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Texas Instruments SN74LVC157ABQBR
- Part No.:
- SN74LVC157ABQBR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 16-WFQFN Exposed Pad
- Datasheet:
-
SN74LVC157ABQBR.pdf
- Description:
- QUADRUPLE 2-LINE TO1-LINE DATA S
- Quantity:
- Payment:
- Shipping:
Inventory:4,873
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Product details
Overview
SN74LVC157ABQBR from Texas Instruments is a quadruple 2-line to 1-line data selector/multiplexer in a 16-pin WQFN (BQB) package, operating from 1.65V to 3.6V supply, with 5.2ns max propagation delay at 3.3V, 5.5V-tolerant inputs, and –40°C to 125°C temperature range. It routes four independent 2:1 data paths under common address (A/B) and strobe (G) control, used in bus multiplexing and signal routing in mixed-voltage digital systems.
For engineers reviewing the SN74LVC157ABQBR datasheet, SN74LVC157ABQBR pinout, SN74LVC157ABQBR application, or SN74LVC157ABQBR equivalent, key selection criteria include its 16-pin WQFN thermal pad layout, 5.5V input tolerance enabling 3.3V/5V level translation, low ground bounce (<0.8V), and guaranteed operation across industrial and extended-temperature environments.
Technical Context
The SN74LVC157ABQBR implements true (non-inverting) data selection logic with a shared active-low output enable (G) and a common address select (A/B) controlling all four 2:1 channels simultaneously. Its CMOS design supports rail-to-rail input voltage swing up to 5.5V while maintaining compatibility with 1.65V–3.6V VCC, enabling seamless interfacing between legacy 5V and modern low-voltage logic domains.
Each channel features independent A and B data inputs and a dedicated Y output, with propagation delay tightly specified across voltage (1.8V–3.3V) and temperature (–40°C to 125°C). The device exhibits robust ESD immunity (±2000V HBM, ±1000V CDM) and latch-up resistance exceeding 250mA per JESD17, suitable for noise-prone industrial PCBs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 1.65V to 3.6V - enables direct integration into 1.8V, 2.5V, and 3.3V logic domains without level shifters |
| Max Propagation Delay | 5.2ns at 3.3V - supports high-speed data routing up to ~190 MHz clock-equivalent operation |
| Input Voltage Tolerance | Up to 5.5V - allows safe connection to 5V sources in mixed-supply systems |
| Operating Temperature | –40°C to 125°C - qualified for automotive under-hood and industrial control applications |
| Output Drive Strength | ±24mA at 3V - sufficient to drive standard CMOS loads and short PCB traces without buffering |
| Power Dissipation Cap | 500mW - limits thermal rise in compact WQFN packages during sustained switching |
| ESD Rating (HBM) | ±2000V - meets IEC 61000-4-2 Level 2 for system-level ESD robustness |
Pinout & Package
SN74LVC157ABQBR uses a 16-pin WQFN package (BQB) with 3.5mm × 2.5mm body size and exposed thermal pad (connected to GND or left floating per TI recommendation).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G | Active-low output enable | Drives all Y outputs low when high; required for functional enable/disable of entire device |
| A/B | Channel select address | Single control line selecting source A (A/B = low) or B (A/B = high) for all four channels |
| 1A–4A, 1B–4B | Data inputs | Eight independent inputs grouped as four pairs; each pair feeds one 2:1 mux stage |
| 1Y–4Y | True data outputs | Four buffered, non-inverted outputs - no polarity inversion; fan-out limited by drive strength |
| VCC | Positive supply | Single 1.65–3.6V rail powers all logic and I/O; requires local 0.1µF bypass capacitor |
| GND | Ground reference | Return path for all signals and power; thermal pad may be tied to GND for improved thermal performance |
Key Features
| Feature | Design Value |
|---|---|
| 5.5V-tolerant inputs | Enables direct interface with 5V microcontrollers or legacy peripherals without external level translators |
| Low ground bounce (VOLP < 0.8V) | Minimizes noise coupling into shared ground planes during simultaneous output switching |
| High noise immunity (VIH/VIL thresholds) | Guaranteed switching at 0.65×VCC (low VCC) and fixed 2.0V/0.8V (high VCC) ensures reliable operation across voltage corners |
| Thermal pad support | Exposed pad in BQB package improves heat dissipation and mechanical stability on dense PCBs |
| Wide temperature qualification | –40°C to 125°C rating supports deployment in engine control units, motor drives, and outdoor infrastructure |
Applications
| Industrial PLC I/O Multiplexing | Automotive Body Control Module |
|---|---|
Use Scenario: Consolidating multiple sensor inputs (e.g., door switches, seat occupancy sensors) onto a single MCU ADC or GPIO port using time-shared sampling. IC Role / Device Role / Timing Role: Quad 2:1 selector routes four independent sensor signals to a shared processing path under MCU-controlled A/B and G timing. Use Value: Reduces MCU pin count and simplifies PCB routing while maintaining deterministic 5.2ns signal path latency. | Use Scenario: Managing dual-source lighting control signals (e.g., manual switch vs. CAN-based command) for headlamp dimming logic. IC Role / Device Role / Timing Role: Acts as a hardware-selectable signal router, with A/B choosing between driver IC inputs and G enabling/disabling output during fault conditions. Use Value: Provides fail-safe signal isolation and deterministic switchover without software intervention or MCU latency. |
| Test Equipment Signal Routing | Low-Power IoT Sensor Hub |
