Texas Instruments SN74LVC1G07YZVR

Overview

SN74LVC1G07YZVR from Texas Instruments is a single non-inverting buffer/driver with open-drain output, designed for 1.65V to 5.5V V_CC operation. It delivers 32mA sink current at 4.5V, supports 5.5V-tolerant inputs/outputs, and features I_off for live insertion and partial-power-down protection. It enables wired-OR logic in compact consumer audio and embedded control interfaces.

For engineers reviewing the SN74LVC1G07YZVR datasheet, SN74LVC1G07YZVR pinout, SN74LVC1G07YZVR application, or SN74LVC1G07YZVR equivalent, key selection criteria include open-drain drive strength (32mA), 5.5V input tolerance, ultra-small DSBGA-4 package (0.88mm × 0.88mm body), I_off support, and −40°C to +85°C operating range.

Technical Context

The SN74LVC1G07YZVR implements a single CMOS buffer stage with an open-drain NMOS output transistor-no internal pull-up-requiring external termination for logic high. Its I_off circuitry actively isolates inputs and outputs when V_CC = 0 V, preventing back-drive current and enabling hot-swap capability.

It operates across 1.65V–5.5V supply, accepts input voltages up to 5.5V regardless of V_CC, and achieves 4.2ns max propagation delay at 3.3V. The YZV package is a 4-pin DSBGA with 0.4mm pitch, where pins A1, A2, B1, B2 map to Input (A), V_CC, Output (Y), and GND respectively.

Key Specifications

Pinout & Package

SN74LVC1G07YZVR uses a 4-ball DSBGA (YZV) package with 0.4mm pitch and 0.88mm × 0.88mm body size. No internal connections are present beyond the four functional terminals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar open-drain buffer applications.

Compared with SN74LVC1G07DBVR and SN74LVC1G07DPWR, the SN74LVC1G07YZVR provides the smallest possible PCB footprint (0.77mm²) and lowest profile for ultra-thin portable devices, while trading off one pin and 40°C upper temperature margin for space savings.

Availability

SN74LVC1G07YZVR is available at Aetrix Electronics and suitable for portable media players, enterprise SSDs, and pro-audio mixers requiring stable component supply, long-term lifecycle support, and RoHS-compliant DSBGA packaging.

Supply support for SN74LVC1G07YZVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions, with over 90 years of innovation in precision analog, power management, and logic ICs.

The SN74LVC1G07YZVR belongs to TI's LVC low-voltage CMOS logic family, engineered for high-speed, low-power, mixed-voltage interface bridging in space- and power-constrained portable and industrial electronics.

FAQ

What is the maximum sink current capability of the SN74LVC1G07YZVR?

The SN74LVC1G07YZVR supports up to 32mA sink current at V_CC = 4.5V, as specified in the Absolute Maximum Ratings and Electrical Characteristics tables. This value is validated across the full −40°C to +85°C operating range and enables direct LED driving or termination of multiple open-drain loads without external amplification. The SN74LVC1G07YZVR maintains this performance while consuming only 10µA typical quiescent current.

Does the SN74LVC1G07YZVR support level translation between different supply voltages?

Yes, the SN74LVC1G07YZVR supports bidirectional level translation: its inputs tolerate up to 5.5V regardless of V_CC, and its open-drain output can be pulled up to any voltage ≤5.5V. For example, with V_CC = 1.8V, it accepts 3.3V or 5V inputs and drives a 3.3V bus via external pull-up. This eliminates external translators in mixed-supply systems. The SN74LVC1G07YZVR achieves this without compromising propagation delay (4.2ns max at 3.3V).

What is the purpose of the I_off feature in the SN74LVC1G07YZVR?

The I_off feature in the SN74LVC1G07YZVR disables all input and output circuitry when V_CC = 0V, limiting leakage current to ±10µA. This prevents damaging back-drive current during hot-swap events or partial power-down states-critical in modular systems like audio dock interfaces or SSD add-in cards. The SN74LVC1G07YZVR leverages I_off to meet JESD78 Class II latch-up immunity (>100mA) and enable safe live insertion without system reset.

Which package type does the SN74LVC1G07YZVR use, and what are its dimensions?

The SN74LVC1G07YZVR uses a 4-ball DSBGA (YZV) package with 0.4mm pitch and a nominal body size of 0.88mm × 0.88mm. Unlike 5-pin variants (e.g., DPW or DSBGA-5), the YZV variant omits the NC pin to minimize footprint-achieving 0.77mm² total area. Its solder-ball layout (A1=A, A2=V_CC, B1=GND, B2=Y) is optimized for automated assembly and high-density routing in thin-profile consumer electronics.

Can the SN74LVC1G07YZVR be used in wired-OR logic configurations?

Yes, the SN74LVC1G07YZVR is explicitly designed for wired-OR (active-low) or wired-AND (active-high) bus implementations due to its open-drain output. Multiple SN74LVC1G07YZVR outputs can share a common pull-up resistor to implement interrupt aggregation or bus arbitration without contention. The device's 32mA sink capability ensures robust low-state drive even with multiple parallel outputs, and its 5.5V-tolerant inputs allow heterogeneous voltage domains on the same bus.