Texas Instruments SN74LVC139AZQNR
- Part No.:
- SN74LVC139AZQNR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 20-VFBGA
- Datasheet:
-
SN74LVC139AZQNR.pdf
- Description:
- IC DECODER/DEMUX 1X2:4 20BGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,095
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Product details
Overview
SN74LVC139AZQNR from Texas Instruments is a dual 2-line to 4-line decoder/demultiplexer in a 16-pin VFBGA (ZQN) package, operating from 1.65 V to 3.6 V, with 6.2 ns max propagation delay at 3.3 V, ±24 mA output drive, and 5.5 V-tolerant inputs. It enables address decoding in low-voltage microcontroller peripheral interfaces and mixed-voltage I/O translation.
For engineers reviewing the SN74LVC139AZQNR datasheet, SN74LVC139AZQNR pinout, SN74LVC139AZQNR application, or SN74LVC139AZQNR equivalent, key selection factors include its dual-decoder architecture with active-low enables, VFBGA footprint for space-constrained PCBs, 3.3 V/5 V input compatibility, and latch-up immunity exceeding 250 mA per JESD 17.
Technical Context
This device integrates two independent 2-to-4 line decoders sharing no internal logic-each has dedicated A/B select inputs and active-low G enable. Outputs are fully buffered CMOS with rail-to-rail swing and high noise immunity.
Input voltage tolerance up to 5.5 V allows direct interfacing with legacy 5 V logic while powered at 1.65–3.6 V; output VOH/VOL specs are guaranteed across VCC range, supporting reliable level-shifting without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65 V to 3.6 V - supports modern low-power SoC I/O domains and mixed-voltage system integration |
| Max tpd | 6.2 ns at VCC = 3.3 V - enables timing-critical address decoding in ≤160 MHz bus systems |
| Output Drive | ±24 mA at VCC = 3.0 V - sufficient to drive four standard LVC loads or one 50 Ω transmission line |
| Input Voltage Tolerance | Up to 5.5 V - eliminates need for external level shifters when interfacing with 5 V controllers or sensors |
| Latch-Up Immunity | >250 mA per JESD 17 - ensures robust operation in noisy industrial environments with transient coupling |
| Power Dissipation Cap | 30.5 pF at 3.3 V - predicts dynamic power consumption of ~1 µW/MHz for clocked applications |
Pinout & Package
VFBGA-16 (ZQN) package, 2.5 mm × 2.5 mm, 0.5 mm pitch, bottom-side ball array with exposed thermal pad (GND-connected). Pin 1 located at top-left corner per JEDEC MO-220 standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | First decoder select A input | LSB of 2-bit address for decoder 1; accepts 0–5.5 V regardless of VCC |
| B1 | First decoder select B input | MSB of 2-bit address for decoder 1; fully buffered, 1 normalized load |
| G1 | First decoder active-low enable | When low, enables Y0–Y3 outputs; when high, forces all outputs high-impedance |
| Y0–Y3 | First decoder active-low outputs | Complementary decoded outputs - only one low per valid A/B combination |
| A2, B2, G2 | Second decoder select/enable inputs | Independent control path identical to decoder 1; no shared internal nodes |
| Y4–Y7 | Second decoder active-low outputs | Outputs Y4–Y7 correspond to Y0–Y3 of decoder 2; functionally isolated |
| VCC | Supply voltage | Single 1.65–3.6 V supply powers both decoders; no separate IOVDD required |
| GND | Ground reference | Common return for all I/O and core logic; ties to thermal pad for thermal performance |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent decoders | Enables simultaneous decoding of two separate 2-bit address buses without cross-talk or timing interaction |
| 5.5 V tolerant inputs | Permits direct connection to 5 V microcontrollers or sensors while operating at 1.8 V or 3.3 V VCC |
| Low propagation delay | 6.2 ns max at 3.3 V allows use in high-speed memory-mapped peripheral selection (e.g., FPGA config space) |
| High noise immunity | VIL/VIL thresholds scale with VCC (e.g., 0.35×VCC low, 0.65×VCC high), ensuring stable operation across voltage corners |
| Small-footprint VFBGA | ZQN package saves >60% board area vs. TSSOP/PW, critical for wearables and compact IoT modules |
Applications
| Industrial PLC I/O Expansion | Automotive Body Control Module |
|---|---|
Use Scenario: Expanding GPIO count on an ARM Cortex-M7 MCU by decoding 2-bit address lines to select among eight discrete sensor inputs. IC Role / Device Role / Timing Role: Address decoder mapping parallel bus signals to individual analog sensor channels via multiplexed ADC interface. Use Value: Eliminates need for larger programmable logic; 6.2 ns delay ensures synchronization with 100 MHz APB clock domain. |
Use Scenario: Selecting between four lighting driver ICs (LED matrix rows) and four HVAC actuator drivers in a centralized body controller. IC Role / Device Role / Timing Role: Dual-decoder provides independent enable control for two functional subsystems using shared MCU address lines. Use Value: Reduces MCU pin count by 4 vs. discrete enables; 5.5 V input tolerance accommodates legacy 5 V CAN transceiver I/O levels. |
| Medical Wearable Sensor Hub | Network Edge Gateway |
Use Scenario: Routing SPI chip-select signals from a low-power RISC-V SoC to four different biosensor ICs (ECG, SpO₂, temperature, motion). IC Role / Device Role / Timing Role: Demultiplexer converting 2-bit CS bus into four dedicated active-low chip-select lines. Use Value: ZQN package fits within 3.2 mm × 3.2 mm module footprint; 1.65 V operation extends battery life in coin-cell-powered devices. |
