resistance of 92.1°C/W. This value reflects standard JEDEC test conditions (1-layer board, 1-in² copper) and confirms suitability for thermally demanding deployments such as remote radio units (RRUs), where SN74LVC125ARGYRG4 operates continuously at full drive strength without forced airflow.
Can SN74LVC125ARGYRG4 drive 50Ω transmission lines directly?
Yes - SN74LVC125ARGYRG4 delivers ±24mA output drive at 3V, sufficient to terminate and drive short 50Ω lines (e.g., control buses within optical modules). However, for longer traces or impedance-critical paths, series matching resistors are recommended to suppress ringing. This capability makes SN74LVC125ARGYRG4 effective in point-to-point microwave backhaul timing distribution where SN74LVC125ARGYRG4 buffers clock enables.
Is SN74LVC125ARGYRG4 qualified for automotive applications?
No - SN74LVC125ARGYRG4 is specified for industrial operation from –40°C to +125°C but is not AEC-Q100 qualified. It is intended for telecom infrastructure, optical networking, and industrial embedded systems. For automotive use cases requiring qualification, designers should select TI's automotive-grade alternatives; SN74LVC125ARGYRG4 remains optimal for telecom shelters and baseband units where its thermal and voltage specs align precisely with system requirements.
SN74LVC125ARGYRG4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 14-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 24mA, 24mA
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 14-VQFN (3.5x3.5)
SN74LVC125ARGYRG4 FAQ
1.How can I place an order for SN74LVC125ARGYRG4 through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74LVC125ARGYRG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74LVC125ARGYRG4 reliable?
The price and inventory of SN74LVC125ARGYRG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVC125ARGYRG4 is usually 5 days.
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Once your SN74LVC125ARGYRG4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74LVC125ARGYRG4?
For technical support, including SN74LVC125ARGYRG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC125ARGYRG4 requirements.
6.How does Aetrix verify that SN74LVC125ARGYRG4 is sourced from the original manufacturer or authorized distributors?
All SN74LVC125ARGYRG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC125ARGYRG4 meets industry standards.
7.What is the process for return or replacement of SN74LVC125ARGYRG4?
All SN74LVC125ARGYRG4 units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC125ARGYRG4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC125ARGYRG4 part is unused and in its original packaging.
Return procedure for SN74LVC125ARGYRG4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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