Texas Instruments SN74LVC1G07YZPR
- Part No.:
- SN74LVC1G07YZPR
- Manufacturer:
- Texas Instruments
- Package:
- 5-XFBGA, DSBGA
- Datasheet:
-
SN74LVC1G07YZPR.pdf
- Description:
- IC BUF NON-INVERT 5.5V 5DSBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74LVC1G07YZPR from Texas Instruments is a single non-inverting buffer/driver with open-drain output, designed for 1.65V–5.5V VCC operation. It delivers ±24mA output drive at 3.3V, supports 5.5V-tolerant inputs/outputs, and achieves 4.2ns max propagation delay at 3.3V - enabling wired-OR logic, level translation, and LED driving in space-constrained consumer electronics.
For engineers reviewing the SN74LVC1G07YZPR datasheet, SN74LVC1G07YZPR pinout, SN74LVC1G07YZPR application, or SN74LVC1G07YZPR equivalent, key selection criteria include open-drain sink capability (32mA max), Ioff support for live insertion, ultra-small DSBGA package (1.75mm × 1.25mm), and −40°C to +85°C operating range - critical for portable media, SSDs, and embedded PC interfaces.
Technical Context
The SN74LVC1G07YZPR implements a single CMOS buffer with true open-drain output architecture, allowing direct connection to pull-up networks for active-low wired-OR or active-high wired-AND logic functions. Its Ioff circuitry disables outputs when VCC = 0V, preventing back-drive current and supporting partial-power-down systems.
Input voltage tolerance up to 5.5V enables bidirectional level translation between disparate supply domains (e.g., 1.8V logic driving 5V bus). The device operates across 1.65V–5.5V VCC, with guaranteed switching performance down to −40°C and up to +85°C - validated per JESD78 Class II latch-up (>100mA) and JESD22 ESD standards (2000V HBM, 1000V CDM).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65V to 5.5V - supports mixed-voltage system interfacing and battery-powered operation down to 1.65V. |
| Max tpd | 4.2ns at 3.3V - enables reliable signal buffering up to ~100MHz clock/data rates in high-speed digital paths. |
| IOL Max | 32mA at 4.5V - sufficient to directly drive LEDs, relays, or multiple CMOS inputs without external amplification. |
| Ioff | ±10µA max - ensures safe hot-plug operation and prevents back-current flow during power sequencing or partial shutdown. |
| Input Voltage Tolerance | Up to 5.5V - allows interfacing with higher-voltage peripherals while powered from lower VCC (e.g., 1.8V/2.5V/3.3V). |
| ESD Rating (HBM) | 2000V - meets industrial-grade robustness requirements for handling and board-level integration. |
| Operating Temperature | −40°C to +85°C - qualified for commercial and extended-temperature embedded applications including SSDs and tablets. |
Pinout & Package
SN74LVC1G07YZPR uses a 5-pin DSBGA (YZP) package with 1.75mm × 1.25mm body size and 0.4mm pitch. Pin 1 (A) is input, Pin 2 (GND) is ground, Pin 3 (DNU) is do-not-use, Pin 4 (Y) is open-drain output, and Pin 5 (VCC) is power supply.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A | Input | CMOS-compatible digital input accepting 0–5.5V; no internal pull-up/down; must be driven or tied to defined logic level. |
| GND | Ground Reference | Primary return path for all internal currents; requires low-inductance connection to system ground plane. |
| DNU | No Internal Connection | Unbonded pad; must remain unconnected on PCB; no routing or solder mask opening required. |
| Y | Open-Drain Output | Sinks current only; requires external pull-up resistor to define high state; supports wired-OR logic and level translation. |
| VCC | Power Supply | Supplies core logic and output driver; bypass capacitor (0.1µF) required adjacent to pin for noise suppression. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-small DSBGA package | 1.75mm × 1.25mm footprint with 0.4mm pitch - reduces PCB area by >70% vs. SOT-23, ideal for portable media players and SSD modules. |
