Texas Instruments SN74LVC1G125YZAR
- Part No.:
- SN74LVC1G125YZAR
- Manufacturer:
- Texas Instruments
- Package:
- 5-XFBGA, DSBGA
- Datasheet:
-
SN74LVC1G125YZAR.pdf
- Description:
- IC BUFF NON-INVERT 5.5V 5DSBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74LVC1G125 from Texas Instruments is a single 3-state bus buffer gate used for signal isolation and controlled data routing on low-voltage digital buses. It features true non-inverting logic, 3.3V/5V supply compatibility (1.65–5.5V), ±24mA output drive at 3.3V, 3.7ns max propagation delay, and Ioff support for live insertion in partial-power-down systems.
For engineers reviewing the SN74LVC1G125 datasheet, SN74LVC1G125 pinout, SN74LVC1G125 application, or SN74LVC1G125 equivalent, key selection considerations include its ultra-small DPW (X2SON-5) package (0.8mm × 0.8mm), over-voltage tolerant inputs (up to 5.5V), down-translation capability, and robust ESD ratings (2000V HBM).
Technical Context
The SN74LVC1G125 implements a CMOS-based non-inverting buffer with active-low 3-state enable control (OE). Its output enters high-impedance when OE is high, and passes A→Y when OE is low - enabling bidirectional bus sharing and load isolation. The device uses standard CMOS inputs with input transition rate limits (5 ns/V at 5V) and includes clamp diodes only on negative side.
It supports mixed-voltage interfacing via over-voltage tolerant inputs (VI up to 5.5V independent of VCC) and down-translation: a 5V input signal can safely drive the device while operating from a 3.3V or 1.8V supply, with output levels referenced to VCC. Ioff functionality ensures zero current flow at outputs during VCC = 0V, preventing back-drive in powered-down subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65V to 5.5V - enables operation across 1.8V, 2.5V, 3.3V, and 5V logic domains |
| Max Propagation Delay | 3.7ns at 3.3V, CL = 15pF - supports >200MHz data rates in short-bus applications |
| Output Drive | ±24mA at 3.3V - sufficient to drive multiple LVC loads or moderate capacitive loads without external buffering |
| Input Voltage Tolerance | Up to 5.5V regardless of VCC - allows direct interfacing with 5V TTL or legacy peripherals |
| Ioff Current | ±10μA max - prevents current leakage and back-drive during system power sequencing |
| ESD Rating (HBM) | 2000V - meets industrial-grade robustness requirements without external protection |
| Operating Temperature | –40°C to +125°C - qualified for automotive under-hood and industrial control environments |
Pinout & Package
SN74LVC1G125YZAR is packaged in the ultra-compact DPW (X2SON-5) package: 0.8mm × 0.8mm body, 0.5mm pitch, no exposed pad. This 5-pin monolithic silicon die-level package enables ultra-dense PCB layouts in space-constrained applications such as portable SSDs and compact video transcoders.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (OE) | Active-low output enable | Drives Y into high-impedance when high; ties to VCC via pullup resistor for power-up safety |
| 2 (A) | Data input | CMOS-compatible input accepting up to 5.5V; supports down-translation from higher voltage domains |
| 3 (GND) | Ground reference | Return path for all internal currents; must be low-impedance to maintain noise margin and switching integrity |
| 4 (Y) | 3-state buffered output | Non-inverting output with balanced sourcing/sinking; floats when OE = high |
| 5 (VCC) | Power supply | Supplies core logic and output drivers; requires local 0.1μF bypass capacitor per TI layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-small X2SON-5 package | 0.64mm² footprint - reduces board area by >50% vs. SOT-23, critical for SSD and mobile video modules |
| Over-voltage tolerant inputs | Accepts 0–5.5V inputs irrespective of VCC - eliminates level shifters when interfacing 5V sensors to 3.3V SoCs |
| Ioff partial-power-down | Blocks current flow at all I/Os when VCC = 0V - enables hot-plug capability in modular cable modems and comms systems |
| Low ICC and IOZ | 10μA max ICC, 10μA max IOZ - minimizes quiescent power in always-on subsystems like video broadcast timing controllers |
| Clamp-diode protected I/O | Negative-only clamping per JESD78 Class II - withstands transient coupling without external TVS in benign EMI environments |
Applications
| Cable Modem Termination System | SSD Internal Bus Interface |
|---|---|
Use Scenario: Isolating DOCSIS PHY layer signals from upstream/downstream MAC processors during dynamic channel reconfiguration. IC Role / Device Role / Timing Role: 3-state bus buffer enabling time-multiplexed access to shared memory and register banks between dual-core processors. Use Value: Prevents bus contention during firmware updates; Ioff ensures no back-drive when one processor powers down mid-operation. |
Use Scenario: Controlling NAND flash command/address/data lines in M.2 NVMe SSDs with multi-die stacking. IC Role / Device Role / Timing Role: Signal isolator for shared command bus between controller and multiple NAND packages, synchronized to PCIe Gen4 timing windows. Use Value: Ultra-small DPW package saves <0.7mm² per channel; 3.7ns tpd meets tight setup/hold margins for 1200MT/s NAND interfaces. |
| Video IP-Based Transcoder | Military Radar Signal Processing |
Use Scenario: Routing uncompressed video streams between FPGA-based encoder/decoder blocks and DDR4 frame buffers in multi-format broadcast infrastructure. IC Role / Device Role / Timing Role: Low-skew, non-inverting buffer managing parallel 24-bit pixel buses with precise OE-controlled enable timing. Use Value: Down-translation allows 5V camera sensor interface to 3.3V FPGA I/O banks; ±24mA drive sustains signal integrity across 8cm PCB traces. |
Use Scenario: Enabling/disabling analog-to-digital converter (ADC) data lanes in phased-array radar front-end modules during beamforming state transitions. IC Role / Device Role / Timing Role: High-reliability 3-state gate isolating ADC output buses from DSP clusters during calibration or standby modes. Use Value: –40°C to +125°C rating ensures operation in sealed radar enclosures; 2000V HBM withstands EMI in high-power RF environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 74LVC1G125GW,125 (Nexperia) | Same logic function and pinout; SC-70-5 package (2.0mm × 2.1mm), 4.5ns max tpd at 3.3V | Larger footprint; slightly slower propagation; identical Ioff and voltage tolerance specs | Preferred where SC-70 handling or legacy footprint compatibility is required; not suitable for <1mm² area budgets |
| NC7SZ125P5X (ON Semiconductor) | Same function; SOT-353 (SC-70-5); 3.9ns max tpd at 3.3V; supports 1.65–5.5V VCC | Identical package size but lower drive (±24mA same); 1000V HBM (vs. 2000V) | Valid alternative where ESD immunity >2000V is not mandated; verify layout clearance for same thermal performance |
Compared with SN74LVC1G125YZAR, the Nexperia 74LVC1G125GW offers identical functionality in a larger SC-70 package, while the ON Semi NC7SZ125P5X matches footprint and speed but provides lower ESD robustness - making SN74LVC1G125YZAR optimal for ultra-compact, high-reliability designs requiring maximum HBM immunity and minimal board area.