Use Scenario: Switching between calibration references and live sensor outputs in portable multimeters or data loggers. IC Role / Device Role / Timing Role: Selects between precision voltage references and variable sensor outputs under microcontroller command for ADC input conditioning. Use Value: Enables on-device self-calibration with sub-5ns timing skew between reference and measurement paths. | Use Scenario: Aggregating outputs from multiple environmental sensors (temp, humidity, motion) onto a single low-power MCU interface with minimal active components. IC Role / Device Role / Timing Role: Multiplexes discrete sensor outputs to reduce wake-up interrupt lines and simplify firmware polling sequence. Use Value: Low 1µA typical ICC at 3.6V extends battery life; 1.65V minimum VCC supports direct coin-cell operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar quad 2:1 multiplexer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC157AD | SOIC-16 package; higher RθJA (118.1°C/W); no thermal pad | Larger footprint; less suitable for thermally constrained or high-density layouts | Preferred where through-hole assembly or legacy SOIC compatibility is required |
| SN74LVC157APWR | TSSOP-16 package; RθJA = 141.8°C/W; same 3.5×2.5mm body but different leadframe | Higher thermal resistance; requires more careful thermal layout than WQFN | Chosen when board space allows larger package and reflow profile accommodates Level-1 MSL |
Compared with SN74LVC157AD and SN74LVC157APWR, the SN74LVC157ABQBR offers superior thermal performance (98.8°C/W), smallest PCB area (3.5mm × 2.5mm), and integrated thermal pad - making it optimal for space-constrained, high-reliability embedded systems requiring extended temperature operation.
Availability
SN74LVC157ABQBR is available at Aetrix Electronics and suitable for industrial automation, automotive electronics, and test equipment requiring stable component supply, extended temperature reliability, and compact WQFN packaging.
Supply support for SN74LVC157ABQBR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 90 years of innovation in industrial, automotive, and consumer electronics.
The SN74LVC157ABQBR belongs to TI's LVC logic family, designed specifically for low-voltage, high-speed, mixed-signal interfacing in space- and power-constrained applications where 5V-tolerance and wide temperature operation are critical.
FAQ
What is the maximum input voltage the SN74LVC157ABQBR can tolerate?
The SN74LVC157ABQBR accepts input voltages up to 5.5V regardless of VCC level, allowing safe interfacing with 5V logic families while powered from 1.65V–3.6V supplies. This feature eliminates the need for external level-shifting circuitry in mixed-voltage systems and is explicitly validated in TI's electrical characteristics tables under VI ratings.
Does the SN74LVC157ABQBR require external pull-up or pull-down resistors on unused inputs?
Yes - all unused inputs of the SN74LVC157ABQBR must be held at a defined logic level (VCC or GND) to prevent floating states that cause increased ICC, noise susceptibility, or erratic output behavior. TI's datasheet Section 4.4 and Application Report SCBA004 mandate this practice; leaving inputs unconnected violates recommended operating conditions and risks functional failure.
Can the thermal pad on the SN74LVC157ABQBR package be left unconnected?
Yes - the thermal pad on the SN74LVC157ABQBR (BQB package) may be left floating or connected to GND, per TI's Pin Functions table footnote. TI does not require soldering the pad to GND, though doing so improves thermal performance and mechanical reliability. No other connections (e.g., to VCC or signal nets) are permitted.
What is the worst-case propagation delay for SN74LVC157ABQBR at 1.8V supply?
At 1.8V ± 0.15V and –40°C to 125°C, the worst-case propagation delay (tpd) for SN74LVC157ABQBR is 15.5ns (A/B → Y path), as specified in Table 4.9. This value accounts for process, voltage, and temperature extremes and defines the maximum timing budget for synchronous routing in low-voltage designs.
Is SN74LVC157ABQBR pin-compatible with other LVC157A variants like SN74LVC157AD?
No - SN74LVC157ABQBR (WQFN-16) is not pin-compatible with SN74LVC157AD (SOIC-16) due to differing pinouts and package footprints. While both share identical logic functionality and signal names, their physical pin arrangements differ significantly (e.g., GND and VCC locations vary), requiring separate PCB layouts. Pin compatibility exists only within the same package type (e.g., BQB-to-BQB).
SN74LVC157ABQBR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 16-WFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Data Selector/Multiplexer
- Circuit:
- 4 x 2:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- 24mA, 24mA
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-WQFN (2.5x3.5)
SN74LVC157ABQBR FAQ
1.How can I place an order for SN74LVC157ABQBR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74LVC157ABQBR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74LVC157ABQBR reliable?
The price and inventory of SN74LVC157ABQBR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVC157ABQBR is usually 5 days.
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4.How is shipping managed for SN74LVC157ABQBR?
SN74LVC157ABQBR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74LVC157ABQBR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74LVC157ABQBR?
For technical support, including SN74LVC157ABQBR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC157ABQBR requirements.
6.How does Aetrix verify that SN74LVC157ABQBR is sourced from the original manufacturer or authorized distributors?
All SN74LVC157ABQBR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC157ABQBR meets industry standards.
7.What is the process for return or replacement of SN74LVC157ABQBR?
All SN74LVC157ABQBR units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC157ABQBR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC157ABQBR part is unused and in its original packaging.
Return procedure for SN74LVC157ABQBR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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