| 5.5V-tolerant I/O | Enables direct interface with legacy 5V peripherals while operating from modern low-voltage rails (1.65V–3.3V), eliminating level-shifters. |
| Ioff partial-power-down | Prevents damaging back-current flow when VCC is off - essential for hot-swap, modular designs, and multi-rail power sequencing. |
| 32mA sink capability | Drives standard LEDs, optocouplers, or multiple 74LVC inputs without external transistors - simplifies BOM and layout. |
| Wired-OR logic support | Multiple Y outputs can share one pull-up resistor to implement active-low arbitration, interrupt combining, or bus signaling. |
Applications
| LED Driver Interface | SSD Power Sequencing Control |
|---|---|
|
Use Scenario: Driving status LEDs in portable media players and digital picture frames where board space and power efficiency are critical. IC Role / Device Role: Open-drain buffer sinking current from LED anode connected to VCC or higher rail via pull-up. Use Value: Eliminates need for discrete transistor; 32mA sink supports bright LEDs; 1.75mm × 1.25mm DSBGA minimizes footprint. |
Use Scenario: Controlling enable signals for voltage regulators in enterprise SSDs requiring precise power-up sequencing. IC Role / Device Role: Level-translating and combining multiple control signals into a single wired-OR reset/interrupt line. Use Value: 5.5V-tolerant inputs accept upstream 3.3V/5V logic; Ioff prevents backfeed during regulator power-down phases. |
| Tablet System Bus Arbitration | Embedded PC Interrupt Aggregation |
|
Use Scenario: Implementing shared interrupt lines across multiple low-power peripherals in enterprise tablets operating at 1.8V/3.3V. IC Role / Device Role: Wired-OR gate aggregating interrupt outputs from sensors, PMICs, and USB controllers. Use Value: Open-drain output allows seamless combination of multiple sources; 4.2ns tpd ensures timely interrupt response. |
Use Scenario: Consolidating fault signals from thermal monitors, fan controllers, and memory modules in fanless embedded PCs. IC Role / Device Role: Non-inverting buffer isolating and strengthening interrupt signals before delivery to host processor GPIO. Use Value: 24mA drive strength ensures clean signal integrity over longer traces; −40°C to +85°C rating matches industrial thermal envelope. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar open-drain buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC1G07DBVR | Same logic function and electrical specs, but in 5-pin SOT-23 (2.9mm × 1.6mm); higher thermal resistance (RθJA = 357°C/W vs. 130°C/W for YZP). | Preferred for prototyping or manual assembly due to larger pitch (0.95mm) and reflow-friendly leaded package. | Select when board space is less constrained and hand-soldering or test fixture compatibility is prioritized over miniaturization. |
| SN74LVC1G07DPWR | Identical functionality in 5-pin X2SON (0.8mm × 0.8mm); same 0.5mm pitch as YZP but smaller footprint (0.64mm² vs. 2.19mm²) and higher max junction temp (125°C). | Better suited for high-density, thermally demanding applications like network projectors or DLP front-end systems. | Choose when maximum miniaturization and extended temperature operation (−40°C to 125°C) are required, and DSBGA assembly capability exists. |
Compared with SN74LVC1G07DBVR and SN74LVC1G07DPWR, the SN74LVC1G07YZPR offers the best balance of ultra-compact size (1.75mm × 1.25mm), commercial-temperature qualification (−40°C to +85°C), and proven DSBGA manufacturability - making it optimal for cost-sensitive, space-limited consumer electronics where full 125°C operation is unnecessary.
Availability
SN74LVC1G07YZPR is available at Aetrix Electronics and suitable for portable media players, solid-state drives (SSD), and embedded PCs requiring stable component supply, consistent DSBGA packaging, and guaranteed −40°C to +85°C operation.
Supply support for SN74LVC1G07YZPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in logic IC design and high-volume manufacturing.