Availability
SN74LVC1G125YZAR is available at Aetrix Electronics and suitable for cable modem termination systems, SSD internal bus interfaces, video IP-based transcoders, military radar signal processing, and high-speed data acquisition requiring stable component supply across extended temperature ranges.
Supply support for SN74LVC1G125YZAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of experience in high-reliability interface IC design.
The SN74LVC1G125 belongs to TI's LVC (Low-Voltage CMOS) logic family, engineered for low-power, mixed-voltage interoperability in space- and power-constrained digital systems - particularly targeting communications infrastructure, storage, and industrial control.
FAQ
What is the recommended pullup resistor value for OE on SN74LVC1G125YZAR?
The OE pin should be tied to VCC through a pullup resistor to ensure high-impedance state during power-up. TI specifies the minimum resistor value based on the driver's current-sinking capability. For SN74LVC1G125YZAR, a 10kΩ resistor is recommended - it guarantees reliable disable behavior while minimizing static current draw and accommodating typical MCU GPIO sink strength (≥4mA).
Can SN74LVC1G125YZAR interface a 5V sensor output with a 1.8V microcontroller input?
Yes - SN74LVC1G125YZAR accepts input voltages up to 5.5V regardless of VCC, enabling direct connection of 5V sensor outputs. When powered from 1.8V, it down-translates the signal and outputs logic levels compatible with 1.8V CMOS inputs (VOH ≥ 1.7V, VOL ≤ 0.1V per datasheet), making SN74LVC1G125YZAR ideal for bridging legacy and low-voltage domains without external level shifters.
Does SN74LVC1G125YZAR support hot-swap or live-insertion applications?
Yes - SN74LVC1G125YZAR includes Ioff circuitry that disables all outputs when VCC = 0V, preventing current backflow and latch-up during partial power-down. This feature, combined with ±10μA max Ioff current, makes SN74LVC1G125YZAR suitable for hot-plug modules in cable modems and modular video infrastructure where subsystems may power up/down independently.
What is the maximum capacitive load SN74LVC1G125YZAR can drive while maintaining 3.7ns propagation delay?
SN74LVC1G125YZAR maintains its 3.7ns max tpd specification at CL = 15pF (per Section 5.6). At higher loads - up to 50pF - it still meets full datasheet performance (Section 8.2.1.1), though propagation delay increases (e.g., 4.5ns at 3.3V, CL = 30pF). For loads >50pF, TI recommends adding a series damping resistor to control edge rate and prevent ringing - a design consideration explicitly validated for SN74LVC1G125YZAR.
Is SN74LVC1G125YZAR pin-compatible with other 5-pin X2SON logic devices?
SN74LVC1G125YZAR uses the standard DPW (X2SON-5) footprint defined by JEDEC MO-302, with 0.5mm pitch and 0.8mm × 0.8mm body. It shares mechanical compatibility with other TI X2SON-5 logic devices (e.g., SN74LVC1G00YZPR, SN74LVC1G08YZPR), allowing layout reuse across buffer, gate, and inverter functions - though electrical functionality and pin assignments differ and must be verified per device.
SN74LVC1G125YZAR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 5-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 32mA
- Voltage - Supply:
- 1.65V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 5-DSBGA (1.4x0.9)
SN74LVC1G125YZAR FAQ
1.How can I place an order for SN74LVC1G125YZAR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74LVC1G125YZAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74LVC1G125YZAR reliable?
The price and inventory of SN74LVC1G125YZAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVC1G125YZAR is usually 5 days.
3.What payment methods are accepted for SN74LVC1G125YZAR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74LVC1G125YZAR transactions.
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4.How is shipping managed for SN74LVC1G125YZAR?
SN74LVC1G125YZAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74LVC1G125YZAR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74LVC1G125YZAR?
For technical support, including SN74LVC1G125YZAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC1G125YZAR requirements.
6.How does Aetrix verify that SN74LVC1G125YZAR is sourced from the original manufacturer or authorized distributors?
All SN74LVC1G125YZAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC1G125YZAR meets industry standards.
7.What is the process for return or replacement of SN74LVC1G125YZAR?
All SN74LVC1G125YZAR units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC1G125YZAR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC1G125YZAR part is unused and in its original packaging.
Return procedure for SN74LVC1G125YZAR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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