Use Scenario: Decoding Ethernet PHY register addresses in a multi-port switch ASIC design where each port requires unique configuration access. IC Role / Device Role / Timing Role: Dual decoder splits master address bus to isolate PHY register banks across four physical ports. Use Value: Latch-up immunity >250 mA prevents field failures during ESD events near RJ45 connectors in unshielded enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 2-to-4 decoder applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC139APWR | TSSOP-16 package, 0.65 mm pitch, 5.0 mm × 4.4 mm footprint - larger than ZQN but hand-solderable | Suitable for prototyping and medium-volume industrial boards where reflow capability is limited | Choose when board assembly lacks fine-pitch BGA reflow capability or requires visual inspection access |
| SN74LV139ADR | SOIC-16 package, LV family - wider VCC range (2.0–5.5 V), slower tpd (11 ns @ 5 V), no 5.5 V input tolerance | Compatible with legacy 5 V-only systems but incompatible with 1.65–1.95 V ultra-low-power designs | Choose only if operating exclusively at ≥2.0 V and requiring pin compatibility with older LV-based designs |
Compared with SN74LVC139APWR and SN74LV139ADR, SN74LVC139AZQNR delivers the smallest footprint and lowest VCC support, making it optimal for miniaturized, battery-sensitive applications - whereas PWR offers manufacturability trade-offs and DR suits legacy 5 V infrastructure.
Availability
SN74LVC139AZQNR is available at Aetrix Electronics and suitable for industrial PLC I/O expansion, automotive body control modules, medical wearable sensor hubs, and network edge gateways requiring stable component supply across extended temperature ranges.
Supply support for SN74LVC139AZQNR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 50 years of innovation in logic and interface solutions.
The SN74LVC139A product line delivers high-speed, low-voltage CMOS decoding for space- and power-constrained digital systems - designed specifically for mixed-voltage interoperability and industrial reliability.
FAQ
What is the maximum operating frequency supported by SN74LVC139AZQNR?
SN74LVC139AZQNR does not specify a maximum clock frequency because it is a combinational logic device without internal clocking. Its usable switching rate is determined by propagation delay (6.2 ns max at 3.3 V) and system-level timing margins. In practice, SN74LVC139AZQNR reliably supports address decoding in bus systems operating up to 160 MHz, assuming proper PCB layout and load capacitance ≤30 pF.
Can SN74LVC139AZQNR be used as a level shifter between 5 V and 3.3 V logic domains?
Yes, SN74LVC139AZQNR can serve as a unidirectional level shifter: its inputs tolerate up to 5.5 V independent of VCC, and outputs swing rail-to-rail between GND and VCC. When powered at 3.3 V, it accepts 5 V control signals and produces 3.3 V-compatible outputs - ideal for interfacing legacy 5 V peripherals with modern low-voltage MCUs. SN74LVC139AZQNR does not support bidirectional translation.
Is the thermal pad on the ZQN package of SN74LVC139AZQNR electrically connected?
Yes, the exposed thermal pad on the SN74LVC139AZQNR ZQN package is internally connected to GND. TI's datasheet and package drawings confirm this connection, and PCB layout guidelines require soldering the pad directly to a GND plane for optimal thermal performance and electrical stability. Omitting this connection may degrade latch-up immunity and increase junction temperature under sustained load.
Does SN74LVC139AZQNR support partial power-down or I/O isolation when VCC is off?
No, SN74LVC139AZQNR does not feature I/O protection during VCC-off conditions. Its inputs are 5.5 V tolerant only when VCC is within specification (1.65–3.6 V); applying voltage to any pin with VCC = 0 V risks damage due to forward-biasing internal ESD diodes. For hot-plug or partial-power-down systems, external isolation circuitry or a device with Ioff support (e.g., SN74LVC1G139) is required. SN74LVC139AZQNR must be powered before enabling inputs.
How are unused inputs handled on SN74LVC139AZQNR to ensure stable operation?
All unused inputs on SN74LVC139AZQNR must be tied to a defined logic level - either VCC or GND - to prevent floating states that cause increased ICC, noise susceptibility, or erratic output behavior. TI explicitly recommends this in the datasheet (SCBA004 application report). Leaving inputs unconnected violates recommended operating conditions and may result in unpredictable decoder activation. SN74LVC139AZQNR has no internal pull-ups or pull-downs on select or enable pins.
SN74LVC139AZQNR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 20-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Decoder/Demultiplexer
- Circuit:
- 1 x 2:4
- Independent Circuits:
- 2
- Current - Output High, Low:
- 24mA, 24mA
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-BGA MICROSTAR JUNIOR (4x3)
SN74LVC139AZQNR FAQ
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6.How does Aetrix verify that SN74LVC139AZQNR is sourced from the original manufacturer or authorized distributors?
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7.What is the process for return or replacement of SN74LVC139AZQNR?
All SN74LVC139AZQNR units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC139AZQNR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC139AZQNR part is unused and in its original packaging.
Return procedure for SN74LVC139AZQNR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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