Texas Instruments SN74LVC1G07DCKJ

Overview

SN74LVC1G07DCKJ from Texas Instruments is a single non-inverting buffer/driver with open-drain output, designed for 1.65V–5.5V V_CC operation. It delivers ±24mA drive at 3.3V, supports 5.5V-tolerant inputs/outputs, achieves 4.2ns max propagation delay at 3.3V, and enables wired-OR logic in consumer audio/video interfaces.

For engineers reviewing the SN74LVC1G07DCKJ datasheet, SN74LVC1G07DCKJ pinout, SN74LVC1G07DCKJ application, or SN74LVC1G07DCKJ equivalent, key selection criteria include open-drain sink capability (32mA max), I_off support for live insertion, 0.5mm-pitch SC70-5 package compatibility, and voltage translation across 1.65V–5.5V rails.

Technical Context

The SN74LVC1G07DCKJ implements a CMOS-based non-inverting buffer with true open-drain output stage, enabling active-low wired-OR and active-high wired-AND bus configurations. Its I_off circuitry actively disables outputs during partial power-down, preventing back-drive current when V_CC = 0 V.

Input and output pins tolerate up to 5.5V regardless of V_CC level, supporting bidirectional voltage translation between disparate logic domains. The device operates across –40°C to 125°C ambient temperature and meets JESD78 Class II latch-up immunity (>100mA).

Key Specifications

Pinout & Package

SN74LVC1G07DCKJ uses the SC70-5 (DCK) package: 2.0mm × 2.1mm body size, 0.65mm height, 0.5mm lead pitch, and surface-mount construction optimized for space-constrained PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar open-drain buffer applications.

Compared with SN74LVC1G07DBVR and 74LVC1G07GW,125, the SN74LVC1G07DCKJ offers the smallest PCB footprint among functionally equivalent open-drain buffers while maintaining full 1.65V–5.5V operation, 32mA sink capability, and I_off-enabled hot-swap safety-making it optimal for ultra-compact consumer electronics and modular embedded systems.

Availability

SN74LVC1G07DCKJ is available at Aetrix Electronics and suitable for portable media players, embedded PCs, and digital radio receivers requiring stable component supply, consistent SC70-5 packaging, and guaranteed long-term production continuity.

Supply support for SN74LVC1G07DCKJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 90 years of innovation in industrial, automotive, and consumer electronics.

The SN74LVC1G07DCKJ belongs to TI's LVC logic family, engineered for low-voltage, high-speed, mixed-signal interface applications where space, power efficiency, and voltage translation are critical design constraints.

FAQ

What is the maximum sink current specification for SN74LVC1G07DCKJ?

The SN74LVC1G07DCKJ supports a maximum sink current (I_OL) of 32mA when V_CC = 4.5V, as specified in the Absolute Maximum Ratings table. At 3.3V, it delivers ±24mA output drive. This capability enables direct driving of LEDs, pull-up networks, or multiple CMOS loads without external amplification. The device maintains this performance across its full operating temperature range of –40°C to 125°C.

Does SN74LVC1G07DCKJ support voltage translation between different logic families?

Yes, SN74LVC1G07DCKJ supports bidirectional voltage translation: its inputs and open-drain output accept voltages up to 5.5V independent of V_CC, which can range from 1.65V to 5.5V. This allows interfacing a 1.8V microcontroller output to a 3.3V or 5V bus, or translating a 5V sensor signal down to a 2.5V processor input-provided an appropriate external pull-up resistor is used on the Y pin.

What is the purpose of the N.C. pin on SN74LVC1G07DCKJ?

Pin 3 of SN74LVC1G07DCKJ is marked N.C. (No internal connection). It has no electrical connection to the die and must remain unconnected in the PCB layout. TI's layout guidelines explicitly prohibit tying N.C. pins to V_CC or GND, as doing so may introduce parasitic coupling or violate package mechanical integrity. Leaving it floating is electrically safe and aligns with TI's recommended practice for this SC70-5 variant.

How does the I_off feature benefit system design with SN74LVC1G07DCKJ?

The I_off feature in SN74LVC1G07DCKJ disables output leakage paths when V_CC = 0V, limiting I_off to ±10µA. This prevents damaging back-current flow from powered subsystems into unpowered ones-critical for hot-swap modules, partial power-down states, or systems with asymmetric power sequencing. It eliminates the need for external isolation components and simplifies compliance with JEDEC JESD78 latch-up immunity requirements.

What are the thermal characteristics of SN74LVC1G07DCKJ in its SC70-5 package?

SN74LVC1G07DCKJ in the SC70-5 (DCK) package has a junction-to-ambient thermal resistance (R_θJA) of 371.0°C/W and junction-to-board resistance (R_θJB) of 258.6°C/W, per TI's latest revision. These values reflect typical PCB conditions with 1-inch² 1-oz copper pad. For continuous 32mA sink operation at 125°C ambient, derating calculations confirm safe operation without forced cooling, provided adequate copper pour and minimal adjacent heat sources are maintained.