Texas Instruments SN74LVC1G07YZAR

Overview

SN74LVC1G07YZAR from Texas Instruments is a single non-inverting buffer/driver with open-drain output, designed for 1.65-V to 5.5-V V_CC operation. It delivers 4.2 ns max propagation delay at 3.3 V, ±24-mA sink drive capability, and supports partial-power-down via I_off logic-enabling use in level-shifting and wired-AND bus interfaces in portable I²C systems.

For engineers reviewing the SN74LVC1G07YZAR datasheet, SN74LVC1G07YZAR pinout, SN74LVC1G07YZAR application, or SN74LVC1G07YZAR equivalent, key selection criteria include open-drain compatibility with 5.5-V tolerant inputs, ultra-low 10-µA max ICC, NanoFree™ WCSP package footprint (0.8 × 0.8 mm), and JESD 78 Class II latch-up immunity.

Technical Context

This device implements a single-channel CMOS buffer with non-inverting logic and an open-drain output stage, requiring an external pull-up resistor for high-level assertion. Its I_off circuitry actively disables outputs during power-down, blocking current backflow when V_CC = 0 V.

The SN74LVC1G07YZAR operates across 1.65–5.5 V supply range with input voltage tolerance up to 5.5 V independent of V_CC, enabling bidirectional level translation between mixed-voltage domains such as 1.8-V logic driving a 5-V bus.

Key Specifications

Pinout & Package

NanoFree™ WCSP (DSBGA) package: 0.8 mm × 0.8 mm, 5-bump bottom-side layout with Pb-free construction (YZA/YZP bump variant), no wire bonds, die-as-package construction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar open-drain buffer applications.

Compared with SN74LVC1G07DBVR and NC7SZ07P5X, the SN74LVC1G07YZAR offers the smallest footprint (0.8 × 0.8 mm), lowest thermal resistance among WCSP variants (132°C/W), and Pb-free NanoFree™ construction-making it optimal for space- and reliability-critical portable electronics where rework is impractical.

Availability

SN74LVC1G07YZAR is available at Aetrix Electronics and suitable for I²C bus translation, GPIO expansion, hot-swap detection, and reset signal conditioning requiring stable component supply and long-term lifecycle support.

Supply support for SN74LVC1G07YZAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets.

The SN74LVC1G07YZAR belongs to TI's LVC logic family-designed specifically for low-voltage, high-speed, mixed-voltage interface applications with robust ESD and latch-up performance.

FAQ

What is the maximum sink current specification for SN74LVC1G07YZAR at 3.3 V?

The SN74LVC1G07YZAR provides a guaranteed minimum sink current (I_OL) of 24 mA at V_CC = 3.3 V, with VOL ≤ 0.55 V. This rating ensures reliable driving of standard TTL loads or multiple CMOS inputs under worst-case conditions across –40°C to 85°C ambient temperature.

Does SN74LVC1G07YZAR support level shifting between 1.8-V and 5-V logic domains?

Yes, the SN74LVC1G07YZAR supports bidirectional level shifting: its inputs tolerate up to 5.5 V regardless of V_CC, and its open-drain output can be pulled up to any voltage ≤5.5 V. When V_CC = 1.8 V and the output is pulled to 5 V, the device correctly buffers the 1.8-V input signal to the 5-V domain.

Is SN74LVC1G07YZAR pin-compatible with other packages in the SN74LVC1G07 family?

No, SN74LVC1G07YZAR uses a 5-bump NanoFree™ WCSP (YZA/YZP) bottom-terminal layout, which is not mechanically or electrically pin-compatible with SOT-23 (DBV) or SC-70 (DCK) variants. Pin 1 identification differs (• = Pb-free bump), and terminal mapping (A/GND/NC/V_CC/Y) does not align with top-side-marked packages.

How does the I_off feature function in SN74LVC1G07YZAR during system power-down?

The I_off circuitry in SN74LVC1G07YZAR disables both input and output paths when V_CC = 0 V, limiting leakage current to ±10 µA. This prevents back-current flow from live buses into the unpowered device-critical for maintaining signal integrity and avoiding damage in multi-rail systems where subsystems power up/down asynchronously.

What is the thermal performance of SN74LVC1G07YZAR in its NanoFree™ WCSP package?

The SN74LVC1G07YZAR in NanoFree™ WCSP (YZA/YZP) has a junction-to-ambient thermal resistance (θ_JA) of 132°C/W under JEDEC-standard PCB conditions. This is significantly lower than SOT-23 (206°C/W) and SC-70 (252°C/W) variants, enabling higher sustained drive current in thermally constrained layouts without derating.