The SN74LVC1G07YZPR belongs to TI's LVC (Low-Voltage CMOS) logic family, engineered for low-power, high-speed interfacing in battery-operated and space-constrained systems - particularly targeting consumer, computing, and storage applications.
FAQ
What is the maximum sink current specification for SN74LVC1G07YZPR?
The SN74LVC1G07YZPR supports a maximum sink current (IOL) of 32mA at VCC = 4.5V, as specified in the Electrical Characteristics table. This value is tested and guaranteed across the full operating temperature range (−40°C to +85°C) and enables direct driving of LEDs, optocouplers, or multiple CMOS loads without external amplification. The SN74LVC1G07YZPR maintains this capability while consuming only 10µA typical quiescent current.
Does SN74LVC1G07YZPR support level translation between different voltage domains?
Yes, the SN74LVC1G07YZPR supports bidirectional level translation due to its 5.5V-tolerant inputs and open-drain output. When powered from a lower VCC (e.g., 1.8V or 2.5V), it accepts input signals up to 5.5V and drives a pull-up to any higher voltage (e.g., 3.3V or 5V), enabling seamless interfacing between mixed-supply subsystems. This behavior is explicitly confirmed in Section 7.3 Feature Description of the datasheet.
What is the operating temperature range for SN74LVC1G07YZPR?
The SN74LVC1G07YZPR is rated for operation from −40°C to +85°C, as stated in the Recommended Operating Conditions table and Package Option Addendum. This range applies specifically to the YZP (DSBGA) package variant and differs from other variants like DBV or DPW, which support up to +125°C. The SN74LVC1G07YZPR's thermal metrics (e.g., RθJA = 130°C/W) are optimized for this commercial-temperature envelope.
Can SN74LVC1G07YZPR be used in wired-OR configurations?
Yes, the SN74LVC1G07YZPR is explicitly designed for wired-OR logic implementation. Its open-drain output allows multiple Y pins to share a single pull-up resistor, creating an active-low OR function. This is documented in the Description section and Figure 8-2 (Typical Application), and is enabled by the device's ability to sink up to 32mA while maintaining VOL ≤ 0.55V under load - ensuring clean logic thresholds in multi-source bus configurations.
What does the "DNU" pin on SN74LVC1G07YZPR signify?
The "DNU" (Do Not Use) pin on SN74LVC1G07YZPR is Pin 3 - an unconnected, unbonded pad with no internal circuit connection. It must remain electrically floating and unattached on the PCB; no trace, solder mask opening, or thermal relief should be applied. This is confirmed in the Pin Functions table and mechanical drawings for the YZP package, distinguishing it from functional pins like A, Y, GND, and VCC.
SN74LVC1G07YZPR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 5-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- Open Drain
- Current - Output High, Low:
- -, 32mA
- Voltage - Supply:
- 1.65V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 5-DSBGA (1.4x0.9)
SN74LVC1G07YZPR FAQ
1.How can I place an order for SN74LVC1G07YZPR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74LVC1G07YZPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74LVC1G07YZPR reliable?
The price and inventory of SN74LVC1G07YZPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVC1G07YZPR is usually 5 days.
3.What payment methods are accepted for SN74LVC1G07YZPR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74LVC1G07YZPR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74LVC1G07YZPR?
SN74LVC1G07YZPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74LVC1G07YZPR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74LVC1G07YZPR?
For technical support, including SN74LVC1G07YZPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC1G07YZPR requirements.
6.How does Aetrix verify that SN74LVC1G07YZPR is sourced from the original manufacturer or authorized distributors?
All SN74LVC1G07YZPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC1G07YZPR meets industry standards.
7.What is the process for return or replacement of SN74LVC1G07YZPR?
All SN74LVC1G07YZPR units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC1G07YZPR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC1G07YZPR part is unused and in its original packaging.
Return procedure for SN74LVC1G07YZPR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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